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1. 再颁专利

USRE40947E1 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole 失效
公开(公告)号：USRE40947E1
公开(公告)日：2009-10-27
申请号：US10829479
申请日：1990-10-12
申请人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
发明人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
IPC分类号： B32B3/00
CPC分类号： B32B3/00 , H05K3/0094 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/4069 , H05K3/4602 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0257 , H05K2201/0347 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , Y10S428/901 , Y10T428/24917
摘要： A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

2. 发明授权

US06376049B1 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole 有权
标题翻译：多层印刷线路板及其制造方法，以及用于填充通孔的树脂组合物
公开(公告)号：US06376049B1
公开(公告)日：2002-04-23
申请号：US09341689
申请日：1999-07-23
申请人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
发明人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
IPC分类号： B32B300
CPC分类号： B32B3/00 , H05K3/0094 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/4069 , H05K3/4602 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0257 , H05K2201/0347 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , Y10S428/901 , Y10T428/24917
摘要： A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.
摘要翻译：多层印刷布线板由设置有通孔的基板和通过插入层间绝缘树脂层而形成在基板上的布线板，所述通孔具有粗糙的内表面并填充有填料，通孔中的填充物的暴露部分被覆盖有通孔覆盖导体层，并且形成在其上方的通孔连接到通孔覆盖导体层。在通孔和填料之间不剥离，该布线板在通孔和内层电路之间具有令人满意的连接可靠性，并提供高密度布线。

3. 发明授权

US06376052B1 Multilayer printed wiring board and its production process, resin composition for filling through-hole 有权
标题翻译：多层印刷线路板及其生产工艺，填充通孔的树脂组合物
公开(公告)号：US06376052B1
公开(公告)日：2002-04-23
申请号：US09556860
申请日：2000-04-21
申请人： Motoo Asai , Ken-ichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
发明人： Motoo Asai , Ken-ichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
IPC分类号： B32B300
CPC分类号： B32B3/00 , H05K3/0094 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/4069 , H05K3/4602 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0257 , H05K2201/0347 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , Y10S428/901 , Y10T428/24917
摘要： A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.
摘要翻译：多层印刷布线板由设置有通孔的基板和通过插入层间绝缘树脂层而形成在基板上的布线板，所述通孔具有粗糙的内表面并填充有填料，通孔中的填充物的暴露部分被覆盖有通孔覆盖导体层，并且形成在其上方的通孔连接到通孔覆盖导体层。在通孔和填充物，该布线板在通孔和内层电路之间具有令人满意的连接可靠性，并且提供高密度布线。

4. 发明授权

US06762921B1 Multilayer printed-circuit board and method of manufacture 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US06762921B1
公开(公告)日：2004-07-13
申请号：US09926476
申请日：2001-11-09
申请人： Motoo Asai , Kouta Noda , Takashi Kariya
发明人： Motoo Asai , Kouta Noda , Takashi Kariya
IPC分类号： H02H322
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/421 , H05K2201/0195 , H05K2201/09509 , Y10T428/24273
摘要： This invention is to propose a technique of producing a printed wiring board having an excellent adhesion property between an electroless plated film and an electrolytic plated film constituting a conductor circuit through a semi-additive process without causing the peeling of a plating resist and is a printed wiring board comprising conductor circuits formed on a roughened surface of an insulating layer, in which the conductor circuit is constituted with an electroless plated film at the side of the insulating layer and an electrolytic plated film at the opposite side and the electroless plated film located at the side of the insulating layer is formed so as to follow to the roughened surface of the insulating layer. This printed wiring board is produced by a semi-additive method wherein the electroless plated film is formed on the roughened surface of the insulating layer so as to follow to the roughened surface of the insulating layer.
摘要翻译：本发明提出一种制造印刷电路板的技术，该印刷电路板在不引起电镀抗蚀剂剥离的情况下，通过半添加工艺，在化学镀膜和构成导体电路的电解电镀膜之间具有优异的粘合性，并且是印刷布线板包括形成在绝缘层的粗糙表面上的导体电路，其中导体电路由绝缘层侧面的无电解电镀膜和位于绝缘层侧面的电镀电镀膜和位于绝缘层的一侧形成为与绝缘层的粗糙化表面相邻。该印刷电路板是通过半附加法制造的，其中无电镀膜形成在绝缘层的粗糙化表面上，以便遵循绝缘层的粗糙化表面。

5. 发明申请

US20080023815A1 INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：印刷电路板用印刷电介质层，印刷线路板及其制造方法
公开(公告)号：US20080023815A1
公开(公告)日：2008-01-31
申请号：US11858942
申请日：2007-09-21
申请人： Motoo ASAI , Kouta Noda , Yasushi Inagaki
发明人： Motoo ASAI , Kouta Noda , Yasushi Inagaki
IPC分类号： H01L23/24
CPC分类号： H01L23/145 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H01L2924/3011 , H05K3/005 , H05K3/045 , H05K3/107 , H05K3/381 , H05K3/4602 , H05K3/465 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2201/0245 , H05K2201/09036 , H05K2203/0108 , H05K2203/1152 , H05K2203/1189 , Y10T428/25 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A printed wiring board including a substrate, conductor circuits and interlayer dielectric layers stacked alternately on the substrate, each of the interlayer dielectric layers including a curable resin having flaky particles dispersed therein, and viaholes formed in the interlayer dielectric layers and electrically connecting the conductor circuits at different levels.
摘要翻译：一种印刷电路板，包括基板，导体电路和层间电介质层，层叠电介质层交替地堆叠在基板上，每个层间介电层包括其中分散有片状颗粒的固化树脂，以及形成在层间电介质层中的通孔，并将导体电路在不同层次上

6. 发明申请

US20070013049A1 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same 有权
标题翻译：用于印刷线路板的层间绝缘层，印刷线路板及其制造方法
公开(公告)号：US20070013049A1
公开(公告)日：2007-01-18
申请号：US10557206
申请日：2004-09-29
申请人： Motoo Asai , Kouta Noda , Yasushi Inagaki
发明人： Motoo Asai , Kouta Noda , Yasushi Inagaki
IPC分类号： H01L23/24
CPC分类号： H01L23/145 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H01L2924/3011 , H05K3/005 , H05K3/045 , H05K3/107 , H05K3/381 , H05K3/4602 , H05K3/465 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2201/0245 , H05K2201/09036 , H05K2203/0108 , H05K2203/1152 , H05K2203/1189 , Y10T428/25 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A printed wiring board is provided which includes an interlayer dielectric layer formed on a substrate from a curable resin having flaky particles dispersed therein. The printed wiring board is excellent in cooling/heating cycle resistance and packaging reliability while maintaining a satisfactory heat resistance, electrical insulation, heat liberation, connection reliability and chemical stability. Also a method of producing a printed wiring board is proposed in which an imprint method using a mold having formed thereon convexities corresponding to wiring patterns and viaholes to be formed being buried in an interlayer dielectric layer is used to form the wiring patterns and viaholes by transcribing the concavities of the mold to the interlayer dielectric layer. The imprint method permits to form the wiring patterns and viaholes but assures an easy and accurate transcription without any optical transcription or complicated etching. Thus, a multilayer printed wiring board excellent in insulation reliability and interlayer connection and having fine wiring patterns formed therein can be mass-produced extremely easily and inexpensively.
摘要翻译：提供一种印刷电路板，其包括由分散在其中的片状颗粒的可固化树脂形成在基板上的层间电介质层。印刷电路板在保持耐热性，电绝缘性，热释放性，连接可靠性和化学稳定性方面保持良好的冷/热循环阻力和包装可靠性。还提出了一种制造印刷电路板的方法，其中使用在其中形成有对应于要形成的布线图案和通孔的凸起的模具被埋在层间电介质层中的模具的压印方法用于通过转录形成布线图案和通孔模具与层间电介质层的凹部。压印方法允许形成布线图案和通孔，但确保容易且准确的转录，无需任何光学转录或复杂蚀刻。因此，绝缘可靠性和层间连接性优异，并且在其中形成的精细布线图案的多层印刷线路板可以极其容易且廉价地批量生产。

7. 发明授权

US06261671B1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board 有权
标题翻译：用于化学镀的粘合剂，用于制备用于化学镀的粘合剂的原料组合物和印刷线路板
公开(公告)号：US06261671B1
公开(公告)日：2001-07-17
申请号：US09402475
申请日：1999-10-12
申请人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
发明人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
IPC分类号： B32B300
CPC分类号： H05K3/4676 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/1844 , C23C18/24 , C23C18/405 , C23C18/50 , C23C18/54 , H05K3/4673 , H05K2201/0212 , H05K2201/0269 , H05K2203/0773 , Y10S428/901 , Y10T428/24893 , Y10T428/24917
摘要： The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.
摘要翻译：公开了用于化学镀的粘合剂，其有利于确保线间和层之间的绝缘可靠性同时保持实用的剥离强度，并且使用粘合剂的印刷电路板。粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为不超过1.5个妈妈。

8. 发明授权

US08021748B2 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same 有权
标题翻译：用于印刷线路板的层间绝缘层，印刷线路板及其制造方法
公开(公告)号：US08021748B2
公开(公告)日：2011-09-20
申请号：US10557206
申请日：2004-09-29
申请人： Motoo Asai , Kouta Noda , Yasushi Inagaki
发明人： Motoo Asai , Kouta Noda , Yasushi Inagaki
IPC分类号： B32B5/16
CPC分类号： H01L23/145 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H01L2924/3011 , H05K3/005 , H05K3/045 , H05K3/107 , H05K3/381 , H05K3/4602 , H05K3/465 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2201/0245 , H05K2201/09036 , H05K2203/0108 , H05K2203/1152 , H05K2203/1189 , Y10T428/25 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A printed wiring board is provided which includes an interlayer dielectric layer formed on a substrate from a curable resin having flaky particles dispersed therein. The printed wiring board is excellent in cooling/heating cycle resistance and packaging reliability while maintaining a satisfactory heat resistance, electrical insulation, heat liberation, connection reliability and chemical stability. Also a method of producing a printed wiring board is proposed in which an imprint method using a mold having formed thereon convexities corresponding to wiring patterns and viaholes to be formed being buried in an interlayer dielectric layer is used to form the wiring patterns and viaholes by transcribing the concavities of the mold to the interlayer dielectric layer. The imprint method permits to form the wiring patterns and viaholes but assures an easy and accurate transcription without any optical transcription or complicated etching. Thus, a multilayer printed wiring board excellent in insulation reliability and interlayer connection and having fine wiring patterns formed therein can be mass-produced extremely easily and inexpensively.
摘要翻译：提供一种印刷电路板，其包括由分散在其中的片状颗粒的可固化树脂形成在基板上的层间电介质层。印刷电路板在保持耐热性，电绝缘性，热释放性，连接可靠性和化学稳定性方面保持良好的冷/热循环阻力和包装可靠性。还提出了一种制造印刷电路板的方法，其中使用在其中形成有对应于要形成的布线图案和通孔的凸起的模具被埋在层间电介质层中的模具的压印方法用于通过转录形成布线图案和通孔模具与层间电介质层的凹部。压印方法允许形成布线图案和通孔，但确保容易且准确的转录，无需任何光学转录或复杂蚀刻。因此，绝缘可靠性和层间连接性优异，并且在其中形成的精细布线图案的多层印刷线路板可以极其容易且廉价地批量生产。

9. 发明申请

US20080014336A1 INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：印刷电路板用印刷电介质层，印刷线路板及其制造方法
公开(公告)号：US20080014336A1
公开(公告)日：2008-01-17
申请号：US11858981
申请日：2007-09-21
申请人： Motoo ASAI , Kouta Noda , Yasushi Inagaki
发明人： Motoo ASAI , Kouta Noda , Yasushi Inagaki
IPC分类号： H01C17/06
CPC分类号： H01L23/145 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H01L2924/3011 , H05K3/005 , H05K3/045 , H05K3/107 , H05K3/381 , H05K3/4602 , H05K3/465 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2201/0245 , H05K2201/09036 , H05K2203/0108 , H05K2203/1152 , H05K2203/1189 , Y10T428/25 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of forming a multilayer printed wiring board including forming a yet-to-cure interlayer dielectric layer by applying or attaching, to a dielectric substrate, an interlayer dielectric material of liquid or dry film including one or more of thermosetting resin, mixture of thermosetting and thermoplastic resins, photosensitized thermosetting resin, mixture of photosensitized thermosetting and thermoplastic resins, and photosensitive resin, softening the dielectric layer, pressing mold having convexities onto the softened dielectric layer to form concavities for conductor and concavities or through-holes for viaholes, cooling or heating the softened dielectric layer to temperature at which shapes of the concavities and/or through-holes in the dielectric layer are maintained, removing the mold from the dielectric layer, heating, or irradiating ultraviolet rays to, the dielectric layer, and curing, by heating, the dielectric layer, and forming the circuits and viaholes by forming a conductive material in the concavities and/or through-holes in the cured dielectric layer.
摘要翻译：一种形成多层印刷线路板的方法，包括通过将电介质基底施加或附着到液态或干膜的层间电介质材料中，形成不固化的层间绝缘层，所述层间绝缘材料包括一种或多种热固性树脂，热固性树脂热塑性树脂，光敏热固性树脂，光敏热固性树脂和热塑性树脂的混合物和感光树脂，软化介电层，将具有凸面的压制模具压到软化的介电层上，以形成用于导体和凹部的凹坑或用于通孔，冷却或将软化的电介质层加热至保持电介质层的凹部和/或通孔的形状的温度，从电介质层除去模具，加热或照射紫外线至电介质层，并通过加热介电层，并形成电路和通孔在固化的介电层中的凹部和/或通孔中的导电材料。

10. 发明授权

US06248428B1 Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board 有权
标题翻译：化学镀用粘合剂，化学镀用粘合剂用原料组合物及印刷线路板
公开(公告)号：US06248428B1
公开(公告)日：2001-06-19
申请号：US09402477
申请日：1999-10-12
申请人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
发明人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
IPC分类号： B32B300
CPC分类号： H05K3/4661 , H05K3/387 , H05K3/4602 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , Y10S428/901 , Y10T428/24893 , Y10T428/24917 , Y10T428/2804
摘要： Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.
摘要翻译：用于化学镀的粘合剂粘合剂确保了线之间和层之间的绝缘可靠性，同时保持实际的剥离强度，并且公开了使用该粘合剂的印刷电路板。粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为不超过2毫米，由粗颗粒和细颗粒组成。

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