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1. 发明授权

US09949376B2 Cortical implant system for brain stimulation and recording 有权
公开(公告)号：US09949376B2
公开(公告)日：2018-04-17
申请号：US14563778
申请日：2014-12-08
申请人： Second Sight Medical Products, Inc.
发明人： Robert J Greenberg , Neil H Talbot , James S Little
IPC分类号： A61N1/375 , A61N1/05 , A61N1/36 , A61N1/372 , H05K3/28 , H05K1/11 , H05K1/14 , A61B5/00 , A61B5/0478 , H05K1/18 , H01L23/055 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/32 , H05K3/36 , H05K3/40
CPC分类号： H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

2. 发明授权

US09947432B2 Electrically conductive materials formed by electrophoresis 有权
公开(公告)号：US09947432B2
公开(公告)日：2018-04-17
申请号：US14876297
申请日：2015-10-06
申请人： FLEXcon Company, Inc.
发明人： Kenneth Burnham , Richard Skov
IPC分类号： H01B1/22 , H01B1/24 , C09J9/02 , H05K1/09 , B82Y30/00
CPC分类号： H01B1/24 , B82Y30/00 , C09J9/02 , H05K1/095 , H05K2201/0245 , H05K2201/026 , H05K2201/0323 , H05K2203/105 , H05K2203/1136
摘要： A method of forming an electrically conductive composite is disclosed that includes the steps of providing a first dielectric material and a second conductive material that is substantially dispersed within the first dielectric material; and applying an electric field through at least a portion of the combined first dielectric material and second conductive material such that the second conductive material undergoes electrophoresis and forms at least one electrically conductive path through the electrically conductive composite along the direction of the applied electric field.

3. 发明申请

US20180103544A1 CONNECTING A FLEXIBLE CIRCUIT TO OTHER STRUCTURES 审中-公开
公开(公告)号：US20180103544A1
公开(公告)日：2018-04-12
申请号：US15287563
申请日：2016-10-06
申请人： Microsoft Technology Licensing, LLC
发明人： James David Holbery , Siyuan Ma , Michael David Dickey , Andrew L. Fassler
IPC分类号： H05K1/03 , C09D183/04 , C09D5/24 , C08K7/00 , C08K3/08 , H01L23/538 , G06F1/16 , H05K1/09 , H05K3/00
CPC分类号： H05K1/0393 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2201/001 , C08K2201/011 , C09D5/24 , C09D183/04 , G06F1/1669 , H01L23/5386 , H01L23/5387 , H05K1/028 , H05K1/0313 , H05K1/09 , H05K1/148 , H05K3/0014 , H05K3/285 , H05K2201/0245 , H05K2201/026 , H05K2201/0391 , H05K2203/0776
摘要： One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

4. 发明申请

US20180072897A1 CONFORMAL COATING, COMPOSITION AND METHOD FOR THE MITIGATION OF GROWTH OF METALLIC CRYSTALLINE STRUCTURES 审中-公开
公开(公告)号：US20180072897A1
公开(公告)日：2018-03-15
申请号：US15558956
申请日：2016-03-18
申请人： LOUGHBOROUGH UNIVERSITY
发明人： Mark Andrew ASHWORTH , Helen Elizabeth PEARSON , Xujin BAO , Geoffrey David WILCOX
IPC分类号： C09D7/12 , C09D5/00 , C09D175/04 , H05K3/28
CPC分类号： C09D7/70 , C08K3/346 , C08K7/00 , C08K9/02 , C08K9/04 , C08K2201/004 , C08K2201/005 , C08K2201/011 , C09D5/00 , C09D7/61 , C09D7/62 , C09D175/04 , H05K1/0373 , H05K3/28 , H05K3/285 , H05K2201/0209 , H05K2201/0245 , H05K2201/0769 , H05K2201/09872
摘要： A nanocomposite coating composition for use in the mitigation of whisker growth from a metallic surface (82) includes a polymer matrix (86) comprising a base polymer and insulating material nanoplatelets (85), for example clay nanoplatelets, within the polymer matrix (86). A conformal coating (84) for application to a metal surface (82) is formed from the coating composition. The conformal coating mitigates the spontaneous growth of whiskers (83), in particular tin whiskers, from the coated surface (82), reducing the risk of short-circuits caused by such whiskers bridging gaps within electronic devices. Methods are provided for the preparation of coating compositions and coatings.

5. 发明授权

US09833802B2 Methods and apparatus for conductive element deposition and formation 有权
公开(公告)号：US09833802B2
公开(公告)日：2017-12-05
申请号：US14736040
申请日：2015-06-10
申请人： PULSE FINLAND OY
发明人： Esa Kalistaja , Elli Galla , Dan Kuehler , Winthrop Childers
IPC分类号： H05K1/00 , B05B12/04 , H05K3/12 , B05B17/04 , B05D1/28 , H05K1/11 , H05K3/14
CPC分类号： B05B12/04 , B05B17/04 , B05D1/28 , H05K1/111 , H05K3/12 , H05K3/1241 , H05K3/125 , H05K3/14 , H05K2201/0245 , H05K2201/0391 , H05K2201/0999 , H05K2201/10098 , H05K2203/1366 , H05K2203/1476
摘要： A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets, and methods of, and apparatus for, forming the same. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a complex (3D) conductive trace is formed using two or more different print technologies via creation of different domains within the conductive trace pattern.

6. 发明授权

US09756718B2 Module board 有权
公开(公告)号：US09756718B2
公开(公告)日：2017-09-05
申请号：US14160962
申请日：2014-01-22
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuji Kataoka , Koichi Kanryo
IPC分类号： H05K1/02 , H05K3/28 , H01L23/00
CPC分类号： H05K1/0216 , H01L24/97 , H01L2224/16225 , H01L2924/15787 , H01L2924/19105 , H05K1/0218 , H05K3/284 , H05K2201/0245 , H05K2201/0323 , H05K2201/0715 , H05K2203/1316 , H01L2924/00
摘要： A module board includes a base substrate. Electronic components are mounted on a first principal surface of the base substrate. The mounted electronic components are sealed by a sealing resin containing an SiO2 filler. A top surface and side surfaces of the sealing resin are covered with a shield layer containing a carbon filler, which is flat powder, as a conductive component. A terminal electrode is formed on a second principal surface of the base substrate that is disposed opposite to the first principal surface of the base substrate.

7. 发明授权

US09718726B2 Glass ceramic substrate and portable electronic device housing using the substrate 有权
公开(公告)号：US09718726B2
公开(公告)日：2017-08-01
申请号：US14706406
申请日：2015-05-07
申请人： ASAHI GLASS COMPANY, LIMITED
发明人： Seigo Ohta , Masamichi Tanida , Hideki Numakura , Qing Li
IPC分类号： C03C14/00 , B32B17/00
CPC分类号： C03C14/004 , B32B17/00 , C01F7/02 , C01F7/441 , C01P2002/02 , C01P2004/20 , C01P2004/54 , C01P2004/61 , C03C3/091 , C03C8/16 , C03C2214/04 , H05K1/0306 , H05K2201/0195 , H05K2201/0209 , H05K2201/0245 , H05K2201/068 , Y10T428/131 , Y10T428/24174 , Y10T428/26
摘要： A glass ceramic substrate includes: an inner layer part having a first thermal expansion coefficient; and a surface layer part having a second thermal expansion coefficient smaller than the first thermal expansion coefficient. The inner layer part contains a first glass matrix and flat alumina particles. The flat alumina particles are dispersed in the glass matrix in a direction in which individual thickness directions are substantially perpendicular to a surface direction of one of main surfaces of the inner layer part. Further, a mean aspect ratio of the flat alumina particles is 3 or more in one of cross sections along the thickness directions of the flat alumina particles out of cross sections of the inner layer part.

8. 发明申请

US20170156215A1 Method of Making Highly Flexible and Conductive Printed Graphene-Based Laminate for Wireless Wearable Communications 有权
公开(公告)号：US20170156215A1
公开(公告)日：2017-06-01
申请号：US14952942
申请日：2015-11-26
申请人： Chung-Ping LAI , Kuo-Hsin CHANG , Jia-Cing CHEN
发明人： Chung-Ping LAI , Kuo-Hsin CHANG , Jia-Cing CHEN
IPC分类号： H05K3/00 , H05K3/22
CPC分类号： H05K3/1283 , H01Q1/273 , H05K1/038 , H05K1/0386 , H05K1/0393 , H05K1/097 , H05K2201/0116 , H05K2201/0245 , H05K2201/0323 , H05K2201/10098 , H05K2203/0143 , H05K2203/0278
摘要： A printed graphene-based laminate for wireless wearable communications can be processed at low temperature so that it is compatible with heat-sensitive flexible materials like papers and textiles. The printed graphene-based laminate is of high conductivity, high flexibility, light weight and low cost, making it perfect candidate for wireless wearable devices. As a proof of concept, printed graphene-based laminate enabled transmission lines (TLs) and antennas were designed, fabricated and characterized. To explore its potentials in wearable communications applications, mechanically flexible transmission lines and antennas under various bended cases were experimentally studied. The measurement results demonstrate that the printed graphene laminate can be used for RF signal transmitting, radiating and receiving, which represents some of the essential functionalities of RF signal processing in wireless wearable communications systems. This work brings a step closer the prospect to implement all graphene enabled wireless wearable communications systems in the near future.

9. 发明授权

US09520206B2 Anisotropic conductive film and method for manufacturing the same 有权
标题翻译：各向异性导电膜及其制造方法
公开(公告)号：US09520206B2
公开(公告)日：2016-12-13
申请号：US14263673
申请日：2014-04-28
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Soo Young Ji , Jung Hyun Lee
IPC分类号： H01B1/24 , H05K3/32 , H05K3/36 , G02F1/1345
CPC分类号： H01B1/24 , G02F1/13452 , H05K3/323 , H05K3/365 , H05K2201/0245 , H05K2201/0323
摘要： Disclosed herein are an anisotropic conductive film and a method for manufacturing the same. The anisotropic conductive film according to the present invention includes: an insulating resin; and a plurality of conductive graphenes dispersed into the insulating resin.
摘要翻译：本文公开了各向异性导电膜及其制造方法。根据本发明的各向异性导电膜包括：绝缘树脂; 以及分散在绝缘树脂中的多个导电石墨烯。

10. 发明授权

US09460828B2 Graphene printed pattern circuit structure 有权
标题翻译：石墨烯印刷图案电路结构
公开(公告)号：US09460828B2
公开(公告)日：2016-10-04
申请号：US14528936
申请日：2014-10-30
申请人： Enerage Inc.
发明人： Mark Y Wu , Cheng-Yu Hsieh , Jing-Ru Chen , Shu-Ling Hsieh , Kuan-Ting Li
IPC分类号： H01B1/24 , H05K1/09 , H05K1/03
CPC分类号： H01B1/24 , H05K1/0313 , H05K1/097 , H05K2201/0245 , H05K2201/0257 , H05K2201/0323
摘要： Disclosed is a graphene printed circuit pattern structure including a substrate excellent in electrical insulation and a graphene printed circuit layer provided on the substrate. The graphene printed circuit layer is electrically conductive and has a circuit pattern like an electrical circuit on the circuit board. The graphene printed circuit layer includes surface-modified nanographene platelets, a carrier resin and a filler. The ratio of the particle size of the filler to the thickness of the surface-modified nanographene platelet is 2-1000, and the surface-modified nanographene platelets are dispersed in the carrier resin. The filler is uniformly placed among the surface-modified nanographene platelets so as to enhance effective contact for the surface-modified nanographene platelets. The graphene printed circuit pattern structure provides excellent electrical properties and heat dissipation to achieve protection by preventing electrical elements from overheat.
摘要翻译：公开了一种石墨烯印刷电路图案结构，其包括电绝缘性优异的基板和设置在基板上的石墨烯印刷电路层。石墨烯印刷电路层是导电的并且具有类似于电路板上的电路的电路图案。石墨烯印刷电路层包括表面改性的纳米线性血小板，载体树脂和填料。填料的粒径与表面改性纳米石墨烯薄片的厚度的比例为2-1000，表面改性的纳米油墨片分散在载体树脂中。将填料均匀地置于表面改性纳米油墨片中，以增强表面改性纳米石墨烯血小板的有效接触。石墨烯印刷电路图案结构提供优异的电性能和散热性，以通过防止电气元件过热来实现保护。

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