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1. 发明授权

US08912021B2 System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers 有权
标题翻译：用于制造具有波长转换层的发光二极管（LED）裸片的系统和方法
公开(公告)号：US08912021B2
公开(公告)日：2014-12-16
申请号：US13473796
申请日：2012-05-17
申请人： Jui-Kang Yen , De-Shuo Chen
发明人： Jui-Kang Yen , De-Shuo Chen
IPC分类号： H01L21/00 , H01L33/00 , H01L33/50
CPC分类号： H01L33/505 , H01L21/6838 , H01L2933/0041
摘要： A system for fabricating light emitting diode (LED) dice includes a wavelength conversion layer contained on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The system also includes a curing apparatus configured to reduce the adhesiveness of the adhesive layer to facilitate removal of the wavelength conversion layer from the substrate, and an attachment apparatus configured to remove the wavelength conversion layer from the substrate and to attach the wavelength conversion layer to a light emitting diode (LED) die. A method for fabricating light emitting diode (LED) dice includes the steps of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.
摘要翻译：一种用于制造发光二极管（LED）裸片的系统包括：在粘合剂层上的基底上包含的波长转换层，其构造为在暴露于物理能量（例如电磁辐射或热）时具有降低的粘附性。该系统还包括：固化装置，其被配置为降低粘合剂层的粘附性，以便于从基板除去波长转换层;以及附接装置，其被配置为从基板去除波长转换层并将波长转换层附着到发光二极管（LED）裸片。制造发光二极管（LED）模具的方法包括以下步骤：将衬底上的粘合剂层暴露于物理能量以降低粘合剂层的粘附性，从衬底去除波长转换层，以及将波长转换层到发光二极管（LED）模具。

2. 发明申请

US20130065327A1 METHOD AND SYSTEM FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENGTH CONVERSION LAYERS HAVING CONTROLLED COLOR CHARACTERISTICS 有权
标题翻译：用于制造具有控制颜色特性的波长转换层的发光二极管（LED）数位板的方法和系统
公开(公告)号：US20130065327A1
公开(公告)日：2013-03-14
申请号：US13562519
申请日：2012-07-31
申请人： Jui-Kang Yen , Georg Soerensen , Mark Ewing Tuttle
发明人： Jui-Kang Yen , Georg Soerensen , Mark Ewing Tuttle
IPC分类号： H01L33/50
CPC分类号： H01L33/501 , H01L33/0095 , H01L2933/0041
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of coating a transparent substrate with a wavelength conversion material, continuously evaluating a correlated color temperature (CCT) of the output electromagnetic radiation produced by the wavelength conversion material and comparing the correlated color temperature (CCT) to a target correlated color temperature (CCT), and controlling the coating step responsive to feedback from the evaluating and comparing step to adjust the correlated color temperature (CCT) to achieve the target correlated color temperature (CCT). A system for fabricating light emitting diode (LED) dice includes a coating system, a monitoring system, and a control system configured to control the coating system to adjust the correlated color temperature (CCT) of the wavelength conversion material on the transparent substrate to achieve the target correlated color temperature (CCT).
摘要翻译：制造发光二极管（LED）晶片的方法包括以下步骤：用波长转换材料涂覆透明衬底，连续评估由波长转换材料产生的输出电磁辐射的相关色温（CCT），并比较相关色彩温度（CCT）到目标相关色温（CCT），并且响应于来自评估和比较步骤的反馈来控制涂层步骤以调节相关色温（CCT）以实现目标相关色温（CCT）。一种用于制造发光二极管（LED）裸片的系统包括涂层系统，监测系统和控制系统，其被配置为控制涂层系统以调节透明衬底上的波长转换材料的相关色温（CCT）以实现目标相关色温（CCT）。

3. 发明申请

US20130062592A1 LIGHT EMITTING DIODE (LED) DICE HAVING WAVELENGTH CONVERSION LAYERS AND METHODS OF FABRICATION 有权
标题翻译：具有波长转换层的发光二极管（LED）数量和制造方法
公开(公告)号：US20130062592A1
公开(公告)日：2013-03-14
申请号：US13463874
申请日：2012-05-04
申请人： JUI-KANG YEN
发明人： JUI-KANG YEN
IPC分类号： H01L33/06 , H01L33/58 , H01L33/60
CPC分类号： H01L33/50 , H01L33/501 , H01L33/505 , H01L2933/0041
摘要： A light emitting diode (LED) die includes a wavelength conversion layer having a base material, and a plurality of particles embedded in the base material including wavelength conversion particles, and reflective particles. A method for fabricating light emitting diode (LED) dice includes the steps of mixing the wavelength conversion particles in the base material to a first weight percentage, mixing the reflective particles in the base material to a second weight percentage, curing the base material to form a wavelength conversion layer having a selected thickness, and attaching the wavelength conversion layer to a die.
摘要翻译：发光二极管（LED）管芯包括具有基材的波长转换层和嵌入在包括波长转换颗粒的基材中的多个颗粒和反射颗粒。制造发光二极管（LED）模具的方法包括以下步骤：将基材中的波长转换颗粒混合到第一重量百分比，将基材中的反射颗粒混合至第二重量百分比，固化基材以形成具有选定厚度的波长转换层，并将波长转换层附接到管芯。

4. 发明授权

US08124454B1 Die separation 有权
标题翻译：模具分离
公开(公告)号：US08124454B1
公开(公告)日：2012-02-28
申请号：US11548629
申请日：2006-10-11
申请人： Chen-Fu Chu , Trung Tri Doan , Chuong Anh Tran , Chao-Chen Cheng , Jiunn-Yi Chu , Wen-Huang Liu , Hao-Chun Cheng , Feng-Hsu Fan , Jui-Kang Yen
发明人： Chen-Fu Chu , Trung Tri Doan , Chuong Anh Tran , Chao-Chen Cheng , Jiunn-Yi Chu , Wen-Huang Liu , Hao-Chun Cheng , Feng-Hsu Fan , Jui-Kang Yen
IPC分类号： H01L21/00
CPC分类号： H01L33/0079 , H01L33/0095 , H01L33/44 , H01L33/46 , H01S5/0201 , H01S5/0217 , H01S5/32341
摘要： Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.
摘要翻译：提供了用于制造金属器件的技术，例如垂直发光二极管（VLED）器件，功率器件，激光二极管和垂直腔表面发射激光器件。相应地生产的器件可以比常规金属器件更高的产量和更高的性能受益，例如发光二极管的较高的亮度和增加的导热性。此外，本发明公开了在具有原始非导热和/或非导电性的金属器件的高散热率的情况下适用于GaN基电子器件的制造技术中的技术。（或低）导电载体衬底。

5. 发明申请

US20110284866A1 LIGHT-EMITTING DIODE (LED) STRUCTURE HAVING A WAVELENGTH-CONVERTING LAYER AND METHOD OF PRODUCING 审中-公开
标题翻译：具有波长转换层的发光二极管（LED）结构及其制造方法
公开(公告)号：US20110284866A1
公开(公告)日：2011-11-24
申请号：US13191235
申请日：2011-07-26
申请人： CHUONG A. TRAN , Trung T. Doan , Jui-Kang Yen , Yung-Wei Chen
发明人： CHUONG A. TRAN , Trung T. Doan , Jui-Kang Yen , Yung-Wei Chen
IPC分类号： H01L33/42 , H01L33/40 , H01L33/50
CPC分类号： H01L33/0079 , H01L33/22 , H01L33/44 , H01L33/508 , H01L33/641 , H01L2224/48247 , H01L2224/48257 , H01L2224/8592 , H01L2924/181 , H01L2924/00012
摘要： A light emitting diode (LED) device having a substantially conformal wavelength-converting layer for producing uniform white light and a method of making said LED at both the wafer and individual die levels are provided. The LED device includes a metal substrate, a p-type semiconductor coupled to the metal substrate, an active region coupled to the p-type semiconductor, an n-type semiconductor coupled to the active region, and a wavelength converting layer coupled to the n-type semiconductor.
摘要翻译：提供了具有用于产生均匀的白光的基本上保形的波长转换层的发光二极管（LED）装置以及在晶片和各个晶片级上制造所述LED的方法。 LED装置包括金属基板，耦合到金属基板的p型半导体，耦合到p型半导体的有源区，耦合到有源区的n型半导体以及耦合到n型半导体的波长转换层型半导体。

6. 发明授权

US07863639B2 Light-emitting diode lamp with low thermal resistance 有权
标题翻译：具有低热阻的发光二极管灯
公开(公告)号：US07863639B2
公开(公告)日：2011-01-04
申请号：US11279530
申请日：2006-04-12
申请人： Jui-Kang Yen
发明人： Jui-Kang Yen
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/73 , H01L33/486 , H01L33/641 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00012
摘要： A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure.
摘要翻译：提供了一种具有比传统LED灯具更低热传导路径的发光二极管（LED）结构。对于一些实施例，提供了一种可表面安装的发光二极管结构，其具有沉积在金属基板上的有源层，该有源层直接接合到金属板上，该金属板通过将其定位在发光二极管的底部而基本上暴露于低热阻结构体。然后将该金属板焊接到包括散热器的印刷电路板（PCB）。对于本发明的一些实施例，金属板通过几个导热层被热导电地连接到可以包括在结构中的大型散热器。

7. 发明授权

US07811842B2 LED array 有权
标题翻译： LED阵列
公开(公告)号：US07811842B2
公开(公告)日：2010-10-12
申请号：US11622150
申请日：2007-01-11
申请人： Wen-Huang Liu , Jui-Kang Yen
发明人： Wen-Huang Liu , Jui-Kang Yen
IPC分类号： G01R31/28
CPC分类号： H01L25/0753 , G01R31/2635 , H01L33/62 , H01L2224/45144 , H01L2224/48137 , Y10T29/49004 , Y10T29/53022 , H01L2924/00
摘要： Methods for fabricating light-emitting diode (LED) array structures comprising multiple vertical LED stacks coupled to a single metal substrate is provided. The LED array structure may comprise two, three, four, or more LED stacks arranged in any configuration. Each of the LED stacks may have an individual external connection to make a common anode array since the p-doped regions of the LED stacks are all coupled to the metal substrate, or some to all of the n-doped regions of the LED stacks may be electrically connected to create a parallel LED array. Such LED arrays may offer better heat conduction and improved matching of LED characteristics (e.g., forward voltage and emission wavelength) between the individual LED stacks compared to conventional LED arrays.
摘要翻译：提供了包括耦合到单个金属基板的多个垂直LED叠层的制造发光二极管（LED）阵列结构的方法。 LED阵列结构可以包括以任何配置布置的两个，三个，四个或更多个LED堆叠。每个LED堆叠可以具有单独的外部连接以形成公共阳极阵列，因为LED堆叠的p掺杂区域全部耦合到金属衬底，或者LED堆叠的一些至所有n掺杂区域电连接以产生并联LED阵列。与常规LED阵列相比，这样的LED阵列可以提供更好的热传导和改进的LED特征（例如，正向电压和发射波长）的匹配。

8. 发明申请

US20090065791A1 WHITE LIGHT LED WITH MULTIPLE ENCAPSULATION LAYERS 有权
标题翻译：白光LED与多个封装层
公开(公告)号：US20090065791A1
公开(公告)日：2009-03-12
申请号：US11851216
申请日：2007-09-06
申请人： JUI-KANG YEN , Yung-Wei Chen , Tien-Min Liu
发明人： JUI-KANG YEN , Yung-Wei Chen , Tien-Min Liu
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Light-emitting semiconductor devices with multiple encapsulation layers having more uniform white light when compared to conventional light-emitting devices and methods for producing the same are provided. The uniformity of the emitted white light may be quantified by comparing correlated color temperature (CCT) variations between devices, where embodiments of the present invention have a lower CCT variation when compared to conventional devices over a substantial range of light emission angles.
摘要翻译：提供了与传统的发光器件相比具有多个具有更均匀的白光的封装层的发光半导体器件及其制造方法。发射的白光的均匀性可以通过比较器件之间的相关色温（CCT）变化来量化，其中本发明的实施例在相当大的发光角度范围内与常规器件相比具有较低的CCT变化。

9. 外观设计

USD581884S1 Light emitting diode device 有权
标题翻译：发光二极管装置
公开(公告)号：USD581884S1
公开(公告)日：2008-12-02
申请号：US29284248
申请日：2007-09-04
申请人： Jui-Kang Yen
设计人： Jui-Kang Yen

10. 发明申请

US20080123023A1 WHITE LIGHT UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME 审中-公开
标题翻译：白光单元，背光单元和使用其的液晶显示装置
公开(公告)号：US20080123023A1
公开(公告)日：2008-05-29
申请号：US11468363
申请日：2006-08-30
申请人： TRUNG DOAN , Wen-Huang Liu , Jui-Kang Yen , Yung-Wei Chen , Ching-Tai Cheng
发明人： TRUNG DOAN , Wen-Huang Liu , Jui-Kang Yen , Yung-Wei Chen , Ching-Tai Cheng
IPC分类号： G02F1/1335 , F21V9/16
CPC分类号： G02B6/0068 , G02B6/0073 , G02F1/133603 , G02F2001/133614
摘要： A white light source using solid state technology, as well as general backlight units and liquid crystal displays (LCDs) that may incorporate such a white light source, are provided. The white light source described herein utilizes a monochrome light-emitting diode (LED) and a wavelength-converting layer having fluorescent materials to produce a substantially uniform broadband optical spectrum visible as white light. Being constructed on a metal substrate, the white light source may also provide for an improved heat transfer path over conventional solid state white light sources.
摘要翻译：提供了使用固态技术的白光源以及可并入这种白光源的通用背光单元和液晶显示器（LCD）。本文所述的白光源使用具有荧光材料的单色发光二极管（LED）和波长转换层，以产生可视为白光的基本均匀的宽带光谱。在金属基板上构造，白光源也可以提供比常规固态白光源更好的传热路径。

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