专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130065327A1 METHOD AND SYSTEM FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENGTH CONVERSION LAYERS HAVING CONTROLLED COLOR CHARACTERISTICS 有权
标题翻译：用于制造具有控制颜色特性的波长转换层的发光二极管（LED）数位板的方法和系统
公开(公告)号：US20130065327A1
公开(公告)日：2013-03-14
申请号：US13562519
申请日：2012-07-31
申请人： Jui-Kang Yen , Georg Soerensen , Mark Ewing Tuttle
发明人： Jui-Kang Yen , Georg Soerensen , Mark Ewing Tuttle
IPC分类号： H01L33/50
CPC分类号： H01L33/501 , H01L33/0095 , H01L2933/0041
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of coating a transparent substrate with a wavelength conversion material, continuously evaluating a correlated color temperature (CCT) of the output electromagnetic radiation produced by the wavelength conversion material and comparing the correlated color temperature (CCT) to a target correlated color temperature (CCT), and controlling the coating step responsive to feedback from the evaluating and comparing step to adjust the correlated color temperature (CCT) to achieve the target correlated color temperature (CCT). A system for fabricating light emitting diode (LED) dice includes a coating system, a monitoring system, and a control system configured to control the coating system to adjust the correlated color temperature (CCT) of the wavelength conversion material on the transparent substrate to achieve the target correlated color temperature (CCT).
摘要翻译：制造发光二极管（LED）晶片的方法包括以下步骤：用波长转换材料涂覆透明衬底，连续评估由波长转换材料产生的输出电磁辐射的相关色温（CCT），并比较相关色彩温度（CCT）到目标相关色温（CCT），并且响应于来自评估和比较步骤的反馈来控制涂层步骤以调节相关色温（CCT）以实现目标相关色温（CCT）。一种用于制造发光二极管（LED）裸片的系统包括涂层系统，监测系统和控制系统，其被配置为控制涂层系统以调节透明衬底上的波长转换材料的相关色温（CCT）以实现目标相关色温（CCT）。

2. 发明授权

US08841146B2 Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics 有权
标题翻译：用于制造具有受控颜色特性的波长转换层的发光二极管（LED）裸片的方法和系统
公开(公告)号：US08841146B2
公开(公告)日：2014-09-23
申请号：US13562519
申请日：2012-07-31
申请人： Jui-Kang Yen , Georg Soerensen , Mark Ewing Tuttle
发明人： Jui-Kang Yen , Georg Soerensen , Mark Ewing Tuttle
IPC分类号： H01L21/00 , H01L33/00 , H01L33/50
CPC分类号： H01L33/501 , H01L33/0095 , H01L2933/0041
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of coating a transparent substrate with a wavelength conversion material, continuously evaluating a correlated color temperature (CCT) of the output electromagnetic radiation produced by the wavelength conversion material and comparing the correlated color temperature (CCT) to a target correlated color temperature (CCT), and controlling the coating step responsive to feedback from the evaluating and comparing step to adjust the correlated color temperature (CCT) to achieve the target correlated color temperature (CCT). A system for fabricating light emitting diode (LED) dice includes a coating system, a monitoring system, and a control system configured to control the coating system to adjust the correlated color temperature (CCT) of the wavelength conversion material on the transparent substrate to achieve the target correlated color temperature (CCT).
摘要翻译：制造发光二极管（LED）晶片的方法包括以下步骤：用波长转换材料涂覆透明衬底，连续评估由波长转换材料产生的输出电磁辐射的相关色温（CCT），并比较相关色彩温度（CCT）到目标相关色温（CCT），并且响应于来自评估和比较步骤的反馈来控制涂层步骤以调节相关色温（CCT）以实现目标相关色温（CCT）。一种用于制造发光二极管（LED）裸片的系统包括涂层系统，监测系统和控制系统，其被配置为控制涂层系统以调节透明衬底上的波长转换材料的相关色温（CCT）以实现目标相关色温（CCT）。

3. 发明授权

US08866185B2 White light LED with multiple encapsulation layers 有权
标题翻译：白光LED具有多个封装层
公开(公告)号：US08866185B2
公开(公告)日：2014-10-21
申请号：US11851216
申请日：2007-09-06
申请人： Jui-Kang Yen , Yung-Wei Chen , Tien-Min Liu
发明人： Jui-Kang Yen , Yung-Wei Chen , Tien-Min Liu
IPC分类号： H01L33/00 , H01L33/50
CPC分类号： H01L33/507 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Light-emitting semiconductor devices with multiple encapsulation layers having more uniform white light when compared to conventional light-emitting devices and methods for producing the same are provided. The uniformity of the emitted white light may be quantified by comparing correlated color temperature (CCT) variations between devices, where embodiments of the present invention have a lower CCT variation when compared to conventional devices over a substantial range of light emission angles.
摘要翻译：提供了与传统的发光器件相比具有多个具有更均匀的白光的封装层的发光半导体器件及其制造方法。发射的白光的均匀性可以通过比较器件之间的相关色温（CCT）变化来量化，其中本发明的实施例在相当大的发光角度范围内与常规器件相比具有较低的CCT变化。

4. 发明授权

US08492746B2 Light emitting diode (LED) dice having wavelength conversion layers 有权
标题翻译：具有波长转换层的发光二极管（LED）芯片
公开(公告)号：US08492746B2
公开(公告)日：2013-07-23
申请号：US13463874
申请日：2012-05-04
申请人： Jui-Kang Yen
发明人： Jui-Kang Yen
IPC分类号： H01L29/06 , H01L31/0328 , H01L31/0336 , H01L31/072 , H01L31/109
CPC分类号： H01L33/50 , H01L33/501 , H01L33/505 , H01L2933/0041
摘要： A light emitting diode (LED) die includes a wavelength conversion layer having a base material, and a plurality of particles embedded in the base material including wavelength conversion particles, and reflective particles. A method for fabricating light emitting diode (LED) dice includes the steps of mixing the wavelength conversion particles in the base material to a first weight percentage, mixing the reflective particles in the base material to a second weight percentage, curing the base material to form a wavelength conversion layer having a selected thickness, and attaching the wavelength conversion layer to a die.
摘要翻译：发光二极管（LED）管芯包括具有基材的波长转换层和嵌入在包括波长转换颗粒的基材中的多个颗粒和反射颗粒。制造发光二极管（LED）模具的方法包括以下步骤：将基材中的波长转换颗粒混合到第一重量百分比，将基材中的反射颗粒混合至第二重量百分比，固化基材以形成具有选定厚度的波长转换层，并将波长转换层附接到管芯。

5. 发明申请

US20120032217A1 WHITE LED DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：白光LED装置及其制造方法
公开(公告)号：US20120032217A1
公开(公告)日：2012-02-09
申请号：US13118337
申请日：2011-05-27
申请人： Jui-Kang Yen
发明人： Jui-Kang Yen
IPC分类号： H01L33/50
CPC分类号： H01L33/507 , H01L33/44 , H01L33/505 , H01L33/58 , H01L2933/0058
摘要： The invention provides a white light emitting diode device, which includes: a conductive substrate; a multilayered light emitting semiconductor epitaxial structure formed on the conductive substrate; a contact provided on the multilayered light emitting semiconductor epitaxial structure; a transparent layer provided on the multilayered light emitting semiconductor epitaxial structure; a wavelength converting layer provided on the transparent layer; and an optical layer provided on the wavelength converting layer. The invention also provides a method of manufacturing the white light emitting diode device.
摘要翻译：本发明提供了一种白色发光二极管器件，其包括：导电衬底; 形成在所述导电基板上的多层发光半导体外延结构; 提供在多层发光半导体外延结构上的接触; 设置在所述多层发光半导体外延结构上的透明层; 设置在透明层上的波长转换层; 以及设置在波长转换层上的光学层。本发明还提供一种制造白色发光二极管器件的方法。

6. 发明授权

US07911059B2 High thermal conductivity substrate for a semiconductor device 有权
标题翻译：用于半导体器件的高导热性衬底
公开(公告)号：US07911059B2
公开(公告)日：2011-03-22
申请号：US11760369
申请日：2007-06-08
申请人： Ching-Tai Cheng , Jui-Kang Yen
发明人： Ching-Tai Cheng , Jui-Kang Yen
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L33/641 , H01L24/97 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2924/00014 , H01L2924/00
摘要： A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.
摘要翻译：提供了一种用于封装半导体管芯以提高导热性并且与常规半导体封装技术相比更简单的制造的方法和装置。本文描述的封装技术可适用于各种半导体器件，例如发光二极管（LED），中央处理单元（CPU），图形处理单元（GPU），微控制器单元（MCU）和数字信号处理器（DSP）。对于一些实施例，封装包括陶瓷衬底，其具有上空腔，其中设置有一个或多个半导体管芯，并且具有沉积有一个或多个金属层的下部空腔，以将散热从半导体管芯散出。对于其它实施例，封装包括陶瓷衬底，该陶瓷衬底具有上空腔，其中设置有一个或多个半导体管芯，并且具有下表面，其上沉积有一个或多个金属层，用于有效散热。

7. 发明授权

US07781783B2 White light LED device 有权
标题翻译：白光LED装置
公开(公告)号：US07781783B2
公开(公告)日：2010-08-24
申请号：US12025584
申请日：2008-02-04
申请人： Jui-Kang Yen , Yung-Wei Chen
发明人： Jui-Kang Yen , Yung-Wei Chen
IPC分类号： H01L29/22
CPC分类号： H01L33/504 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2933/0091 , H01L2924/00014
摘要： Light-emitting diode (LED) devices which can produce a uniform white light with a broad emission spectrum and a high color rendering index (CRI) are provided. For example, the emission spectrum of LED devices as described herein may provide more red light and yield a higher CRI light when compared to conventional white LEDs. For some embodiments, the various lights emitted from different layers of the LED device may mix at a light-scattering encapsulation layer and become a uniform white light.
摘要翻译：提供了能够产生具有宽发射光谱和高显色指数（CRI）的均匀白光的发光二极管（LED）装置。例如，与传统白光LED相比，本文所述的LED器件的发射光谱可以提供更多的红光并产生更高的CRI光。对于一些实施例，从LED器件的不同层发射的各种光可以在光散射封装层处混合并变成均匀的白光。

8. 外观设计

USD613702S1 Two-pin lead frame for a LED device 有权
标题翻译：双针引线框架，用于LED设备
公开(公告)号：USD613702S1
公开(公告)日：2010-04-13
申请号：US29278104
申请日：2007-03-20
申请人： Jui-Kang Yen , Yung-Wei Chen
设计人： Jui-Kang Yen , Yung-Wei Chen

9. 发明申请

US20120092852A1 LLB BULB HAVING LIGHT EXTRACTING ROUGH SURFACE PATTERN (LERSP) AND METHOD OF FABRICATION 有权
标题翻译：具有光提取粗糙表面图案（LERSP）的LLB袋和制造方法
公开(公告)号：US20120092852A1
公开(公告)日：2012-04-19
申请号：US13338524
申请日：2011-12-28
申请人： Trung Tri Doan , Jui-Kang Yen
发明人： Trung Tri Doan , Jui-Kang Yen
IPC分类号： F21V9/16 , F21V5/04 , H01L33/48 , F21V9/00
CPC分类号： F21V3/049 , F21K9/232 , F21K9/64 , F21V3/04 , F21V5/00 , F21Y2115/10
摘要： A LLB bulb includes a base, a LED light source configured to emit electromagnetic radiation, and a lens/cover having a light extracting rough surface pattern (LERSP) configured to reduce glare and reflection in the LLB bulb without light loss. A method for fabricating the LLB bulb includes the steps of providing the lens/cover, and forming the light extracting rough surface pattern (LERSP) on the lens/cover. The lens/cover can be fabricated with the light extracting rough surface pattern (LERSP) using a process such as bead blasting, sand blasting, etching (chemical or plasma), or molding.
摘要翻译： LLB灯泡包括基座，被配置为发射电磁辐射的LED光源，以及具有提取粗糙表面图案（LERSP）的透镜/盖，该透镜/盖被配置为减少LLB灯泡中的眩光和反射而没有光损失。制造LLB灯泡的方法包括以下步骤：提供透镜/盖，并在透镜/盖上形成光提取粗糙表面图案（LERSP）。可以使用诸如珠粒喷砂，喷砂，蚀刻（化学或等离子体）或模塑的工艺，用光提取粗糙表面图案（LERSP）制造透镜/盖。

10. 发明授权

US07852015B1 Solid state lighting system and maintenance method therein 有权
标题翻译：固态照明系统及其维护方法
公开(公告)号：US07852015B1
公开(公告)日：2010-12-14
申请号：US11548604
申请日：2006-10-11
申请人： Jui-Kang Yen , Trung Tri Doan , Yung-Wei Chen , Ching-Tai Cheng
发明人： Jui-Kang Yen , Trung Tri Doan , Yung-Wei Chen , Ching-Tai Cheng
IPC分类号： H05B41/16
CPC分类号： F21V23/06 , F21K9/23 , F21Y2105/10 , F21Y2115/10
摘要： A solid state light module incorporating light emitting diodes (LEDs) disposed on a metal substrate, a solid state lighting system employing such modules, and method of replacing LEDs of the light modules are provided. The metal substrate may allow for lower LED junction temperature and, hence, a longer device lifetime. In addition, the metal substrate may allow for the potential omission of a heat sink, which may reduce light module size, when compared to conventional solid state light emitters.
摘要翻译：提供了一种结合设置在金属基板上的发光二极管（LED）的固态光模块，采用这种模块的固态照明系统，以及替换该光模组的LED的方法。金属基板可以允许较低的LED结温度，并因此允许更长的器件寿命。此外，与传统的固态发光体相比，金属基板可以允许潜在的省略散热器，这可能减少光模块尺寸。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式