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    • 1. 发明授权
    • Methodology for analysis and fixing guidance of pre-coloring layout
    • 预先着色布局的分析和固定指导方法
    • US08434043B1
    • 2013-04-30
    • US13480847
    • 2012-05-25
    • Chin-Chang HsuHungLung LinWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • Chin-Chang HsuHungLung LinWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G06F17/5081
    • The present disclosure relates to a method and apparatus for identifying pre-coloring violations and for providing hints and/or warnings to a designer to eliminate the pre-coloring violations. In some embodiments, the method is performed by identifying G0-spaces within a double patterning technology (DPT) layer, of an integrated chip (IC) layout, having a plurality of pre-colored shapes. Violation paths extending between the pre-colored shapes are identified based upon the G0-spaces. Good paths (i.e., paths that will not cause a violation) and bad paths (i.e., paths that will cause a violation) between the pre-colored shapes are also identified. Hints and/or warnings are generated based upon the identified good and bad paths, wherein the hints and/or warnings provide guidance to eliminate the violation paths and develop a violation free IC layout.
    • 本公开涉及一种用于识别预着色违规的方法和装置,并且用于向设计者提供提示和/或警告以消除预着色违规。 在一些实施例中,该方法通过识别具有多个预着色形状的集成芯片(IC)布局的双图案形成技术(DPT)层内的G0空间来执行。 基于G0空格识别在预色图案之间延伸的违规路径。 还识别出良好路径(即,不会引起违规的路径)和不良路径(即将导致违规的路径)。 提示和/或警告是基于所识别的好路径和不良路径生成的,其中提示和/或警告提供指导以消除违规路径并开发无违规IC布局。
    • 2. 发明申请
    • MULTI-PATTERNING METHOD
    • 多图案方法
    • US20130074018A1
    • 2013-03-21
    • US13238127
    • 2011-09-21
    • Chin-Chang HSUWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • Chin-Chang HSUWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G03F1/70
    • A method comprises (a) receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool, the layout including a plurality of polygons to be formed in the DPT-layer by a multi-patterning process; (b) receiving at least one identification of a subset of the plurality of polygons that are to be formed in the DPT-layer using the same photomask as each other; (c) constructing a graph of the subset of the plurality of polygons and any intervening polygons of the plurality of polygons, where the subset of the plurality of polygons are represented in the graph by a single node, the graph including connections connecting adjacent ones of the polygons in the graph that are positioned within a threshold distance of each other; and (d) identifying a multi-patterning conflict if any subset of the connections form an odd loop.
    • 一种方法包括(a)接收表示由位置和路线工具生成的集成电路的DPT层的布局的数据,该布局包括通过多图案化工艺在DPT层中形成的多个多边形; (b)使用彼此相同的光掩模来接收要在DPT层中形成的多个多边形的子集的至少一个标识; (c)构造所述多个多边形的子集的图形和所述多个多边形中的任何中间多边形,其中所述多个多边形的所述子集由所述图形中的单个节点表示,所述图包括连接相邻的多边形的连接 图中的多边形位于彼此的阈值距离内; 和(d)如果连接的任何子集形成奇数循环,则识别多图案化冲突。
    • 3. 发明授权
    • Multi-patterning method
    • 多图案化方法
    • US08468470B2
    • 2013-06-18
    • US13238127
    • 2011-09-21
    • Chin-Chang HsuWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • Chin-Chang HsuWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G03F1/70
    • A method comprises (a) receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool, the layout including a plurality of polygons to be formed in the DPT-layer by a multi-patterning process; (b) receiving at least one identification of a subset of the plurality of polygons that are to be formed in the DPT-layer using the same photomask as each other; (c) constructing a graph of the subset of the plurality of polygons and any intervening polygons of the plurality of polygons, where the subset of the plurality of polygons are represented in the graph by a single node, the graph including connections connecting adjacent ones of the polygons in the graph that are positioned within a threshold distance of each other; and (d) identifying a multi-patterning conflict if any subset of the connections form an odd loop.
    • 一种方法包括(a)接收表示由位置和路线工具生成的集成电路的DPT层的布局的数据,该布局包括通过多图案化工艺在DPT层中形成的多个多边形; (b)使用彼此相同的光掩模来接收要在DPT层中形成的多个多边形的子集的至少一个标识; (c)构造所述多个多边形的子集的图形和所述多个多边形中的任何中间多边形,其中所述多个多边形的所述子集由所述图形中的单个节点表示,所述图包括连接相邻的多边形的连接 图中的多边形位于彼此的阈值距离内; 和(d)如果连接的任何子集形成奇数循环,则识别多图案化冲突。
    • 4. 发明授权
    • Decomposition and marking of semiconductor device design layout in double patterning lithography
    • 半双工图案平版印刷中半导体器件设计布局的分解和标记
    • US08775977B2
    • 2014-07-08
    • US13027520
    • 2011-02-15
    • Chin-Chang HsuWen-Ju YangHsiao-Shu ChaoYi-Kan ChengLee-Chung Lu
    • Chin-Chang HsuWen-Ju YangHsiao-Shu ChaoYi-Kan ChengLee-Chung Lu
    • G06F17/50
    • G03F1/70G03F7/70433G03F7/70466
    • Provided is a system and method for assessing a design layout for a semiconductor device level and for determining and designating different features of the design layout to be formed by different photomasks by decomposing the design layout. The features are designated by markings that associate the various device features with the multiple photomasks upon which they will be formed and then produced on a semiconductor device level using double patterning lithography, DPL, techniques. The markings are done at the device level and are included on the electronic file provided by the design house to the photomask foundry. In addition to overlay and critical dimension considerations for the design layout being decomposed, various other device criteria, design criteria processing criteria and their interrelation are taken into account, as well as device environment and the other device layers, when determining and marking the various device features.
    • 提供了一种用于评估半导体器件级的设计布局并通过分解设计布局来确定和指定由不同光掩模形成的设计布局的不同特征的系统和方法。 这些特征由标记指定,该标记将各种器件特征与将在其上形成的多个光掩模相关联,然后使用双重图案化光刻DPL技术在半导体器件层面上产生。 标记是在设备级完成的,并被包括在由设计公司提供给光掩模铸造厂的电子文件中。 除了正在分解的设计布局的重叠和关键维度考虑之外,在确定和标记各种设备时,还考虑了各种其他设备标准,设计标准处理标准及其相关性以及设备环境和其他设备层 特征。
    • 6. 发明授权
    • Multi-patterning method
    • 多图案化方法
    • US08473873B2
    • 2013-06-25
    • US13224486
    • 2011-09-02
    • Chin-Chang HsuYing-Yu ShenWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • Chin-Chang HsuYing-Yu ShenWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G06F17/50G03F1/70
    • A method includes receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool. The layout includes a plurality of polygons to be formed in the DPT-layer by a multi-patterning process. First and second ones of the plurality of polygons to be formed using first and second photomasks, respectively are identified. Any intervening polygons along a first path connecting the first polygon to the second polygon, and separator regions between adjacent polygons along the first path are identified. The separator regions have sizes less than a minimum threshold distance between polygons formed on the first photomask. The separator regions are counted. A multi-patterning conflict is identified, if the count of separator regions is even, prior to assigning all remaining ones of the plurality of polygons to the first or second masks.
    • 一种方法包括接收表示由位置和路线工具生成的集成电路的DPT层的布局的数据。 该布局包括通过多图案化工艺在DPT层中形成的多个多边形。 分别使用第一和第二光掩模形成的多个多边形中的第一和第二多边形。 识别沿着连接第一多边形到第二多边形的第一路径以及沿着第一路径的相邻多边形之间的分隔区域的任何中间多边形。 分离器区域具有小于形成在第一光掩模上的多边形之间的最小阈值距离的尺寸。 计数分离器区域。 在将所述多个多边形中的所有剩余的多边形分配给第一或第二掩模之前,如果分离器区域的计数是偶数,则识别多图案化冲突。
    • 10. 发明授权
    • Semiconductor device design method, system and computer-readable medium
    • 半导体器件设计方法,系统和计算机可读介质
    • US08707245B2
    • 2014-04-22
    • US13406108
    • 2012-02-27
    • Ching-Shun YangZe-Ming WuHsiao-Shu ChaoYi-Kan Cheng
    • Ching-Shun YangZe-Ming WuHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50G06F11/22
    • G06F17/5081G03F7/00G06F17/5036G06F2217/82
    • In a semiconductor device design method performed by at least one processor, first and second electrical components are extracted from a layout of a semiconductor device. The semiconductor device has a semiconductor substrate and the first and second electrical components in the semiconductor substrate. Parasitic parameters of a coupling in the semiconductor substrate between the first and second electrical components are extracted using a first tool. Intrinsic parameters of the first and second electrical components are extracted using a second tool different from the first tool. The extracted parasitic parameters and intrinsic parameters are combined into a model of the semiconductor device. The parasitic parameters of the coupling are extracted based on a model of the coupling included in the second tool.
    • 在由至少一个处理器执行的半导体器件设计方法中,从半导体器件的布局中提取第一和第二电子部件。 半导体器件具有半导体衬底和半导体衬底中的第一和第二电子部件。 使用第一工具提取第一和第二电气部件之间的半导体衬底中的耦合的寄生参数。 使用与第一工具不同的第二工具提取第一和第二电气部件的固有参数。 提取的寄生参数和固有参数被组合成半导体器件的模型。 基于包括在第二工具中的耦合模型,提取耦合的寄生参数。