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1. 发明申请

US20050195396A1 Inspection condition setting program, inspection device and inspection system 审中-公开
公开(公告)号：US20050195396A1
公开(公告)日：2005-09-08
申请号：US11066121
申请日：2005-02-24
申请人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
发明人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
IPC分类号： G01N21/956 , G01R31/303 , G06T1/00 , G06T7/00 , H01L21/00 , H01L21/66 , G01B11/00
CPC分类号： G01N21/9501 , G01N21/95684 , G01R31/2894 , H01L22/12 , H01L22/20
摘要： A program is provided for setting efficiently, and with precision, the inspection conditions of an inspection device that detects particles and deformed patterns in or on products such as semiconductor integrated circuits that are manufactured by simultaneously forming a plurality of products on a single substrate. In particular, the system achieves greater efficiency of the setting of cell comparison regions and the setting of non-inspection regions. Input processing of a product type code, input processing of chip size and configuration information, reading processing of circuit layout data, extraction processing of repeated pattern region coordinates, extraction processing of sparse region coordinates and circuit pattern condition registration processing are sequentially executed.

2. 发明授权

US06928375B2 Inspection condition setting program, inspection device and inspection system 失效
标题翻译：检验条件设定程序，检查装置和检查系统
公开(公告)号：US06928375B2
公开(公告)日：2005-08-09
申请号：US10411785
申请日：2003-04-10
申请人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
发明人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
IPC分类号： G01N21/956 , G01R31/303 , G06T1/00 , G06T7/00 , H01L21/00 , H01L21/66 , G06F19/00
CPC分类号： G01N21/9501 , G01N21/95684 , G01R31/2894 , H01L22/12 , H01L22/20
摘要： A program is provided for setting efficiently, and with precision, the inspection conditions of an inspection device that detects particles and deformed patterns in or on products such as semiconductor integrated circuits that are manufactured by simultaneously forming a plurality of products on a single substrate. In particular, the system achieves greater efficiency of the setting of cell comparison regions and the setting of non-inspection regions. Input processing of a product type code, input processing of chip size and configuration information, reading processing of circuit layout data, extraction processing of repeated pattern region coordinates, extraction processing of sparse region coordinates and circuit pattern condition registration processing are sequentially executed.
摘要翻译：提供了一种程序，用于精确地设置检测装置的检查条件，该检查装置检测在通过在单个基板上同时形成多个产品而制造的半导体集成电路等产品中或其上产生的变形图案。特别地，该系统实现了细胞比较区域的设置和非检查区域的设置的更高的效率。顺序地执行产品类型代码的输入处理，芯片尺寸和配置信息的输入处理，电路布局数据的读取处理，重复模式区域坐标的提取处理，稀疏区域坐标的提取处理和电路图案状态注册处理。

3. 发明授权

US06611728B1 Inspection system and method for manufacturing electronic devices using the inspection system 有权
标题翻译：使用检查系统制造电子设备的检查系统和方法
公开(公告)号：US06611728B1
公开(公告)日：2003-08-26
申请号：US09389230
申请日：1999-09-03
申请人： Natsuyo Morioka , Hisafumi Iwata , Junko Konishi , Yoko Ikeda , Kazunori Nemoto , Makoto Ono , Yasuhiro Yoshitake
发明人： Natsuyo Morioka , Hisafumi Iwata , Junko Konishi , Yoko Ikeda , Kazunori Nemoto , Makoto Ono , Yasuhiro Yoshitake
IPC分类号： G06F1900
CPC分类号： G01N21/9501 , H01L22/12 , H01L22/20
摘要： An inspection system comprises an inspection machine for inspecting a work which is processed in one of the manufacturing processes of a manufacturing line and an analysis system for outputting an inspection history list obtained by making calculations from the inspected result. The inspection history list shows a matrix of first information as the inspection processes in which the work is inspected or the manufacturing processes corresponding to the inspection processes in which the work is inspected and second information as to the works inspected by the inspection machine.
摘要翻译：检查系统包括检查机器，用于检查在生产线的一个制造过程中处理的工件和用于输出通过从检查结果进行计算而获得的检查履历表的分析系统。检查历史列表显示作为检查工作的检查过程的第一信息矩阵或与检查工作相关的检查过程对应的制造过程以及由检查机检查的工件的第二信息。

4. 发明授权

US5278012A Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate 失效
标题翻译：薄膜多层基板的制造方法以及检测基板电路导体图案的方法和装置
公开(公告)号：US5278012A
公开(公告)日：1994-01-11
申请号：US938516
申请日：1992-09-02
申请人： Chie Yamanaka , Toshiaki Ichinose , Takanori Ninomiya , Hisafumi Iwata , Yasuo Nakagawa , Nobuyuki Akiyama
发明人： Chie Yamanaka , Toshiaki Ichinose , Takanori Ninomiya , Hisafumi Iwata , Yasuo Nakagawa , Nobuyuki Akiyama
IPC分类号： G01N21/956 , H01L21/00 , H01L21/48 , H01L21/66 , H05K3/22 , G01N21/88 , G01N21/64
CPC分类号： H01L21/67121 , G01N21/95684 , H01L21/4857 , H01L22/20 , H05K3/225 , G01N2021/8825
摘要： A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.
摘要翻译：一种制造具有基底基板的薄膜多层基板的方法，其中通过介电层叠置在其上的多个导体图案层之间包括以下步骤：每当在导体图案层上形成导体图案层时，光学检测最上面的导体图案层基底; 检查导体图案层的缺陷和/或存在故障; 并根据检查检测到的故障位置数据修复故障部分。根据这种方法，可以提高生产成本较高的相对大尺寸薄膜多层基板的生产成本，以便在其上安装LSI芯片。

5. 发明授权

US08319960B2 Defect inspection system 失效
标题翻译：缺陷检查系统
公开(公告)号：US08319960B2
公开(公告)日：2012-11-27
申请号：US12770337
申请日：2010-04-29
申请人： Kenji Aiko , Shuichi Chikamatsu , Minori Noguchi , Hisafumi Iwata
发明人： Kenji Aiko , Shuichi Chikamatsu , Minori Noguchi , Hisafumi Iwata
IPC分类号： G01N21/88
CPC分类号： H04N7/18 , G01N21/9501 , G01N21/956 , G01N2021/8822 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 10a, and an angle between the sample surface and a traveling direction of the light from a defect is α1. An oblique detection optics system receives the light from the defect at a reduced elevation angle α2 with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and to increase the amount of the light from the defect and detected. The diameter 10a of a lens is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens with an outer diameter 10c is used to improve the focus ability, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed. The lens has an aperture larger than the diameter 10b while the lens receives the light scattered at the elevation angle α2, making it possible to improve the ability to detect defects and lens performance simultaneously.
摘要翻译：缺陷检查系统可以抑制来自样品粗糙表面或常规电路图案的光的影响，并且增加来自诸如异物的缺陷的光的增益以高灵敏度检测样品表面上的缺陷。当使用具有大NA值的透镜时，透镜的外径为10a，并且样品表面与来自缺陷的光的行进方向之间的角度为α1。倾斜检测光学系统以相对于样品表面的降低的仰角α2接收来自缺陷的光，以减少来自样品粗糙表面，氧化膜粗糙底表面和电路图案的光，并且增加来自缺陷的光并检测。透镜的直径10a小于直径10b，导致散射光聚焦的能力降低。当使用外径为10c的透镜来提高聚焦能力时，透镜会干扰样品。为了避免干扰，去除了与样品干扰的一部分透镜。透镜具有大于直径10b的孔径，而透镜接收以仰角α2散射的光，从而可以提高同时检测缺陷和透镜性能的能力。

6. 发明授权

US07426023B2 Method and apparatus for detecting defects 有权
标题翻译：检测缺陷的方法和装置
公开(公告)号：US07426023B2
公开(公告)日：2008-09-16
申请号：US11296290
申请日：2005-12-08
申请人： Yoshimasa Ohshima , Hisafumi Iwata , Hiroyuki Nakano
发明人： Yoshimasa Ohshima , Hisafumi Iwata , Hiroyuki Nakano
IPC分类号： G01N21/00
CPC分类号： G01N21/47 , G01N21/21 , G01N21/94 , G01N21/9501 , G01N2021/8825
摘要： There is disclosed a defect detecting apparatus that focuses a laser beam, irradiates it onto the surface of a sample to be examined, and detects a foreign substance/defect existing on the surface from the scattered light as a result of the irradiation of the beam onto the sample surface. In order to stably detect defects such as foreign substance, the defect detecting apparatus according to the invention is constructed to use a beam shape optical system by which the laser beam emitted from a laser source is shaped to change the illumination intensity from its Gauss distribution to a flat distribution so that the detected signal can be stably produced even if the relative position of a defect/foreign substance to the laser beam irradiation position is changed.
摘要翻译：公开了一种将激光束聚焦并将其照射到待检查样品的表面上的缺陷检测装置，并且由于将光束照射到散射光上而检测存在于表面上的异物/缺陷样品表面。为了稳定地检测异物等缺陷，根据本发明的缺陷检测装置的结构是使用光束形状光学系统，通过该光束系统将从激光源发射的激光束成形为将照射强度从其高斯分布改变为平坦分布，使得即使改变了缺陷/异物与激光束照射位置的相对位置，也能够稳定地产生检测信号。

7. 发明申请

US20050264797A1 Method and apparatus for detecting defects 审中-公开
标题翻译：检测缺陷的方法和装置
公开(公告)号：US20050264797A1
公开(公告)日：2005-12-01
申请号：US11136664
申请日：2005-05-25
申请人： Hiroyuki Nakano , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Akira Hamamatsu , Hisafumi Iwata , Tetsuya Watanabe , Takahiro Jingu , Hideki Fukushima
发明人： Hiroyuki Nakano , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Akira Hamamatsu , Hisafumi Iwata , Tetsuya Watanabe , Takahiro Jingu , Hideki Fukushima
IPC分类号： G01B11/30 , G01N21/88 , G01N21/89 , G01N21/94 , G01N21/95 , G01N21/956 , H01L21/66
CPC分类号： G01N21/9501 , G01N21/8806 , G01N21/94 , G01N21/956 , G01N2021/8905 , G01N2021/9513
摘要： The present invention relates to a defect detection apparatus and method by which foreign particles and circuit pattern defects can be detected in distinction from the edge roughness of wiring on the substrate. The defect detection apparatus comprises an irradiation optical system includes: a beam expander; an optical member group formed by stacking multiple plate-like optical members each having a different optical path length at least in a beam-converging direction in order to admit the laser beam with the beam diameter extended by the beam expander and emit multiple slit-like beams each spatially reduced in coherence in the beam-converging direction; and beam-converging optical system by which the multiple slit-like beams each emitted from the optical member group is converged into a slit-like beam in the beam-converging direction and the slit-like beam is irradiated from an oblique direction onto the surface of the subject.
摘要翻译：本发明涉及一种缺陷检测装置和方法，通过该缺陷检测装置和方法可以检测与基板上的布线的边缘粗糙度相关的异物和电路图案缺陷。缺陷检测装置包括：照射光学系统，包括：扩束器; 光学构件组，其通过至少在束会聚方向上堆叠具有不同光程长度的多个板状光学构件而形成，以便允许具有由扩束器延伸的光束直径的激光束并且发射多个狭缝状光束在束收敛方向上的相干性在空间上减小; 以及束光聚光光学系统，其中从光学构件组发射的多个狭缝状光束在束会聚方向上会聚到狭缝状光束中，并且狭缝状光束从倾斜方向照射到表面上的主题。

8. 发明授权

US06539272B1 Electric device inspection method and electric device inspection system 有权
标题翻译：电气设备检查方法和电气设备检查系统
公开(公告)号：US06539272B1
公开(公告)日：2003-03-25
申请号：US09494939
申请日：2000-02-01
申请人： Makoto Ono , Hisafumi Iwata , Kazunori Nemoto
发明人： Makoto Ono , Hisafumi Iwata , Kazunori Nemoto
IPC分类号： G06F1900
CPC分类号： G01N21/956 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An analysis method includes one or more inspection steps for inspecting defects on a wafer, including an electrical inspection an step for inspecting electrical function of dies of the wafer, a determination step for determining whether each die is a good die or a bad die by using results obtained in the electrical inspection step, a calculation step for calculating the yield of dies without defects by using results obtained in the determination step, and an output step for outputting a result of the calculation step.
摘要翻译：分析方法包括检查晶片上的缺陷的一个或多个检查步骤，包括电检查用于检查晶片的管芯的电功能的步骤，用于通过使用用于确定每个管芯是否为良好管芯或坏死的确定步骤在电检查步骤中获得的结果，通过使用在确定步骤中获得的结果来计算没有缺陷的管芯的产量的计算步骤以及用于输出计算步骤的结果的输出步骤。

9. 发明授权

US5684565A Pattern detecting method, pattern detecting apparatus, projection exposing apparatus using the same and exposure system 失效
标题翻译：图案检测方法，图案检测装置，使用其的投影曝光装置和曝光系统
公开(公告)号：US5684565A
公开(公告)日：1997-11-04
申请号：US304586
申请日：1994-09-12
申请人： Yoshitada Oshida , Hisafumi Iwata , Yasuhiro Yoshitake , Minoru Yoshida , Yukihiro Shibata
发明人： Yoshitada Oshida , Hisafumi Iwata , Yasuhiro Yoshitake , Minoru Yoshida , Yukihiro Shibata
IPC分类号： G03F7/20 , G03F9/00 , H01L21/027 , G03B27/42 , G03B27/72
CPC分类号： G03F9/7065
摘要： A method and apparatus is disclosed for detecting a pattern image of each of a plurality of patterns on the surface of an object. Light emitted from either a light source including a wide wavelength or a light source including a plurality of monowavelengths is applied to the object. The object includes a layered structure having a plurality of layers, wherein at least a part of an uppermost layer of the object is optically transparent. Spectral illumination intensity characteristics of the light emitted from the light source is varied, depending on information about both the layered structure of the object, and a material of the object to obtain a desired spectral illumination intensity, and a pattern image of each of patterns is detected as either a one-dimensional or a two-dimensional image based on light reflected from the object.
摘要翻译：公开了一种用于检测物体表面上的多个图案中的每一个的图案图像的方法和装置。从包括宽波长的光源或包括多个单波长的光源发射的光被施加到物体。该物体包括具有多个层的分层结构，其中物体的最上层的至少一部分是光学透明的。根据关于物体的分层结构和物体的材料的信息，从光源发射的光的光谱照度强度特性是变化的，以获得期望的光谱照度，并且每个图案的图案图像是基于从对象反射的光被检测为一维或二维图像。

10. 发明授权

US5293538A Method and apparatus for the inspection of defects 失效
标题翻译：用于检查缺陷的方法和装置
公开(公告)号：US5293538A
公开(公告)日：1994-03-08
申请号：US705537
申请日：1991-05-24
申请人： Hisafumi Iwata , Yukio Matsuyama , Hitoshi Kubota
发明人： Hisafumi Iwata , Yukio Matsuyama , Hitoshi Kubota
IPC分类号： G01N21/88 , G01N21/95 , G01N21/956 , G01N21/47
CPC分类号： G01N21/8806 , G01N21/956 , G01N2021/8427 , G01N2021/8825
摘要： A defect inspection method and apparatus detect a defect which exists on the surface of a protection layer or a defect which exists in the protection layer and scatters the light on its surface, through the detection of the light which is derived from an illumination light and reflected on the protection layer surface and the light which is derived from a slit-formed illumination light and scattered in the area between the position where the light is incident to the transparent protection layer and the position where the surface of an element underneath the transparent protection layer is illuminated. An image process, which images two elements having the same appearance and compares the images, thereby to reduce inconsistent components emerging in portions other than a defective portion, is conducted through imaging under the bright field illumination and bright/dark field combined illumination, and the images are rendered the minimum filtering process based on 3-by-3 pixels and the defect judgement process based on comparison.
摘要翻译：缺陷检查方法和装置通过检测从照明光导出的光并检测出存在于保护层的表面上的缺陷或者存在于保护层中的缺陷并将光散射在其表面上在保护层表面上和由狭缝形成的照明光导出并散射在光入射到透明保护层的位置和透明保护层下面的元件表面之间的区域中的光被照亮。一种图像处理，其对具有相同外观的两个元件进行图像比较，从而减少在缺陷部分以外的部分中出现的不一致的成分，通过在明场照明和亮/暗场组合照明下的成像进行，并且基于3×3像素的图像被渲染为最小滤波处理，并且基于比较的缺陷判断处理。

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