会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method and apparatus for the inspection of defects
    • 用于检查缺陷的方法和装置
    • US5293538A
    • 1994-03-08
    • US705537
    • 1991-05-24
    • Hisafumi IwataYukio MatsuyamaHitoshi Kubota
    • Hisafumi IwataYukio MatsuyamaHitoshi Kubota
    • G01N21/88G01N21/95G01N21/956G01N21/47
    • G01N21/8806G01N21/956G01N2021/8427G01N2021/8825
    • A defect inspection method and apparatus detect a defect which exists on the surface of a protection layer or a defect which exists in the protection layer and scatters the light on its surface, through the detection of the light which is derived from an illumination light and reflected on the protection layer surface and the light which is derived from a slit-formed illumination light and scattered in the area between the position where the light is incident to the transparent protection layer and the position where the surface of an element underneath the transparent protection layer is illuminated. An image process, which images two elements having the same appearance and compares the images, thereby to reduce inconsistent components emerging in portions other than a defective portion, is conducted through imaging under the bright field illumination and bright/dark field combined illumination, and the images are rendered the minimum filtering process based on 3-by-3 pixels and the defect judgement process based on comparison.
    • 缺陷检查方法和装置通过检测从照明光导出的光并检测出存在于保护层的表面上的缺陷或者存在于保护层中的缺陷并将光散射在其表面上 在保护层表面上和由狭缝形成的照明光导出并散射在光入射到透明保护层的位置和透明保护层下面的元件表面之间的区域中的光 被照亮。 一种图像处理,其对具有相同外观的两个元件进行图像比较,从而减少在缺陷部分以外的部分中出现的不一致的成分,通过在明场照明和亮/暗场组合照明下的成像进行,并且 基于3×3像素的图像被渲染为最小滤波处理,并且基于比较的缺陷判断处理。
    • 2. 发明申请
    • COMMUNICATION SYSTEM AND COMMUNICATING METHOD
    • 通信系统和通信方法
    • US20120239772A1
    • 2012-09-20
    • US13514205
    • 2011-01-14
    • Hitoshi Kubota
    • Hitoshi Kubota
    • G06F15/16
    • H04L12/18H04W74/0816H04W74/085H04W84/18H04W88/04
    • A communication system includes a first terminal, a second terminal, and a third terminal. The first terminal transmits message data addressed to the third terminal to plural terminals. When the second terminal receives the message data and confirms that a destination thereof is not the second terminal, the second terminal transfers the received message data. When the third terminal receives the message data and confirms that the destination thereof is the third terminal, the third terminal transmits response data corresponding to the received message data to the first terminal. A priority for transmission of the response data is set higher than that of the transferred message data, and a period of time from reception of the message data until the transmission of the corresponding response data is shorter than a period of time from reception of the message data until the transfer of the message data.
    • 通信系统包括第一终端,第二终端和第三终端。 第一终端将寻址到第三终端的消息数据发送到多个终端。 当第二终端接收到消息数据并确认其目的地不是第二终端时,第二终端传送接收到的消息数据。 当第三终端接收到消息数据并确认其目的地是第三终端时,第三终端向第一终端发送与接收到的消息数据相对应的响应数据。 将响应数据的发送的优先级设置为高于传送的消息数据的优先级,并且从接收消息数据直到对应的响应数据的发送的时间段短于从接收到消息的时间段 数据直到传输消息数据。
    • 8. 发明授权
    • Manufacturing method of semiconductor substrate and method and apparatus for inspecting defects of patterns of an object to be inspected
    • 半导体基板的制造方法以及检查被检查体的图案的缺陷的方法和装置
    • US06263099B1
    • 2001-07-17
    • US09107432
    • 1998-06-30
    • Shunji MaedaYasuhiko NakayamaMinoru YoshidaHitoshi KubotaKenji Oka
    • Shunji MaedaYasuhiko NakayamaMinoru YoshidaHitoshi KubotaKenji Oka
    • G06K900
    • G01N21/8806G01N21/9501G01N21/956G01N21/95607G01N2021/95615G01N2201/0618G01N2201/0634
    • A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.
    • 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上,检查被检查物体上的微细图案,晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制,并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较,并且检测出显示不一致的图案的一部分作为缺陷,从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外,通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。
    • 9. 发明授权
    • Method of inspecting thin film transistor liquid crystal substrate and
apparatus therefor
    • 检查薄膜晶体管液晶基板的方法及其装置
    • US5309108A
    • 1994-05-03
    • US921583
    • 1992-07-30
    • Shunji MaedaHitoshi KubotaMakoto Ono
    • Shunji MaedaHitoshi KubotaMakoto Ono
    • G06T7/00G09G3/00G01R31/02G06K9/00
    • G09G3/006G06T7/001G06T2207/10048G06T2207/30121
    • The invention relates to a method of inspecting and correcting a thin film transistor liquid crystal substrate and an apparatus therefor, where a plurality of scan lines and signal lines are connected electrically in common at each one terminal side respectively, and an infrared image outside the pixel domain is detected after lapse of a prescribed time from the time point of applying voltage between the scan lines and the signal lines, and an infrared image outside the pixel domain is detected after lapse of a prescribed time from the time point of stopping the voltage application, and the scan lines and the signal lines relating to variation of the heating state are detected from difference or quotient between an infrared image at the voltage applying state and an infrared image at the stopping state of voltage application, thereby a pixel address with a shortcircuit defect occurring is specified. If an image part being equal to the set threshold value or more does not exist in the difference infrared image in the pixel address, a wiring pattern position in the pixel address is detected from a visible image of the pixel address, and this wiring pattern and one from a neighboring pixel address are compared to detect a short circuit defect which can be removed by laser.
    • 本发明涉及一种薄膜晶体管液晶基板的检查和校正方法及其装置,其中多个扫描线和信号线分别在每个一个端子侧共同电连接,并且在该像素之外的红外图像 在从施加扫描线和信号线之间的电压的时间点经过规定时间之后检测域,并且在从停止施加电压的时间点经过规定时间之后检测像素域外的红外图像 ,并且在电压施加状态下的红外图像与在施加电压的停止状态的红外图像之间的差或商检测与加热状态的变化相关的扫描线和信号线,从而具有短路的像素地址 指定缺陷发生。 如果像素地址中的差异红外图像中不存在等于设定阈值的图像部分,则从像素地址的可视图像检测像素地址中的布线图案位置,并且该布线图案和 比较来自相邻像素地址的一个,以检测可以通过激光去除的短路缺陷。
    • 10. 发明授权
    • Method of measuring three-dimensional postion of workpiece
    • 测量工件立体位置的方法
    • US5198876A
    • 1993-03-30
    • US791223
    • 1991-11-13
    • Takashi AnezakiHitoshi KubotaManabu Yamane
    • Takashi AnezakiHitoshi KubotaManabu Yamane
    • G01B11/00B25J9/16G01S17/06G05B19/408G06T1/00
    • B25J9/1697G01S17/06G05B19/4083
    • A method of measuring a three-dimensional position of a workpiece by using a laser measuring unit provided at a hand portion of an industrial robot, the laser measuring unit including an image recognition camera and first and second laser beam sources for emitting lateral and vertical slit beams, respectively, the method comprising the steps of: positioning the laser measuring unit such that the laser measuring unit confronts the workpiece; emitting the lateral and vertical slit beams towards the workpiece from the first and second laser beam sources, respectively; inputting the lateral and vertical slit beams on the workpiece, as first and second slit images, into the image recognition camera, respectively; detecting a first point of a maximum output of the lateral slit beam at an edge of the workpiece in the first slit image and a second point of a maximum output of the vertical slit beam at another edge of the workpiece in the second slit image; and calculating the three-dimensional position of the workpiece based on a first amount of deviation of the first point from a first preset reference point and a second amount of deviation of the second point from a second preset reference point.
    • 一种通过使用设置在工业机器人的手部的激光测量单元来测量工件的三维位置的方法,所述激光测量单元包括图像识别相机和用于发射横向和纵向狭缝的第一和第二激光束源 所述方法包括以下步骤:定位所述激光测量单元,使得所述激光测量单元面对所述工件; 分别从第一和第二激光束源向工件发射横向和纵向狭缝光束; 将作为第一和第二狭缝图像的工件上的横向和纵向狭缝光束分别输入到图像识别摄像机中; 检测所述第一狭缝图像中的所述工件的边缘处的横向狭缝光束的最大输出的第一点和所述第二狭缝图像中所述工件的另一边缘处的所述垂直狭缝光束的最大输出的第二点; 以及基于所述第一点与第一预设参考点的偏移的第一量和所述第二点与第二预设参考点的偏差的第二量来计算所述工件的三维位置。