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1. 发明申请

US20050195396A1 Inspection condition setting program, inspection device and inspection system 审中-公开
公开(公告)号：US20050195396A1
公开(公告)日：2005-09-08
申请号：US11066121
申请日：2005-02-24
申请人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
发明人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
IPC分类号： G01N21/956 , G01R31/303 , G06T1/00 , G06T7/00 , H01L21/00 , H01L21/66 , G01B11/00
CPC分类号： G01N21/9501 , G01N21/95684 , G01R31/2894 , H01L22/12 , H01L22/20
摘要： A program is provided for setting efficiently, and with precision, the inspection conditions of an inspection device that detects particles and deformed patterns in or on products such as semiconductor integrated circuits that are manufactured by simultaneously forming a plurality of products on a single substrate. In particular, the system achieves greater efficiency of the setting of cell comparison regions and the setting of non-inspection regions. Input processing of a product type code, input processing of chip size and configuration information, reading processing of circuit layout data, extraction processing of repeated pattern region coordinates, extraction processing of sparse region coordinates and circuit pattern condition registration processing are sequentially executed.

2. 发明授权

US06928375B2 Inspection condition setting program, inspection device and inspection system 失效
标题翻译：检验条件设定程序，检查装置和检查系统
公开(公告)号：US06928375B2
公开(公告)日：2005-08-09
申请号：US10411785
申请日：2003-04-10
申请人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
发明人： Makoto Ono , Yohei Asakawa , Hisafumi Iwata , Kanako Harada
IPC分类号： G01N21/956 , G01R31/303 , G06T1/00 , G06T7/00 , H01L21/00 , H01L21/66 , G06F19/00
CPC分类号： G01N21/9501 , G01N21/95684 , G01R31/2894 , H01L22/12 , H01L22/20
摘要： A program is provided for setting efficiently, and with precision, the inspection conditions of an inspection device that detects particles and deformed patterns in or on products such as semiconductor integrated circuits that are manufactured by simultaneously forming a plurality of products on a single substrate. In particular, the system achieves greater efficiency of the setting of cell comparison regions and the setting of non-inspection regions. Input processing of a product type code, input processing of chip size and configuration information, reading processing of circuit layout data, extraction processing of repeated pattern region coordinates, extraction processing of sparse region coordinates and circuit pattern condition registration processing are sequentially executed.
摘要翻译：提供了一种程序，用于精确地设置检测装置的检查条件，该检查装置检测在通过在单个基板上同时形成多个产品而制造的半导体集成电路等产品中或其上产生的变形图案。特别地，该系统实现了细胞比较区域的设置和非检查区域的设置的更高的效率。顺序地执行产品类型代码的输入处理，芯片尺寸和配置信息的输入处理，电路布局数据的读取处理，重复模式区域坐标的提取处理，稀疏区域坐标的提取处理和电路图案状态注册处理。

3. 发明授权

US06826735B2 Inspection data analysis program, defect inspection apparatus, defect inspection system and method for semiconductor device 失效
标题翻译：检验数据分析程序，缺陷检查装置，半导体装置的缺陷检查系统和方法
公开(公告)号：US06826735B2
公开(公告)日：2004-11-30
申请号：US10196146
申请日：2002-07-17
申请人： Makoto Ono , Hisafumi Iwata , Kanako Harada
发明人： Makoto Ono , Hisafumi Iwata , Kanako Harada
IPC分类号： G06F1750
CPC分类号： G01N21/95684 , G06T7/0002 , G06T7/62 , G06T2200/24 , G06T2207/30148
摘要： Inspection data output from an inspection apparatus is read, the inspection data containing at least one information piece of coordinate value information and size information of a particle or a pattern defect of an inspected object, and drawing data of a product of the inspected object is read. Information is extracted which is representative of a relation between at least one information piece of coordinated value information and size information of the particle or pattern defect of the inspected object in the read inspection data and the read drawing data input at said drawing data input step. The extracted information is compared with determination criterion information registered beforehand and it is determined whether each particle or pattern defect of the inspected object in the inspection data is a detection error or not.
摘要翻译：读取从检查装置输出的检查数据，读取包含检测对象的粒子或图案缺陷的坐标值信息和尺寸信息的至少一个信息的检查数据和被检查对象的乘积的绘制数据。提取信息，其代表在读取检查数据中的至少一个协调价值信息信息和被检查对象的粒子或图案缺陷的尺寸信息与在所述绘制数据输入步骤输入的读取绘制数据之间的关系。将提取的信息与预先登记的确定标准信息进行比较，并且确定检查数据中被检查对象的每个粒子或图案缺陷是否是检测错误。

4. 发明授权

US06611728B1 Inspection system and method for manufacturing electronic devices using the inspection system 有权
标题翻译：使用检查系统制造电子设备的检查系统和方法
公开(公告)号：US06611728B1
公开(公告)日：2003-08-26
申请号：US09389230
申请日：1999-09-03
申请人： Natsuyo Morioka , Hisafumi Iwata , Junko Konishi , Yoko Ikeda , Kazunori Nemoto , Makoto Ono , Yasuhiro Yoshitake
发明人： Natsuyo Morioka , Hisafumi Iwata , Junko Konishi , Yoko Ikeda , Kazunori Nemoto , Makoto Ono , Yasuhiro Yoshitake
IPC分类号： G06F1900
CPC分类号： G01N21/9501 , H01L22/12 , H01L22/20
摘要： An inspection system comprises an inspection machine for inspecting a work which is processed in one of the manufacturing processes of a manufacturing line and an analysis system for outputting an inspection history list obtained by making calculations from the inspected result. The inspection history list shows a matrix of first information as the inspection processes in which the work is inspected or the manufacturing processes corresponding to the inspection processes in which the work is inspected and second information as to the works inspected by the inspection machine.
摘要翻译：检查系统包括检查机器，用于检查在生产线的一个制造过程中处理的工件和用于输出通过从检查结果进行计算而获得的检查履历表的分析系统。检查历史列表显示作为检查工作的检查过程的第一信息矩阵或与检查工作相关的检查过程对应的制造过程以及由检查机检查的工件的第二信息。

5. 发明授权

US06539272B1 Electric device inspection method and electric device inspection system 有权
标题翻译：电气设备检查方法和电气设备检查系统
公开(公告)号：US06539272B1
公开(公告)日：2003-03-25
申请号：US09494939
申请日：2000-02-01
申请人： Makoto Ono , Hisafumi Iwata , Kazunori Nemoto
发明人： Makoto Ono , Hisafumi Iwata , Kazunori Nemoto
IPC分类号： G06F1900
CPC分类号： G01N21/956 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An analysis method includes one or more inspection steps for inspecting defects on a wafer, including an electrical inspection an step for inspecting electrical function of dies of the wafer, a determination step for determining whether each die is a good die or a bad die by using results obtained in the electrical inspection step, a calculation step for calculating the yield of dies without defects by using results obtained in the determination step, and an output step for outputting a result of the calculation step.
摘要翻译：分析方法包括检查晶片上的缺陷的一个或多个检查步骤，包括电检查用于检查晶片的管芯的电功能的步骤，用于通过使用用于确定每个管芯是否为良好管芯或坏死的确定步骤在电检查步骤中获得的结果，通过使用在确定步骤中获得的结果来计算没有缺陷的管芯的产量的计算步骤以及用于输出计算步骤的结果的输出步骤。

6. 发明授权

US06775817B2 Inspection system and semiconductor device manufacturing method 失效
标题翻译：检测系统和半导体器件制造方法
公开(公告)号：US06775817B2
公开(公告)日：2004-08-10
申请号：US10004168
申请日：2001-10-30
申请人： Makoto Ono , Hisafumi Iwata , Keiko Kirino
发明人： Makoto Ono , Hisafumi Iwata , Keiko Kirino
IPC分类号： G06F1750
CPC分类号： H01L21/67271 , G01N21/9501 , G01N21/956 , H01L22/20
摘要： A method and system are provided for analyzing defects having the potential to become electrical failures, during the inspection of particles and/or pattern defects of a wafer used in the manufacture of electronic devices such as semiconductor integrated circuits. Defect map data is processed along with failure probability data. Next, defect-dependent failure probability calculations are made to obtain the failure probability of each defect in the defect map data. That data is then used to prepare failure-probability-added defect map data. Further, a selection process of defects to be reviewed is used to reorder and filter defects from the failure-probability-added defect map data, thus selecting one or more defects for review.
摘要翻译：提供了一种方法和系统，用于在用于制造诸如半导体集成电路的电子器件的晶片的颗粒和/或图案缺陷的检查期间分析具有变为电气故障的可能性的缺陷。缺陷图数据与故障概率数据一起处理。接下来，进行与缺陷相关的故障概率计算，以获得缺陷图数据中的每个缺陷的故障概率。然后将该数据用于准备故障概率添加缺陷图数据。此外，使用要检查的缺陷的选择处理用于从故障概率添加缺陷图数据重新排序和过滤缺陷，从而选择一个或多个缺陷以供审查。

7. 发明授权

US06687633B2 Inspection system, inspection apparatus, inspection program, and production method of semiconductor devices 失效
标题翻译：检测系统，检验仪器，检验程序和半导体器件的生产方法
公开(公告)号：US06687633B2
公开(公告)日：2004-02-03
申请号：US10079518
申请日：2002-02-22
申请人： Makoto Ono , Hisafumi Iwata
发明人： Makoto Ono , Hisafumi Iwata
IPC分类号： G01N3700
CPC分类号： H01L21/67288
摘要： In the wafer production process of a semiconductor integrated circuit, an inspection system and an inspection apparatus that convert and output a yield loss at high accuracy from the result of a defect inspection, such as a dark-field inspection and a bright-field inspection without waiting for the result of the final probing test. Defect map data read processing and kill ratio computation data read processing are performed. Subsequently, kill ratio computation processing every defect computes a kill ratio every defect using defect map data and kill ratio computation data. Subsequently, kill ratio computation processing every chip computes a kill ratio every LSI chip using the kill ratio every defect. Subsequently, yield loss computation processing computes a yield loss of the defect map data using the kill ratio every chip and yield loss output processing outputs the computation result.
摘要翻译：在半导体集成电路的晶片生产过程中，检查系统和检查装置从缺陷检查的结果（例如暗场检查和明场检查）转换并输出高精度的屈服损失而没有等待最终探测测试的结果。执行缺陷地图数据读取处理和杀死比计算数据读取处理。随后，每个缺陷的杀伤比计算处理使用缺陷图数据和杀死比计算数据计算每个缺陷的杀伤比。随后，每个芯片的杀死率计算处理使用每个缺陷的杀死率来计算每个LSI芯片的杀死率。随后，屈服损失计算处理使用每个芯片的杀死率来计算缺陷图数据的屈服损失，并且屈服损失输出处理输出计算结果。

8. 发明授权

US07421357B2 Inspection data analysis program, inspection tools, review apparatus and yield analysis apparatus 有权
标题翻译：检验数据分析程序，检验工具，检查仪器和产量分析仪器
公开(公告)号：US07421357B2
公开(公告)日：2008-09-02
申请号：US10887827
申请日：2004-07-12
申请人： Makoto Ono , Yohei Asakawa
发明人： Makoto Ono , Yohei Asakawa
IPC分类号： G06F19/00 , G01R31/26
CPC分类号： H01L22/20 , G06T7/0004 , G06T2207/30148 , Y02P90/86
摘要： An operation unit executes a process for calling to a main memory first data representative of a result of equipment QC applied to a production unit. A process for reading out to the main memory an amount of change in failure in accordance with particle numbers calculated for individual defect sizes from second inspection data representative of a result of equipment QC is applied to the production unit. Electrical test data of a product processed by the production unit during a period inclusive of the time that the second inspection is carried outis also read to the main memory. A process is also executed for using the amount of change in failure in accordance with the calculated particle numbers and the particle numbers for individual sizes determined from the first inspection data to determine an impact on the product by particles generated in the production equipment when the first inspection data is detected.
摘要翻译：操作单元执行用于向主存储器调用代表应用于生产单元的设备QC的结果的第一数据的处理。对于生产单元，将向根据第二检查数据计算出的各个缺陷尺寸的粒子数量的故障量的变化量写入主存储器的处理被应用于生产单元。在包括执行第二次检查的时间段期间由生产单元处理的产品的电气测试数据也被读取到主存储器。还执行一个处理，以根据从第一检查数据确定的计算的粒子数和个体大小的粒子数量来使用故障变化量，以确定在生产设备中产生的颗粒对产品的影响时，当第一检测数据。

9. 发明申请

US20050021268A1 Inspection data analysis program, inspection tools, review apparatus and yield analysis apparatus 有权
标题翻译：检验数据分析程序，检验工具，检查仪器和产量分析仪器
公开(公告)号：US20050021268A1
公开(公告)日：2005-01-27
申请号：US10887827
申请日：2004-07-12
申请人： Makoto Ono , Yohei Asakawa
发明人： Makoto Ono , Yohei Asakawa
IPC分类号： G05B19/418 , G06T7/00 , H01L21/02 , H01L21/66 , G06F19/00
CPC分类号： H01L22/20 , G06T7/0004 , G06T2207/30148 , Y02P90/86
摘要： An operation unit executes a process for calling to a main memory first data representative of a result of equipment QC applied to a production unit, a process for reading out to the main memory an amount of changing of failure number in accordance with particle numbers calculated for individual defect sizes from second inspection data representative of a result of equipment QC applied to the production unit and electrical test data of a product processed by the production unit during a period inclusive of time that the second inspection is carried out, and a process for using the amount of changing of failure number in accordance with the calculated particle numbers and the particle numbers for individual sizes determined from the first inspection data to determine an impact on the product by particles generated in the production equipment at time that the first inspection data is detected.
摘要翻译：操作单元执行对主存储器的第一数据的调用处理，第一数据表示应用于生产单元的设备QC的结果，根据对于主存储器计算的粒子数量，向主存储器读出故障数量的变化量的处理来自表示生产单元的设备QC的结果的第二检查数据和由生产单元在包括进行第二次检查的时间段内处理的产品的电气测试数据的单独缺陷尺寸以及使用根据计算出的粒子数和根据第一检查数据确定的个体大小的粒子数量来改变故障次数的量，以确定在检测到第一检查数据时在生产设备中产生的颗粒对产品的影响。

10. 发明申请

US20130338189A9 CRYSTAL OF ANTI-BACTERIAL COMPOUND 失效
标题翻译：抗菌化合物的晶体
公开(公告)号：US20130338189A9
公开(公告)日：2013-12-19
申请号：US13814534
申请日：2011-08-05
申请人： Makoto Ono
发明人： Makoto Ono
IPC分类号： A61K31/4709 , C07D401/02
CPC分类号： A61K31/4709 , C07D401/04
摘要： It is intended to provide a salt of a compound and crystals thereof useful as a therapeutic and/or preventive agent for infectious diseases which has wide and excellent antibacterial activity and has excellent safety.[Solution]The present invention provides the hydrochloride of 7-[(1R,5S)-1-amino-5-fluoro-3-azabicyclo[3.3.0]octan-3-yl]-6-fluoro-1-[(1R,2S)-2-fluorocyclopropan-1-yl]-1,4-dihydro-8-methyl-4-oxoquinoline-3-carboxylic acid and crystals thereof, as a novel salt form of the compound and crystals thereof.
摘要翻译：旨在提供具有广泛和优异的抗菌活性并具有优异安全性的用作感染性疾病的治疗和/或预防剂的化合物及其晶体的盐。 [溶液]本发明提供7 - [（1R，5S）-1-氨基-5-氟-3-氮杂双环[3.3.0]辛-3-基] -6-氟-1 - [（ 1R，2S）-2-氟环丙烷-1-基] -1,4-二氢-8-甲基-4-氧代喹啉-3-羧酸及其晶体，作为化合物的新型盐及其晶体。

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