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1. 发明授权

US08814563B2 Substrate heating apparatus and method and coating and developing system 有权
标题翻译：基板加热装置及方法及涂层开发系统
公开(公告)号：US08814563B2
公开(公告)日：2014-08-26
申请号：US12818202
申请日：2010-06-18
申请人： Shinichi Hayashi , Hiroaki Inadomi
发明人： Shinichi Hayashi , Hiroaki Inadomi
IPC分类号： F27D15/02
CPC分类号： F27D5/0037 , F27B5/04 , F27B17/0025 , G03F7/162 , G03F7/3021 , H01L21/67109
摘要： Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two positions. A heat-radiating fin structure is connected to the cooling plate to move together with the cooling plate. The fin structure is thermally connected to the cooling plate via heat pipes. A suction port is arranged so as to locate adjacent to the fin structure when the cooling plate is in the home position. The fin structure is cooled by a gas passing therethrough before flown into the suction port, whereby the cooling plate is cooled through heat transfer from the cooling plate to the fin structure through the heat pipes.
摘要翻译：公开了一种基板加热装置，其包括加热基板的加热板和支撑基板并在第一位置（原位置）和热板上方的第二位置之间移动以在两个位置之间转移晶片的冷却板。散热片结构与冷却板连接，与冷却板一起移动。翅片结构通过热管热连接到冷却板。当冷却板处于初始位置时，设置一个吸入口以便邻近翅片结构定位。在流入吸入口之前，翅片结构被通过的气体冷却，由冷却板通过热管从冷却板传递到翅片结构而被冷却。

2. 发明授权

US08080765B2 Apparatus and method for heating substrate and coating and developing system 有权
标题翻译：用于加热基材和涂层和显影系统的装置和方法
公开(公告)号：US08080765B2
公开(公告)日：2011-12-20
申请号：US12880784
申请日：2010-09-13
申请人： Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
发明人： Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
IPC分类号： F27B5/14 , C23C16/00
CPC分类号： F27B5/04 , F27B17/0025 , F27D3/0084 , H01L21/67109
摘要： A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
摘要翻译：基板加热装置包括布置在热板上方的顶板，使得在热板和顶板之间形成垂直空间。顶板具有用作真空绝热层的真空内部室，其抑制从面对热板的顶板的第一表面到与第一表面相对的顶板的第二表面的热传递。当加热基板时，产生流过热板和顶板之间的空气的气流。

3. 发明申请

US20100255204A1 SUBSTRATE HEATING APPARATUS AND METHOD AND COATING AND DEVELOPING SYSTEM 有权
标题翻译：基板加热装置及方法与涂装与开发系统
公开(公告)号：US20100255204A1
公开(公告)日：2010-10-07
申请号：US12818202
申请日：2010-06-18
申请人： Shinichi HAYASHI , Hiroaki INADOMI
发明人： Shinichi HAYASHI , Hiroaki INADOMI
IPC分类号： B05D3/02
CPC分类号： F27D5/0037 , F27B5/04 , F27B17/0025 , G03F7/162 , G03F7/3021 , H01L21/67109
摘要： Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two positions. A heat-radiating fin structure is connected to the cooling plate to move together with the cooling plate. The fin structure is thermally connected to the cooling plate via heat pipes. A suction port is arranged so as to locate adjacent to the fin structure when the cooling plate is in the home position. The fin structure is cooled by a gas passing therethrough before flown into the suction port, whereby the cooling plate is cooled through heat transfer from the cooling plate to the fin structure through the heat pipes.
摘要翻译：公开了一种基板加热装置，其包括加热基板的加热板和支撑基板并在第一位置（原位置）和热板上方的第二位置之间移动以在两个位置之间转移晶片的冷却板。散热片结构与冷却板连接，与冷却板一起移动。翅片结构通过热管热连接到冷却板。当冷却板处于初始位置时，设置一个吸入口以便邻近翅片结构定位。在流入吸入口之前，翅片结构被通过的气体冷却，由冷却板通过热管从冷却板传递到翅片结构而被冷却。

4. 发明授权

US08237092B2 Apparatus and method for heating substrate and coating and developing system 有权
标题翻译：用于加热基材和涂层和显影系统的装置和方法
公开(公告)号：US08237092B2
公开(公告)日：2012-08-07
申请号：US12880716
申请日：2010-09-13
申请人： Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
发明人： Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
IPC分类号： F27B5/14 , C23C16/00
CPC分类号： F27B5/04 , F27B17/0025 , F27D3/0084 , H01L21/67109
摘要： A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
摘要翻译：基板加热装置包括布置在热板上方的顶板，使得在热板和顶板之间形成垂直空间。顶板具有用作真空绝热层的真空内部室，其抑制从面对热板的顶板的第一表面到与第一表面相对的顶板的第二表面的热传递。当加热基板时，产生流过热板和顶板之间的空气的气流。

5. 发明授权

US07780438B2 Substrate heating apparatus and method and coating and developing system 有权
标题翻译：基板加热装置及方法及涂层开发系统
公开(公告)号：US07780438B2
公开(公告)日：2010-08-24
申请号：US11416094
申请日：2006-05-03
申请人： Shinichi Hayashi , Hiroaki Inadomi
发明人： Shinichi Hayashi , Hiroaki Inadomi
IPC分类号： F27D15/02
CPC分类号： F27D5/0037 , F27B5/04 , F27B17/0025 , G03F7/162 , G03F7/3021 , H01L21/67109
摘要： Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two positions. A heat-radiating fin structure is connected to the cooling plate to move together with the cooling plate. The fin structure is thermally connected to the cooling plate via heat pipes. A suction port is arranged so as to locate adjacent to the fin structure when the cooling plate is in the home position. The fin structure is cooled by a gas passing therethrough before flown into the suction port, whereby the cooling plate is cooled through heat transfer from the cooling plate to the fin structure through the heat pipes.
摘要翻译：公开了一种基板加热装置，其包括加热基板的加热板和支撑基板并在第一位置（原位置）和热板上方的第二位置之间移动以在两个位置之间转移晶片的冷却板。散热片结构与冷却板连接，与冷却板一起移动。翅片结构通过热管热连接到冷却板。当冷却板处于初始位置时，设置一个吸入口以便邻近翅片结构定位。在流入吸入口之前，翅片结构被通过的气体冷却，由冷却板通过热管从冷却板传递到翅片结构而被冷却。

6. 发明申请

US20070160947A1 HEATING DEVICE AND HEATING METHOD 失效
标题翻译：加热装置和加热方法
公开(公告)号：US20070160947A1
公开(公告)日：2007-07-12
申请号：US11617319
申请日：2006-12-28
申请人： Masami AKIMOTO , Shinichi Hayashi , Naruaki Ilda , Hiroaki Inadomi
发明人： Masami AKIMOTO , Shinichi Hayashi , Naruaki Ilda , Hiroaki Inadomi
IPC分类号： F27D15/02
CPC分类号： F27B17/0025 , F27B5/04 , F27D5/0037 , F27D15/02 , H01L21/67109 , H01L21/67748 , H01L21/67784 , Y10S414/139
摘要： A heating device provided with a cooling plate and a heating plate is formed in a low height, and floats a substrate above the cooling plate and the heating plate and moves the substrate horizontally between the cooling plate and the heating plate by the pressure of a gas. A heating device 2 includes a cooling plate 3 provided with flotation gas spouting ports 3a, and a heating plate provided with flotation gas spouting ports. The flotation gas spouting ports 3a and 3b are arranged along a wafer moving passage and are formed so as to spout the gas obliquely upward toward a first end of the wafer moving passage on the side of the cooling plate. A pushing member 51 is brought into contact with a back part of a wafer W with respect to a direction in which the wafer W is moved to move the wafer W in a direction toward the heating plate 6 opposite a direction in which the flotation gas is spouted. The pushing member 51 is brought into contact with a back part of a wafer W with respect to a direction in which the wafer W is moved to move the wafer W in a direction toward the cooling plate 3 in which the flotation gas is spouted.
摘要翻译：设置有冷却板和加热板的加热装置形成为低高度，并且浮动冷却板和加热板上方的基板，并且通过气体的压力将基板水平地移动到冷却板和加热板之间。加热装置2包括具有浮选气体吐出口3a的冷却板3和设置有浮选气体吐出口的加热板。浮选气体喷出口3a和3b沿着晶片移动通道布置，并且形成为在冷却板侧朝向晶片移动通道的第一端倾斜向上喷出气体。推动构件51相对于晶片W移动的方向与晶片W的后部接触，以使晶片W朝向加热板6的方向移动，该方向与浮选气体的方向相反喷出推动构件51相对于晶片W移动的方向与晶片W的后部接触，以朝向其中喷出浮选气体的冷却板3的方向移动晶片W.

7. 发明申请

US20060234178A1 Apparatus and method for heating substrate and coating and developing system 有权
标题翻译：用于加热基材和涂层和显影系统的装置和方法
公开(公告)号：US20060234178A1
公开(公告)日：2006-10-19
申请号：US11205150
申请日：2005-08-17
申请人： Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
发明人： Shinichi Hayashi , Tetsuo Fukuoka , Tetsuya Oda , Hiroaki Inadomi
IPC分类号： F27B5/04
CPC分类号： F27B5/04 , F27B17/0025 , F27D3/0084 , H01L21/67109
摘要： A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
摘要翻译：基板加热装置包括布置在热板上方的顶板，使得在热板和顶板之间形成垂直空间。顶板具有用作真空绝热层的真空内部室，其抑制从面对热板的顶板的第一表面到与第一表面相对的顶板的第二表面的热传递。当加热基板时，产生流过热板和顶板之间的空气的气流。

8. 发明授权

US09496158B2 Processing apparatus 有权
标题翻译：处理装置
公开(公告)号：US09496158B2
公开(公告)日：2016-11-15
申请号：US13447519
申请日：2012-04-16
申请人： Mikio Nakashima , Hiroaki Inadomi , Satoshi Okamura
发明人： Mikio Nakashima , Hiroaki Inadomi , Satoshi Okamura
IPC分类号： H01L21/67
CPC分类号： H01L21/67126 , H01L21/6719
摘要： Provided is a processing apparatus for performing a processing of a substrate to be processed using a high-pressure fluid to prevent the generation of particles and ensure airtightness in the processing container. A sealing member is installed to surround a carrying port of the processing chamber, the carrying port is closed by the cover, and the cover is restricted from retreating by the pressure in the processing chamber by a lock plate, thereby processing the wafer in the processing chamber using the high-pressure fluid. Since the sealing member is pressurized by the internal atmosphere of the processing chamber to be pressed toward the cover during the drying process, a gap between the cover and the processing chamber may be airtightly closed. Since the sealing member does not slide with respect to the processing chamber or the cover, the generation of particles is suppressed.
摘要翻译：提供了一种处理装置，用于使用高压流体进行处理的基板的处理，以防止产生颗粒并确保处理容器中的气密性。安装密封构件以围绕处理室的承载端口，承载口被盖封闭，并且通过锁定板限制盖被处理室中的压力退回，从而在处理中处理晶片使用高压流体。由于密封构件在干燥过程中被处理室的内部气氛加压而被压向盖，因此盖和处理室之间的间隙可以是气密的。由于密封构件相对于处理室或盖不滑动，因此抑制了颗粒的产生。

9. 发明授权

US08567417B2 Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method 失效
标题翻译：超声波清洗装置，超声波清洗方法和存储用于执行超声波清洗方法的计算机程序的存储介质
公开(公告)号：US08567417B2
公开(公告)日：2013-10-29
申请号：US12896029
申请日：2010-10-01
申请人： Yuji Kamikawa , Hiroaki Inadomi , Hideyuki Yamamoto , Hiroshi Komiya , Koji Egashira
发明人： Yuji Kamikawa , Hiroaki Inadomi , Hideyuki Yamamoto , Hiroshi Komiya , Koji Egashira
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , B08B3/048 , H01L21/67057 , H01L21/67313 , H01L21/67757
摘要： An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object.
摘要翻译：一种超声波清洗装置，包括：清洗槽，用于储存清洗液; 用于插入到清洁槽中的被处理物体的保持器，保持被处理物体并将物体浸入清洗液中的保持器; 设置在清洗槽底部的振动器; 以及配置成使振动器超声波振动的超声波振荡器。在清洗槽中设置有用于保持物体的侧面保持构件。保持器构造成由驱动装置横向移动。所述控制装置被构造成控制所述驱动装置，使得所述保持器在所述物体被所述侧向保持构件保持之后横向移动，并且所述控制装置被配置为控制所述超声波振荡器，使得所述振动器被制成超声波振动来自振动器的超声波振动传播到物体。

10. 发明申请

US20110079240A1 ULTRASONIC CLEANING APPARATUS, ULTRASONIC CLEANING METHOD, AND STORAGE MEDIUM STORING COMPUTER PROGRAM FOR EXECUTING ULTRASONIC CLEANING METHOD 失效
标题翻译：超声波清洗装置，超声波清洗方法和存储中央存储计算机程序，用于执行超声波清洗方法
公开(公告)号：US20110079240A1
公开(公告)日：2011-04-07
申请号：US12896029
申请日：2010-10-01
申请人： Yuji KAMIKAWA , Hiroaki Inadomi , Hideyuki Yamamoto , Hiroshi Komiya , Koji Egashira
发明人： Yuji KAMIKAWA , Hiroaki Inadomi , Hideyuki Yamamoto , Hiroshi Komiya , Koji Egashira
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , B08B3/048 , H01L21/67057 , H01L21/67313 , H01L21/67757
摘要： An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object.
摘要翻译：一种超声波清洗装置，包括：清洗槽，用于储存清洗液; 用于插入到清洁槽中的被处理物体的保持器，保持被处理物体并将物体浸入清洗液中的保持器; 设置在清洗槽底部的振动器; 以及配置成使振动器超声波振动的超声波振荡器。在清洗槽中设置有用于保持物体的侧面保持构件。保持器构造成由驱动装置横向移动。所述控制装置被构造成控制所述驱动装置，使得所述保持器在所述物体被所述侧向保持构件保持之后横向移动，并且所述控制装置被配置为控制所述超声波振荡器，使得所述振动器被制成超声波振动来自振动器的超声波振动传播到物体。

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