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1. 发明申请

US20100326351A1 APPARATUS AND METHOD FOR HEATING SUBSTRATE AND COATING AND DEVELOPING SYSTEM 有权
标题翻译：用于加热底物和涂料和发展系统的装置和方法
公开(公告)号：US20100326351A1
公开(公告)日：2010-12-30
申请号：US12880784
申请日：2010-09-13
申请人： Shinichi HAYASHI , Tetsuo FUKUOKA , Tetsuya ODA , Hiroaki INADOMI
发明人： Shinichi HAYASHI , Tetsuo FUKUOKA , Tetsuya ODA , Hiroaki INADOMI
IPC分类号： B05C11/00 , B05C21/00
CPC分类号： F27B5/04 , F27B17/0025 , F27D3/0084 , H01L21/67109
摘要： A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.
摘要翻译：基板加热装置包括布置在热板上方的顶板，使得在热板和顶板之间形成垂直空间。顶板具有用作真空绝热层的真空内部室，其抑制从面对热板的顶板的第一表面到与第一表面相对的顶板的第二表面的热传递。当加热基板时，产生流过热板和顶板之间的空气的气流。

2. 发明申请

US20100255204A1 SUBSTRATE HEATING APPARATUS AND METHOD AND COATING AND DEVELOPING SYSTEM 有权
标题翻译：基板加热装置及方法与涂装与开发系统
公开(公告)号：US20100255204A1
公开(公告)日：2010-10-07
申请号：US12818202
申请日：2010-06-18
申请人： Shinichi HAYASHI , Hiroaki INADOMI
发明人： Shinichi HAYASHI , Hiroaki INADOMI
IPC分类号： B05D3/02
CPC分类号： F27D5/0037 , F27B5/04 , F27B17/0025 , G03F7/162 , G03F7/3021 , H01L21/67109
摘要： Disclosed is a substrate heating apparatus including a hot plate that heats a substrate, and a cooling plate that supports the substrate and moves between a first position (home position) and the second position above the hot plate to transfer wafers between the two positions. A heat-radiating fin structure is connected to the cooling plate to move together with the cooling plate. The fin structure is thermally connected to the cooling plate via heat pipes. A suction port is arranged so as to locate adjacent to the fin structure when the cooling plate is in the home position. The fin structure is cooled by a gas passing therethrough before flown into the suction port, whereby the cooling plate is cooled through heat transfer from the cooling plate to the fin structure through the heat pipes.
摘要翻译：公开了一种基板加热装置，其包括加热基板的加热板和支撑基板并在第一位置（原位置）和热板上方的第二位置之间移动以在两个位置之间转移晶片的冷却板。散热片结构与冷却板连接，与冷却板一起移动。翅片结构通过热管热连接到冷却板。当冷却板处于初始位置时，设置一个吸入口以便邻近翅片结构定位。在流入吸入口之前，翅片结构被通过的气体冷却，由冷却板通过热管从冷却板传递到翅片结构而被冷却。

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