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    • 8. 发明授权
    • Substrate treating method for treating substrates with treating liquids
    • 用处理液处理基材的基板处理方法
    • US09437464B2
    • 2016-09-06
    • US14148324
    • 2014-01-06
    • DAINIPPON SCREEN MFG. CO., LTD.
    • Toyohide Hayashi
    • B08B7/04H01L21/67B08B3/08B08B3/04
    • H01L21/67023B08B3/048B08B3/08H01L21/67028H01L21/67051H01L21/67057H01L21/67253
    • A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates and placing the substrates in a treating position inside the treating tank, a first and a second treating liquid supply device, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid, is supplied into the treating tank, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid, and then controlling the second treating liquid supply device to replace the first treating liquid stored in the treating tank with the second treating liquid, and controlling the temperature control device to maintain the second treating liquid in the same said temperature range.
    • 一种用处理液处理基材的方法,使用处理槽储存处理液,保持机构用于保持基板并将基板放置在处理槽内的处理位置,第一和第二处理液供应装置, 温度控制装置和控制装置。 将第一处理液体供给到处理槽中,然后将比第一处理液低的表面张力低沸点的第二处理液供给到处理槽中,放置在高于第一处理液的沸点的温度范围内 处理液体并且低于第二处理液的沸点,然后控制第二处理液体供给装置以用第二处理液替换存储在处理槽中的第一处理液,并且控制温度控制装置保持第二处理 液体在相同的温度范围内。