会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Two-chip co-design and co-optimization in three-dimensional integrated circuit net assignment
    • 双芯片协同设计和协同优化三维集成电路网络分配
    • US08392870B2
    • 2013-03-05
    • US13019280
    • 2011-02-01
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • G06F17/50
    • G06F17/505G06F2217/86
    • A method of generating optimized input/output (IO) pair and inter-chip connection combinations for two chips is described. In this method, first and second designs for two chips can be specified. Then inter-chip signals based on the first and second designs can be specified. IO pairs for the first and second chips can be determined based on the inter-chip signals. At this point, electrical contacts between micro-bumps (MBs) of the first and second chips can be formed. Inter-chip paths with through-silicon-vias (TSVs) and MBs of the first and second chips can also be formed. At this point, the costs of assigning the IO pairs to the inter-chip paths can be determined. A cost matrix can be built based on these costs. A bipartite matching algorithm can be applied to the cost matrix to determine the optimized IO pair and inter-chip path combinations.
    • 描述了为两个芯片生成优化的输入/输出(IO)对和芯片间连接组合的方法。 在该方法中,可以指定用于两个芯片的第一和第二设计。 那么可以指定基于第一和第二设计的片间信号。 可以基于芯片间信号来确定用于第一和第二芯片的IO对。 此时,可以形成第一和第二芯片的微凸块(MB)之间的电接触。 还可以形成具有第一和第二芯片的通硅通孔(TSV)和MB的芯片间路径。 此时,可以确定将IO对分配给芯片间路径的成本。 可以基于这些成本构建成本矩阵。 二分法匹配算法可以应用于成本矩阵,以确定优化的IO对和芯片间路径组合。
    • 6. 发明申请
    • Two-Chip Co-Design And Co-Optimization In Three-Dimensional Integrated Circuit Net Assignment
    • 三维集成电路网络分配中的双芯片协同设计与协同优化
    • US20120198409A1
    • 2012-08-02
    • US13019280
    • 2011-02-01
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • Yifan ZhangGary K. YeapYonghua LiaoDalei Wang
    • G06F17/50
    • G06F17/505G06F2217/86
    • A method of generating optimized input/output (IO) pair and inter-chip connection combinations for two chips is described. In this method, first and second designs for two chips can be specified. Then inter-chip signals based on the first and second designs can be specified. IO pairs for the first and second chips can be determined based on the inter-chip signals. At this point, electrical contacts between micro-bumps (MBs) of the first and second chips can be formed. Inter-chip paths with through-silicon-vias (TSVs) and MBs of the first and second chips can also be formed. At this point, the costs of assigning the IO pairs to the inter-chip paths can be determined. A cost matrix can be built based on these costs. A bipartite matching algorithm can be applied to the cost matrix to determine the optimized IO pair and inter-chip path combinations.
    • 描述了为两个芯片生成优化的输入/输出(IO)对和芯片间连接组合的方法。 在该方法中,可以指定用于两个芯片的第一和第二设计。 那么可以指定基于第一和第二设计的片间信号。 可以基于芯片间信号来确定用于第一和第二芯片的IO对。 此时,可以形成第一和第二芯片的微凸块(MB)之间的电接触。 还可以形成具有第一和第二芯片的通硅通孔(TSV)和MB的芯片间路径。 此时,可以确定将IO对分配给芯片间路径的成本。 可以基于这些成本构建成本矩阵。 二分法匹配算法可以应用于成本矩阵,以确定优化的IO对和芯片间路径组合。