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1. 发明申请

US20150370244A1 APPARATUS AND METHOD OF USING AN IMAGING DEVICE FOR ADJUSTMENT OF AT LEAST ONE HANDLING DEVICE FOR HANDLING SEMICONDUCTOR COMPONENTS 有权
标题翻译：用于调整至少一个处理器件的成像装置的装置和方法，用于处理半导体元件
公开(公告)号：US20150370244A1
公开(公告)日：2015-12-24
申请号：US14311856
申请日：2014-06-23
申请人： Hing Suen SIU , Yu Sze CHEUNG , Chi Wah CHENG , Chung Yan LAU
发明人： Hing Suen SIU , Yu Sze CHEUNG , Chi Wah CHENG , Chung Yan LAU
IPC分类号： G05B19/418
CPC分类号： G05B19/4182 , G05B2219/39106 , G05B2219/40554 , G05B2219/45031 , G05B2219/45054 , Y02P90/083
摘要： Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.
摘要翻译：公开了一种处理电子部件的装置。该装置包括：i）旋转装置和围绕旋转装置周向布置的多个拾取头，每个拾取头可操作以保持电子部件; ii）位置确定装置，用于确定由各个拾取头保持的电子部件的布置; iii）布置在由位置确定装置确定的指示电子部件的布置的位置的基准标记; iv）相对于基准标记布置的第一成像装置; 以及v）用于处理电子部件的至少一个处理装置。具体地，第一成像装置可操作以捕获包括基准标记和至少一个处理装置的至少一个图像，使得至少一个处理装置的位置是可调节的，以使至少一个处理装置相对于基于从由第一成像装置拍摄的至少一个图像得出的基准标记和至少一个处理装置之间的偏移，电子部件的布置。还公开了一种调节用于处理电子部件的装置的至少一个处理装置的位置的方法。

2. 发明授权

US09218995B2 Transfer apparatus for transferring electronic devices and changing their orientations 有权
标题翻译：用于传送电子设备和改变其方向的传送设备
公开(公告)号：US09218995B2
公开(公告)日：2015-12-22
申请号：US14258463
申请日：2014-04-22
申请人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
发明人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
IPC分类号： B65G47/84 , H01L21/677 , H01L21/67
CPC分类号： H01L21/67718 , H01L21/67132
摘要： A transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.
摘要翻译：一种用于将电子设备从晶片传送到测试处理器的传送设备。传送装置包括：i）可围绕轴线旋转的旋转装置; 以及ii）多个保持器，其构造成保持用于从晶片转移到测试处理器的电子设备。多个保持器联接到旋转装置并且可从旋转装置延伸以从晶片拾取电子装置。具体地说，多个保持器周向地布置并相对于旋转装置的轴线倾斜，以便将晶片上的电子设备的取向改变到测试处理器上的电子设备的期望取向。

3. 发明申请

US20150111366A1 SINGULATION APPARATUS AND METHOD 有权
标题翻译：单机设备及方法
公开(公告)号：US20150111366A1
公开(公告)日：2015-04-23
申请号：US14058396
申请日：2013-10-21
申请人： Chi Wah CHENG , Eric Lap Kei CHOW , Joseph Hoi Shuen TANG , Chun Kit LIU
发明人： Chi Wah CHENG , Eric Lap Kei CHOW , Joseph Hoi Shuen TANG , Chun Kit LIU
IPC分类号： H01L21/67 , H01L21/687 , B28D5/00 , H01L21/78
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , H01L21/68764
摘要： Disclosed is a singulation apparatus, comprising: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being for cutting the workpiece. A singulation method is also disclosed.
摘要翻译：公开了一种切割装置，包括：至少一个卡盘站，工件可固定到该夹持站上，所述至少一个卡盘站构造成沿着进给方向移动; 在所述至少一个卡盘站上方延伸的桥，所述桥具有与所述第一侧相对的第一侧和第二侧; 第一切割装置构件，其安装到所述桥上并且可沿着所述第一侧横向于所述进给方向独立地移动; 以及第二切割装置构件，其安装到所述桥上并且可沿所述第二侧横向于所述进给方向独立地移动，所述第一和第二切割装置用于切割所述工件。还公开了一种分割方法。

4. 发明授权

US08967368B2 Apparatus for processing electronic devices 有权
标题翻译：电子设备处理装置
公开(公告)号：US08967368B2
公开(公告)日：2015-03-03
申请号：US14047143
申请日：2013-10-07
申请人： Chi Wah Cheng , Kai Fung Lau
发明人： Chi Wah Cheng , Kai Fung Lau
IPC分类号： B65G29/00 , B65G47/84 , H01L21/677
CPC分类号： B65G29/00 , B65G47/846 , H01L21/677 , H01L21/67721
摘要： An apparatus for processing electronic devices includes a rotary turret having first device concentric around the rotary turret, which transfer the electronic devices; a rotary wheel having second device holders concentric around the rotary wheel, which receive the electronic devices and a processing device to process the electronic devices. The rotary turret rotates the first device holders along a first circular path, and the rotary wheel rotates the second device holders along a second circular path. The first axis of the rotary turret is perpendicular to the second axis of the rotary wheel, and that a projection of the second circular path of the second device holders in a direction perpendicular to the second axis of the rotary wheel onto the first circular path of the first device holders defines a line from the inside to the outside of the first circular path of the first device holders.
摘要翻译：一种用于处理电子设备的设备包括：旋转转台，其具有围绕旋转转台同心的第一设备，其传送电子设备; 旋转轮具有围绕旋转轮同心的第二装置保持器，其接收电子装置和处理装置以处理电子装置。旋转转台沿着第一圆形路径旋转第一装置保持器，并且旋转轮沿着第二圆形路径旋转第二装置保持器。旋转转台的第一轴线垂直于旋转轮的第二轴线，并且第二装置保持器的第二圆形路径在垂直于旋转轮的第二轴线的方向上的突起到第一圆形路径上第一装置保持器限定从第一装置保持器的第一圆形路径的内侧到外侧的线。

5. 发明授权

US08742288B2 Laser apparatus for singulation, and a method of singulation 有权
标题翻译：用于单片化的激光装置，以及一种分割方法
公开(公告)号：US08742288B2
公开(公告)日：2014-06-03
申请号：US13160624
申请日：2011-06-15
申请人： Chi Hang Kwok , Chi Wah Cheng
发明人： Chi Hang Kwok , Chi Wah Cheng
IPC分类号： B23K26/06
CPC分类号： B23K26/0738 , B23K26/364 , B23K26/40 , B23K2103/50
摘要： An apparatus 101 for singulating an object is disclosed. The apparatus 101 comprises a laser 103 configured to emit a laser beam 105 with a Gaussian irradiance profile, as well as a beam-shaping device 115 configured to reshape the Gaussian irradiance profile of the laser beam 105 emitted from the laser 103. In particular, the beam-shaping device 115 has a plurality of aspherical lenses 117, 119 to redistribute irradiance of the laser beam 105, so as to reduce variation of the irradiance in an effective irradiation spectrum of the laser beam 105 for singulating the object. By redistributing the irradiance of the laser beam 105, irradiation energy may be more efficiently delivered to the semiconductor wafer 102 for laser singulation, compared with conventional laser beams with Gaussian irradiance profiles which are non-uniform. A method of singulating an object is also disclosed.
摘要翻译：公开了一种用于分割物体的装置101。装置101包括被配置为发射具有高斯辐照度分布的激光束105的激光器103以及被配置为重新形成从激光器103发射的激光束105的高斯辐照度分布的光束整形装置115。光束整形装置115具有多个非球面透镜117,119，以重新分布激光束105的辐照度，以便减少激光束105的有效照射光谱中的辐照度的变化，以便分离物体。通过重新分配激光束105的辐照度，与具有不均匀的高斯辐照度分布的常规激光束相比，照射能量可以更有效地传递到用于激光分割的半导体晶片102。还公开了一种单体化对象的方法。

6. 发明申请

US20140011336A1 LASER PROCESSING METHOD AND APPARATUS 有权
标题翻译：激光加工方法和装置
公开(公告)号：US20140011336A1
公开(公告)日：2014-01-09
申请号：US13541865
申请日：2012-07-05
申请人： Chi Hang KWOK , Chi Wah CHENG , Lap Kei CHOW
发明人： Chi Hang KWOK , Chi Wah CHENG , Lap Kei CHOW
IPC分类号： H01L21/78 , B23K26/06
CPC分类号： B23K26/0853 , B23K26/40 , B23K26/53 , B23K2103/50
摘要： A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.
摘要翻译：公开了一种激光加工方法，包括以下步骤：将激光束导向工件; 并且实现激光束和工件之间的相对运动。特别地，将激光束引导到工件的步骤包括将激光束聚焦在工件内直到在工件内形成内部损伤，并且裂纹从内部损伤传播到工件的至少一个表面以形成表面裂纹在工件上。此外，实现激光束和工件之间的相对运动的步骤使得工件上的表面裂纹沿着工件上的分离线传播。还公开了一种激光加工装置。

7. 发明授权

US08354612B2 Laser processing apparatus 有权
标题翻译：激光加工设备
公开(公告)号：US08354612B2
公开(公告)日：2013-01-15
申请号：US12748578
申请日：2010-03-29
申请人： Chi Wah Cheng , Lap Kei Chow , Zhuanyun Zhang , Sze Leong Lai
发明人： Chi Wah Cheng , Lap Kei Chow , Zhuanyun Zhang , Sze Leong Lai
IPC分类号： B23K26/00
CPC分类号： B23K26/0673 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , B23K2103/52 , H01L21/67092
摘要： A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.
摘要翻译：用于切割基板的激光加工设备包括用于产生激光束的激光头和可安装基板的第一和第二工件保持器。沿着激光束的路径定位的分流器可操作以选择性地将激光束引向安装在第一工件保持器上的第一基板，以切割第一基板，或朝向安装在第二工件保持器上的第二基板切割第二基板从而可以在一个基板上同时进行操作，而另一个基板被切割。

8. 发明授权

US08037996B2 Transfer apparatus for handling electronic components 有权
标题翻译：用于处理电子部件的传送装置
公开(公告)号：US08037996B2
公开(公告)日：2011-10-18
申请号：US12348508
申请日：2009-01-05
申请人： Chi Wah Cheng , Wang Lung Tse , Chi Hang Leung
发明人： Chi Wah Cheng , Wang Lung Tse , Chi Hang Leung
IPC分类号： B65G25/00
CPC分类号： B65G47/918 , B65G47/91 , H01L21/67271
摘要： An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.
摘要翻译：用于传送多个电子部件的装置包括一排拾取头，其操作以从第一位置同时拾取电子部件并将其放置在第二位置。此外，存在一种驱动机构，其可操作地驱动拾取头相对于彼此在与行列拾取头的长度平行的方向上相对移动，从而调节拾取头的间距宽度。

9. 发明申请

US20100150756A1 NOZZLE DEVICE EMPLOYING HIGH FREQUENCY WAVE ENERGY 有权
标题翻译：采用高频能量的喷嘴装置
公开(公告)号：US20100150756A1
公开(公告)日：2010-06-17
申请号：US12335675
申请日：2008-12-16
申请人： Lap Kei Eric CHOW , Hoi Shuen TANG , Hon Keung LAI , Chi Wah CHENG
发明人： Lap Kei Eric CHOW , Hoi Shuen TANG , Hon Keung LAI , Chi Wah CHENG
IPC分类号： F04B35/04
CPC分类号： F04F7/00
摘要： A nozzle device comprising a nozzle chamber includes a fluid inlet located at a first side of the nozzle chamber which is operative to introduce fluid into the nozzle chamber in an injection direction and a fluid outlet at a second side of the nozzle chamber which is operative to expel fluid from the nozzle chamber. A high frequency wave generator is also located in the nozzle chamber which is oriented and operative to generate high frequency waves in a direction which is substantially parallel to the injection direction, whereby to impart high frequency energy to the fluid in the nozzle chamber.
摘要翻译：包括喷嘴室的喷嘴装置包括位于喷嘴室的第一侧处的流体入口，该流体入口可操作以沿喷射方向将流体引入喷嘴室，并且在喷嘴室的第二侧具有流体出口，从喷嘴室排出流体。高频波发生器也位于喷嘴室中，其定向和操作以在基本上平行于喷射方向的方向上产生高频波，从而向喷嘴室中的流体施加高频能量。

10. 发明授权

US07495759B1 Damage and wear detection for rotary cutting blades 有权
标题翻译：旋转切割刀片的损伤和磨损检测
公开(公告)号：US07495759B1
公开(公告)日：2009-02-24
申请号：US11877099
申请日：2007-10-23
申请人： Chi Wah Cheng , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Lap Kei Eric Chow
IPC分类号： G01N21/00 , B24B49/00
CPC分类号： B23D59/001 , B24B27/06 , B24B49/12 , G01N2021/151
摘要： A method of detecting wear and damage to a rotary cutting blade for singulating a substrate is provided comprising the steps of providing a sensor to locate a first detecting position at an edge of the blade and performing dicing with the blade while the sensor is maintained substantially at the first detecting position for detecting damage to the blade. Subsequently, an extent of wear of the blade is determined by driving the sensor in the direction of the blade to locate a second detecting position at the edge of the blade as a diameter of the blade is reduced due to dicing. Thereafter, while dicing is performed with the blade, the sensor is maintained substantially at the second detecting position for detecting damage to the blade.
摘要翻译：提供一种检测用于单个基板的旋转切割刀片的磨损和损坏的方法，包括以下步骤：提供传感器以在刀片的边缘定位第一检测位置，并且在传感器基本保持在基座上时与刀片进行切割用于检测对刀片的损坏的第一检测位置。随后，通过沿着刀片的方向驱动传感器来确定刀片的磨损程度，以便由于切割而使刀片的直径减小，从而将刀片的边缘处的第二检测位置定位。此后，当用刀片进行切割时，传感器基本上保持在第二检测位置，用于检测刀片的损坏。

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