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1. 发明授权

US08167523B2 Singulation handler comprising vision system 有权
标题翻译：分割处理器包括视觉系统
公开(公告)号：US08167523B2
公开(公告)日：2012-05-01
申请号：US11777000
申请日：2007-07-12
申请人： Chi Wah Cheng , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Lap Kei Eric Chow
IPC分类号： H01L21/304
CPC分类号： H01L21/681 , H01L21/67092 , Y10T83/04
摘要： Singulation handler is provided which comprises a loading zone where a carrier mechanism receives and holds an electronic component and a singulation zone where the electronic component held by the carrier mechanism is singulated. A loader that is movable along an axis is operative to place the electronic component onto the carrier mechanism when it is situated in the loading zone and a vision system that is movable along substantially the same axis as the loader is operative to obtain at least one image of the electronic component showing alignment information so that the electronic component can be properly aligned during singulation.
摘要翻译：提供了一种分包处理器，其包括载体区域，其中载体机构接收并保持电子部件和由载体机构保持的电子部件被单个化的单位区域。沿着轴线可移动的装载机可操作以将电子部件放置在载体机构上，当它位于装载区域中时，以及视觉系统可沿与加载器基本上相同的轴线移动以获得至少一个图像的电子部件显示对准信息，使得电子部件可以在分割期间适当地对准。

2. 发明授权

US08167524B2 Handling system for inspecting and sorting electronic components 有权
标题翻译：电子元件检查和分类处理系统
公开(公告)号：US08167524B2
公开(公告)日：2012-05-01
申请号：US11941372
申请日：2007-11-16
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
IPC分类号： B65H9/08
CPC分类号： H01L21/67271
摘要： A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.
摘要翻译：提供一种半导体封装处理系统，包括用于接收和保持单个半导体封装的封装保持器，以及第一检查装置，其布置和构造成在包装夹持器被保持时检查包装的第一表面。卸载装置从包装夹持器接收包装并将包装输送到卸载器，并且第二检查装置被布置和配置成在通过卸载保持的状态下检查与第一表面相对的包装的第二表面设备。

3. 发明授权

US07495759B1 Damage and wear detection for rotary cutting blades 有权
标题翻译：旋转切割刀片的损伤和磨损检测
公开(公告)号：US07495759B1
公开(公告)日：2009-02-24
申请号：US11877099
申请日：2007-10-23
申请人： Chi Wah Cheng , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Lap Kei Eric Chow
IPC分类号： G01N21/00 , B24B49/00
CPC分类号： B23D59/001 , B24B27/06 , B24B49/12 , G01N2021/151
摘要： A method of detecting wear and damage to a rotary cutting blade for singulating a substrate is provided comprising the steps of providing a sensor to locate a first detecting position at an edge of the blade and performing dicing with the blade while the sensor is maintained substantially at the first detecting position for detecting damage to the blade. Subsequently, an extent of wear of the blade is determined by driving the sensor in the direction of the blade to locate a second detecting position at the edge of the blade as a diameter of the blade is reduced due to dicing. Thereafter, while dicing is performed with the blade, the sensor is maintained substantially at the second detecting position for detecting damage to the blade.
摘要翻译：提供一种检测用于单个基板的旋转切割刀片的磨损和损坏的方法，包括以下步骤：提供传感器以在刀片的边缘定位第一检测位置，并且在传感器基本保持在基座上时与刀片进行切割用于检测对刀片的损坏的第一检测位置。随后，通过沿着刀片的方向驱动传感器来确定刀片的磨损程度，以便由于切割而使刀片的直径减小，从而将刀片的边缘处的第二检测位置定位。此后，当用刀片进行切割时，传感器基本上保持在第二检测位置，用于检测刀片的损坏。

4. 发明授权

US08702017B2 Nozzle device employing high frequency wave energy 有权
标题翻译：采用高频波能的喷嘴装置
公开(公告)号：US08702017B2
公开(公告)日：2014-04-22
申请号：US12335675
申请日：2008-12-16
申请人： Lap Kei Eric Chow , Hoi Shuen Tang , Hon Keung Lai , Chi Wah Cheng
发明人： Lap Kei Eric Chow , Hoi Shuen Tang , Hon Keung Lai , Chi Wah Cheng
IPC分类号： B05B1/08
CPC分类号： F04F7/00
摘要： A nozzle device comprising a nozzle chamber includes a fluid inlet located at a first side of the nozzle chamber which is operative to introduce fluid into the nozzle chamber in an injection direction and a fluid outlet at a second side of the nozzle chamber which is operative to expel fluid from the nozzle chamber. A high frequency wave generator is also located in the nozzle chamber which is oriented and operative to generate high frequency waves in a direction which is substantially parallel to the injection direction, whereby to impart high frequency energy to the fluid in the nozzle chamber.
摘要翻译：包括喷嘴室的喷嘴装置包括位于喷嘴室的第一侧处的流体入口，该流体入口可操作以沿喷射方向将流体引入喷嘴室，并且在喷嘴室的第二侧具有流体出口，从喷嘴室排出流体。高频波发生器也位于喷嘴室中，其定向和操作以在基本上平行于喷射方向的方向上产生高频波，从而向喷嘴室中的流体施加高频能量。

5. 发明授权

US07849847B2 Drainage apparatus for a singulation system 有权
标题翻译：排水系统的排水装置
公开(公告)号：US07849847B2
公开(公告)日：2010-12-14
申请号：US11853326
申请日：2007-09-11
申请人： Chi Wah Cheng , Lap Kei Eric Chow , Chi Hang Leung
发明人： Chi Wah Cheng , Lap Kei Eric Chow , Chi Hang Leung
IPC分类号： B28D1/02
CPC分类号： B28D5/0076 , Y10T83/242 , Y10T83/647
摘要： A singulation system for a workpiece has a carrier for mounting the workpiece during singulation and a receptacle for collecting debris formed. A driving mechanism, which is operative to move the carrier and the workpiece, is at least partially covered by a bellows. A bellows protecting cover extending over the bellows is coupled between the carrier and the receptacle and is operative to guide debris from the carrier along its longitudinal length towards the receptacle. The bellows protecting cover further comprises side walls extending along opposite sides of its longitudinal length to prevent debris from falling off its sides.
摘要翻译：用于工件的分割系统具有用于在分割期间安装工件的载体和用于收集形成的碎屑的容器。用于移动载体和工件的驱动机构至少部分地被波纹管覆盖。延伸在波纹管上方的波纹管保护盖联接在托架和插座之间，并且可操作以沿着其纵向长度朝向容器引导载体的碎屑。波纹管保护盖还包括沿其纵向长度的相对侧延伸的侧壁，以防止碎屑从其侧面脱落。

6. 发明授权

US08978673B2 Megasonic cleaning system 有权
标题翻译：超声波清洗系统
公开(公告)号：US08978673B2
公开(公告)日：2015-03-17
申请号：US11836458
申请日：2007-08-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
IPC分类号： B08B3/12 , B08B3/02 , H01L21/67
CPC分类号： B08B3/12 , B08B3/02 , B08B2203/0288 , H01L21/67051
摘要： A system for cleaning semiconductor packages is provided which includes a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.
摘要翻译：提供了一种用于清洁半导体封装的系统，其包括构造成将阵列布置中的半导体封装保持的拾取头和多个喷嘴，每个喷嘴构造和布置成将单独的清洁流体射流向上突出抵靠半导体封装。兆声波能量发生器被耦合以将兆声波能量传递给清洁流体，并且驱动装置驱动多个喷嘴和拾取头之间的相对运动，以引导所述射流清洁拾取头上的包装阵列。

7. 发明授权

US08657181B2 Wedge bonder and a method of cleaning a wedge bonder 有权
标题翻译：楔形粘结机和清洁楔形粘合剂的方法
公开(公告)号：US08657181B2
公开(公告)日：2014-02-25
申请号：US13532966
申请日：2012-06-26
申请人： Chi Wah Cheng , Man Kit Mui
发明人： Chi Wah Cheng , Man Kit Mui
IPC分类号： B23K31/02 , H01L21/60
CPC分类号： H01L24/78 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/4847 , H01L2224/7801 , H01L2224/78313 , H01L2224/7855 , H01L2224/78753 , H01L2224/78901 , H01L2224/85122 , H01L2224/85205 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a wedge bonder, comprising a wedge for bonding a wire to surfaces to form an electrical interconnection therebetween, a cleaning device for cleaning the wedge, and a positioning device to which the wedge is mounted. In particular, the positioning device is operative to move the wedge to the cleaning device for cleaning. A method of cleaning a wedge of a wedge bonder is also disclosed.
摘要翻译：公开了一种楔形接合器，包括用于将线接合到表面以形成其间的电互连的楔子，用于清洁楔的清洁装置，以及安装楔的定位装置。特别地，定位装置可操作以将楔移动到清洁装置以进行清洁。还公开了一种清洁楔形接合器楔形物的方法。

8. 发明授权

US08434669B1 Universal bond head for wire bonders 有权
标题翻译：用于焊线机的通用焊头
公开(公告)号：US08434669B1
公开(公告)日：2013-05-07
申请号：US13344172
申请日：2012-01-05
申请人： Chi Wah Cheng , Man Kit Mui
发明人： Chi Wah Cheng , Man Kit Mui
IPC分类号： B23K31/02
CPC分类号： B23K20/004 , B23K20/10 , H01L24/45 , H01L24/78 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48456 , H01L2224/78 , H01L2924/00015
摘要： A wedge wire bonder comprises a wedge that is operative to oscillate along a transducer axis for bonding a wire onto a surface and a wire clamp comprising a pair of parallel clamping plates for clamping the wire. The clamping plates having clamping surfaces that are oriented substantially perpendicularly to the transducer axis. Lateral guides are arranged on opposite sides of the wire, such that the lateral guides and the wire are generally aligned parallel to the clamping surfaces of the clamping plates for guiding the wire towards the wedge.
摘要翻译：楔形线接合器包括楔形件，其可操作以沿着换能器轴线振动以将线材接合到表面上，并且线夹具包括用于夹紧线材的一对平行夹紧板。夹紧板具有基本上垂直于换能器轴线定向的夹紧表面。横向引导件布置在线的相对侧上，使得侧向引导件和线通常对准平行于夹紧板的夹紧表面，以将导线引向楔形件。

9. 发明授权

US08251422B2 Apparatus for transferring electronic components in stages 有权
标题翻译：用于分阶段转移电子元件的装置
公开(公告)号：US08251422B2
公开(公告)日：2012-08-28
申请号：US12748777
申请日：2010-03-29
申请人： Chi Wah Cheng , Wang Lung Tse , Leung Por Chan
发明人： Chi Wah Cheng , Wang Lung Tse , Leung Por Chan
IPC分类号： H01L21/673 , H01L21/677
CPC分类号： H01L21/6838 , H01L21/67333
摘要： A transfer assembly for transferring first and second groups of electronic components simultaneously comprises a holding plate containing first and second sets of suction holes. The respective first and second sets of suction holes are operative to hold the first and second groups of electronic components respectively against the holding plate during transfer of the electronic components. A first vacuum chamber located next to the holding plate is connected only to the first set of suction holes. A vacuum compartment located within the first vacuum chamber encloses a second vacuum chamber. The vacuum compartment includes a sealing sheet in contact with the holding plate which has vacuum holes connecting the second vacuum chamber to the second set of suction holes. First and second vacuum sources are provided for applying vacuum suction forces separately in the first and second vacuum chambers.
摘要翻译：用于同时传送第一组和第二组电子部件的传送组件包括容纳第一组和第二组抽吸孔的保持板。相应的第一组和第二组抽吸孔可操作以在传送电子部件期间将第一组和第二组电子部件分别抵靠在保持板上。位于保持板附近的第一真空室仅与第一组吸入孔连接。位于第一真空室内的真空室包围第二真空室。真空室包括与保持板接触的密封片，该密封片具有将第二真空室连接到第二组吸入孔的真空孔。提供第一和第二真空源以在第一和第二真空室中分别施加真空吸力。

10. 发明申请

US20080164646A1 WORKHOLDER FOR SUPPORTING ELECTRONIC DEVICES 审中-公开
标题翻译：支持电子设备的工作人员
公开(公告)号：US20080164646A1
公开(公告)日：2008-07-10
申请号：US11621531
申请日：2007-01-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse
IPC分类号： B23Q3/02
CPC分类号： B23Q3/088 , B25B11/005 , B28D5/0094
摘要： A workholder, in particular a saw jig, is provided for mounting a substrate containing a plurality of electronic devices. The saw jig has a base platform having a plurality of pockets laid out in the same arrangement as the electronic devices are arranged on the substrate and a plurality of resilient collets are detachably inserted into the pockets, each collet being sized and configured to hold one electronic device by vacuum suction.
摘要翻译：为了安装包含多个电子设备的基板，提供了一个夹持器，特别是锯夹具。锯夹具具有基座平台，其具有以与电子设备布置在基底上相同的布置布置的多个口袋，并且多个弹性夹头可拆卸地插入到口袋中，每个夹头的尺寸和构造被容纳在一个电子设备通过真空抽吸。

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