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1. 发明授权

US09261536B2 Test contactor for electrical testing of electronic components 有权
标题翻译：用于电子元件电气测试的测试接触器
公开(公告)号：US09261536B2
公开(公告)日：2016-02-16
申请号：US13584971
申请日：2012-08-14
申请人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Kai Fung Lau
发明人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Kai Fung Lau
IPC分类号： G01R31/20 , G01R31/02 , G01R31/26 , G01R31/302 , H01R11/18 , H01R13/00 , H05K1/00 , G01R1/067 , G01R1/04 , G01R1/073
CPC分类号： G01R1/06772 , G01R1/0416 , G01R1/07342
摘要： A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.
摘要翻译：一种用于电子部件的测试装置包括安装块和布置在安装块上的多个接触条。接触条被配置成使得电子部件的电引线可操作以在偏置方向上按压和弯曲接触片，以确保电子部件测试期间电引线和接触片之间的良好接触。此外，位于安装块上的预加载块可操作以在电引线和接触片之间接触之前在偏压方向上接触并施加预接触力。

2. 发明授权

US09218995B2 Transfer apparatus for transferring electronic devices and changing their orientations 有权
标题翻译：用于传送电子设备和改变其方向的传送设备
公开(公告)号：US09218995B2
公开(公告)日：2015-12-22
申请号：US14258463
申请日：2014-04-22
申请人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
发明人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
IPC分类号： B65G47/84 , H01L21/677 , H01L21/67
CPC分类号： H01L21/67718 , H01L21/67132
摘要： A transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.
摘要翻译：一种用于将电子设备从晶片传送到测试处理器的传送设备。传送装置包括：i）可围绕轴线旋转的旋转装置; 以及ii）多个保持器，其构造成保持用于从晶片转移到测试处理器的电子设备。多个保持器联接到旋转装置并且可从旋转装置延伸以从晶片拾取电子装置。具体地说，多个保持器周向地布置并相对于旋转装置的轴线倾斜，以便将晶片上的电子设备的取向改变到测试处理器上的电子设备的期望取向。

3. 发明授权

US09465383B2 Apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components 有权
标题翻译：使用成像装置调整至少一个用于处理半导体部件的处理装置的装置和方法
公开(公告)号：US09465383B2
公开(公告)日：2016-10-11
申请号：US14311856
申请日：2014-06-23
申请人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Chung Yan Lau
发明人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Chung Yan Lau
IPC分类号： G06F7/00 , G05B19/418
CPC分类号： G05B19/4182 , G05B2219/39106 , G05B2219/40554 , G05B2219/45031 , G05B2219/45054 , Y02P90/083
摘要： Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.
摘要翻译：公开了一种处理电子部件的装置。该装置包括：i）旋转装置和围绕旋转装置周向布置的多个拾取头，每个拾取头可操作以保持电子部件; ii）位置确定装置，用于确定由各个拾取头保持的电子部件的布置; iii）布置在由位置确定装置确定的指示电子部件的布置的位置的基准标记; iv）相对于基准标记布置的第一成像装置; 以及v）用于处理电子部件的至少一个处理装置。具体地，第一成像装置可操作以捕获包括基准标记和至少一个处理装置的至少一个图像，使得至少一个处理装置的位置是可调节的，以使至少一个处理装置相对于基于从由第一成像装置拍摄的至少一个图像得出的基准标记和至少一个处理装置之间的偏移，电子部件的布置。还公开了一种调节用于处理电子部件的装置的至少一个处理装置的位置的方法。

4. 发明授权

US08967368B2 Apparatus for processing electronic devices 有权
标题翻译：电子设备处理装置
公开(公告)号：US08967368B2
公开(公告)日：2015-03-03
申请号：US14047143
申请日：2013-10-07
申请人： Chi Wah Cheng , Kai Fung Lau
发明人： Chi Wah Cheng , Kai Fung Lau
IPC分类号： B65G29/00 , B65G47/84 , H01L21/677
CPC分类号： B65G29/00 , B65G47/846 , H01L21/677 , H01L21/67721
摘要： An apparatus for processing electronic devices includes a rotary turret having first device concentric around the rotary turret, which transfer the electronic devices; a rotary wheel having second device holders concentric around the rotary wheel, which receive the electronic devices and a processing device to process the electronic devices. The rotary turret rotates the first device holders along a first circular path, and the rotary wheel rotates the second device holders along a second circular path. The first axis of the rotary turret is perpendicular to the second axis of the rotary wheel, and that a projection of the second circular path of the second device holders in a direction perpendicular to the second axis of the rotary wheel onto the first circular path of the first device holders defines a line from the inside to the outside of the first circular path of the first device holders.
摘要翻译：一种用于处理电子设备的设备包括：旋转转台，其具有围绕旋转转台同心的第一设备，其传送电子设备; 旋转轮具有围绕旋转轮同心的第二装置保持器，其接收电子装置和处理装置以处理电子装置。旋转转台沿着第一圆形路径旋转第一装置保持器，并且旋转轮沿着第二圆形路径旋转第二装置保持器。旋转转台的第一轴线垂直于旋转轮的第二轴线，并且第二装置保持器的第二圆形路径在垂直于旋转轮的第二轴线的方向上的突起到第一圆形路径上第一装置保持器限定从第一装置保持器的第一圆形路径的内侧到外侧的线。

5. 发明授权

US08978673B2 Megasonic cleaning system 有权
标题翻译：超声波清洗系统
公开(公告)号：US08978673B2
公开(公告)日：2015-03-17
申请号：US11836458
申请日：2007-08-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Leung Por Boris Chan
IPC分类号： B08B3/12 , B08B3/02 , H01L21/67
CPC分类号： B08B3/12 , B08B3/02 , B08B2203/0288 , H01L21/67051
摘要： A system for cleaning semiconductor packages is provided which includes a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning fluid upwardly against the semiconductor packages. A megasonic energy generator is coupled for imparting megasonic energy to the cleaning fluid and a driving device drives relative movement between the plurality of nozzles and the pickhead to direct the said jets to clean the array of packages on the pickhead.
摘要翻译：提供了一种用于清洁半导体封装的系统，其包括构造成将阵列布置中的半导体封装保持的拾取头和多个喷嘴，每个喷嘴构造和布置成将单独的清洁流体射流向上突出抵靠半导体封装。兆声波能量发生器被耦合以将兆声波能量传递给清洁流体，并且驱动装置驱动多个喷嘴和拾取头之间的相对运动，以引导所述射流清洁拾取头上的包装阵列。

6. 发明授权

US08657181B2 Wedge bonder and a method of cleaning a wedge bonder 有权
标题翻译：楔形粘结机和清洁楔形粘合剂的方法
公开(公告)号：US08657181B2
公开(公告)日：2014-02-25
申请号：US13532966
申请日：2012-06-26
申请人： Chi Wah Cheng , Man Kit Mui
发明人： Chi Wah Cheng , Man Kit Mui
IPC分类号： B23K31/02 , H01L21/60
CPC分类号： H01L24/78 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/4847 , H01L2224/7801 , H01L2224/78313 , H01L2224/7855 , H01L2224/78753 , H01L2224/78901 , H01L2224/85122 , H01L2224/85205 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a wedge bonder, comprising a wedge for bonding a wire to surfaces to form an electrical interconnection therebetween, a cleaning device for cleaning the wedge, and a positioning device to which the wedge is mounted. In particular, the positioning device is operative to move the wedge to the cleaning device for cleaning. A method of cleaning a wedge of a wedge bonder is also disclosed.
摘要翻译：公开了一种楔形接合器，包括用于将线接合到表面以形成其间的电互连的楔子，用于清洁楔的清洁装置，以及安装楔的定位装置。特别地，定位装置可操作以将楔移动到清洁装置以进行清洁。还公开了一种清洁楔形接合器楔形物的方法。

7. 发明授权

US08434669B1 Universal bond head for wire bonders 有权
标题翻译：用于焊线机的通用焊头
公开(公告)号：US08434669B1
公开(公告)日：2013-05-07
申请号：US13344172
申请日：2012-01-05
申请人： Chi Wah Cheng , Man Kit Mui
发明人： Chi Wah Cheng , Man Kit Mui
IPC分类号： B23K31/02
CPC分类号： B23K20/004 , B23K20/10 , H01L24/45 , H01L24/78 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48456 , H01L2224/78 , H01L2924/00015
摘要： A wedge wire bonder comprises a wedge that is operative to oscillate along a transducer axis for bonding a wire onto a surface and a wire clamp comprising a pair of parallel clamping plates for clamping the wire. The clamping plates having clamping surfaces that are oriented substantially perpendicularly to the transducer axis. Lateral guides are arranged on opposite sides of the wire, such that the lateral guides and the wire are generally aligned parallel to the clamping surfaces of the clamping plates for guiding the wire towards the wedge.
摘要翻译：楔形线接合器包括楔形件，其可操作以沿着换能器轴线振动以将线材接合到表面上，并且线夹具包括用于夹紧线材的一对平行夹紧板。夹紧板具有基本上垂直于换能器轴线定向的夹紧表面。横向引导件布置在线的相对侧上，使得侧向引导件和线通常对准平行于夹紧板的夹紧表面，以将导线引向楔形件。

8. 发明授权

US08251422B2 Apparatus for transferring electronic components in stages 有权
标题翻译：用于分阶段转移电子元件的装置
公开(公告)号：US08251422B2
公开(公告)日：2012-08-28
申请号：US12748777
申请日：2010-03-29
申请人： Chi Wah Cheng , Wang Lung Tse , Leung Por Chan
发明人： Chi Wah Cheng , Wang Lung Tse , Leung Por Chan
IPC分类号： H01L21/673 , H01L21/677
CPC分类号： H01L21/6838 , H01L21/67333
摘要： A transfer assembly for transferring first and second groups of electronic components simultaneously comprises a holding plate containing first and second sets of suction holes. The respective first and second sets of suction holes are operative to hold the first and second groups of electronic components respectively against the holding plate during transfer of the electronic components. A first vacuum chamber located next to the holding plate is connected only to the first set of suction holes. A vacuum compartment located within the first vacuum chamber encloses a second vacuum chamber. The vacuum compartment includes a sealing sheet in contact with the holding plate which has vacuum holes connecting the second vacuum chamber to the second set of suction holes. First and second vacuum sources are provided for applying vacuum suction forces separately in the first and second vacuum chambers.
摘要翻译：用于同时传送第一组和第二组电子部件的传送组件包括容纳第一组和第二组抽吸孔的保持板。相应的第一组和第二组抽吸孔可操作以在传送电子部件期间将第一组和第二组电子部件分别抵靠在保持板上。位于保持板附近的第一真空室仅与第一组吸入孔连接。位于第一真空室内的真空室包围第二真空室。真空室包括与保持板接触的密封片，该密封片具有将第二真空室连接到第二组吸入孔的真空孔。提供第一和第二真空源以在第一和第二真空室中分别施加真空吸力。

9. 发明授权

US08167524B2 Handling system for inspecting and sorting electronic components 有权
标题翻译：电子元件检查和分类处理系统
公开(公告)号：US08167524B2
公开(公告)日：2012-05-01
申请号：US11941372
申请日：2007-11-16
申请人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Wang Lung Alan Tse , Tim Wai Tony Mak , Lap Kei Eric Chow
IPC分类号： B65H9/08
CPC分类号： H01L21/67271
摘要： A semiconductor package handling system is provided comprising a package holder for receiving and holding singulated semiconductor packages, and a first inspection device which is arranged and configured to inspect a first surface of the packages while they are being held by the package holder. An offloading device receives the packages from the package holder and conveys them packages to an offloader, and a second inspection device is arranged and configured to inspect a second surface of the packages which is opposite from the first surface while they are being held by the offloading device.
摘要翻译：提供一种半导体封装处理系统，包括用于接收和保持单个半导体封装的封装保持器，以及第一检查装置，其布置和构造成在包装夹持器被保持时检查包装的第一表面。卸载装置从包装夹持器接收包装并将包装输送到卸载器，并且第二检查装置被布置和配置成在通过卸载保持的状态下检查与第一表面相对的包装的第二表面设备。

10. 发明申请

US20080164646A1 WORKHOLDER FOR SUPPORTING ELECTRONIC DEVICES 审中-公开
标题翻译：支持电子设备的工作人员
公开(公告)号：US20080164646A1
公开(公告)日：2008-07-10
申请号：US11621531
申请日：2007-01-09
申请人： Chi Wah Cheng , Wang Lung Alan Tse
发明人： Chi Wah Cheng , Wang Lung Alan Tse
IPC分类号： B23Q3/02
CPC分类号： B23Q3/088 , B25B11/005 , B28D5/0094
摘要： A workholder, in particular a saw jig, is provided for mounting a substrate containing a plurality of electronic devices. The saw jig has a base platform having a plurality of pockets laid out in the same arrangement as the electronic devices are arranged on the substrate and a plurality of resilient collets are detachably inserted into the pockets, each collet being sized and configured to hold one electronic device by vacuum suction.
摘要翻译：为了安装包含多个电子设备的基板，提供了一个夹持器，特别是锯夹具。锯夹具具有基座平台，其具有以与电子设备布置在基底上相同的布置布置的多个口袋，并且多个弹性夹头可拆卸地插入到口袋中，每个夹头的尺寸和构造被容纳在一个电子设备通过真空抽吸。

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