专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20150111366A1 SINGULATION APPARATUS AND METHOD 有权
标题翻译：单机设备及方法
公开(公告)号：US20150111366A1
公开(公告)日：2015-04-23
申请号：US14058396
申请日：2013-10-21
申请人： Chi Wah CHENG , Eric Lap Kei CHOW , Joseph Hoi Shuen TANG , Chun Kit LIU
发明人： Chi Wah CHENG , Eric Lap Kei CHOW , Joseph Hoi Shuen TANG , Chun Kit LIU
IPC分类号： H01L21/67 , H01L21/687 , B28D5/00 , H01L21/78
CPC分类号： H01L21/67092 , B28D5/024 , B28D5/029 , H01L21/68764
摘要： Disclosed is a singulation apparatus, comprising: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being for cutting the workpiece. A singulation method is also disclosed.
摘要翻译：公开了一种切割装置，包括：至少一个卡盘站，工件可固定到该夹持站上，所述至少一个卡盘站构造成沿着进给方向移动; 在所述至少一个卡盘站上方延伸的桥，所述桥具有与所述第一侧相对的第一侧和第二侧; 第一切割装置构件，其安装到所述桥上并且可沿着所述第一侧横向于所述进给方向独立地移动; 以及第二切割装置构件，其安装到所述桥上并且可沿所述第二侧横向于所述进给方向独立地移动，所述第一和第二切割装置用于切割所述工件。还公开了一种分割方法。

2. 发明申请

US20150194354A1 SINGULATION APPARATUS COMPRISING AN IMAGING DEVICE 有权
标题翻译：包含成像装置的组合装置
公开(公告)号：US20150194354A1
公开(公告)日：2015-07-09
申请号：US14146875
申请日：2014-01-03
申请人： Chi Wah CHENG , Hoi Shuen TANG , Chun Kit LIU
发明人： Chi Wah CHENG , Hoi Shuen TANG , Chun Kit LIU
IPC分类号： H01L21/66 , B26D5/06 , B26D5/00 , H01L21/67 , H01L21/78
CPC分类号： H01L22/20 , B26D1/18 , B26D5/007 , B26D5/06 , H01L21/67092 , H01L21/67259 , H01L21/681 , H01L21/78 , Y10T83/162
摘要： Disclosed is a singulation apparatus for cutting a workpiece. The singulation apparatus comprises: i) a processor; ii) at least one chuck device for securing the workpiece to be cut; iii) a cutting device spaced from the at least one chuck device by a separation distance, the cutting device being for cutting the workpiece secured to the at least one chuck device; and iv) an imaging device operable to capture one or more images comprising the cutting device and a reference feature. In particular, the processor is configured to determine a separation distance between the cutting device and the reference feature based on the one or more images as captured by the imaging device, to thereby determine the separation distance between the cutting device and the workpiece as secured to the at least one chuck device.
摘要翻译：公开了一种用于切割工件的切割装置。分割装置包括：i）处理器; ii）至少一个用于固定要切割的工件的卡盘装置; iii）与所述至少一个卡盘装置隔开间隔距离的切割装置，所述切割装置用于切割固定到所述至少一个卡盘装置的工件; 以及iv）可操作以捕获包括切割装置和参考特征的一个或多个图像的成像装置。特别地，处理器被配置为基于由成像装置捕获的一个或多个图像来确定切割装置和参考特征之间的间隔距离，从而确定切割装置与工件之间的分离距离，所述至少一个卡盘装置。

3. 发明申请

US20150370244A1 APPARATUS AND METHOD OF USING AN IMAGING DEVICE FOR ADJUSTMENT OF AT LEAST ONE HANDLING DEVICE FOR HANDLING SEMICONDUCTOR COMPONENTS 有权
标题翻译：用于调整至少一个处理器件的成像装置的装置和方法，用于处理半导体元件
公开(公告)号：US20150370244A1
公开(公告)日：2015-12-24
申请号：US14311856
申请日：2014-06-23
申请人： Hing Suen SIU , Yu Sze CHEUNG , Chi Wah CHENG , Chung Yan LAU
发明人： Hing Suen SIU , Yu Sze CHEUNG , Chi Wah CHENG , Chung Yan LAU
IPC分类号： G05B19/418
CPC分类号： G05B19/4182 , G05B2219/39106 , G05B2219/40554 , G05B2219/45031 , G05B2219/45054 , Y02P90/083
摘要： Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.
摘要翻译：公开了一种处理电子部件的装置。该装置包括：i）旋转装置和围绕旋转装置周向布置的多个拾取头，每个拾取头可操作以保持电子部件; ii）位置确定装置，用于确定由各个拾取头保持的电子部件的布置; iii）布置在由位置确定装置确定的指示电子部件的布置的位置的基准标记; iv）相对于基准标记布置的第一成像装置; 以及v）用于处理电子部件的至少一个处理装置。具体地，第一成像装置可操作以捕获包括基准标记和至少一个处理装置的至少一个图像，使得至少一个处理装置的位置是可调节的，以使至少一个处理装置相对于基于从由第一成像装置拍摄的至少一个图像得出的基准标记和至少一个处理装置之间的偏移，电子部件的布置。还公开了一种调节用于处理电子部件的装置的至少一个处理装置的位置的方法。

4. 发明申请

US20140011336A1 LASER PROCESSING METHOD AND APPARATUS 有权
标题翻译：激光加工方法和装置
公开(公告)号：US20140011336A1
公开(公告)日：2014-01-09
申请号：US13541865
申请日：2012-07-05
申请人： Chi Hang KWOK , Chi Wah CHENG , Lap Kei CHOW
发明人： Chi Hang KWOK , Chi Wah CHENG , Lap Kei CHOW
IPC分类号： H01L21/78 , B23K26/06
CPC分类号： B23K26/0853 , B23K26/40 , B23K26/53 , B23K2103/50
摘要： A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.
摘要翻译：公开了一种激光加工方法，包括以下步骤：将激光束导向工件; 并且实现激光束和工件之间的相对运动。特别地，将激光束引导到工件的步骤包括将激光束聚焦在工件内直到在工件内形成内部损伤，并且裂纹从内部损伤传播到工件的至少一个表面以形成表面裂纹在工件上。此外，实现激光束和工件之间的相对运动的步骤使得工件上的表面裂纹沿着工件上的分离线传播。还公开了一种激光加工装置。

5. 发明申请

US20100150756A1 NOZZLE DEVICE EMPLOYING HIGH FREQUENCY WAVE ENERGY 有权
标题翻译：采用高频能量的喷嘴装置
公开(公告)号：US20100150756A1
公开(公告)日：2010-06-17
申请号：US12335675
申请日：2008-12-16
申请人： Lap Kei Eric CHOW , Hoi Shuen TANG , Hon Keung LAI , Chi Wah CHENG
发明人： Lap Kei Eric CHOW , Hoi Shuen TANG , Hon Keung LAI , Chi Wah CHENG
IPC分类号： F04B35/04
CPC分类号： F04F7/00
摘要： A nozzle device comprising a nozzle chamber includes a fluid inlet located at a first side of the nozzle chamber which is operative to introduce fluid into the nozzle chamber in an injection direction and a fluid outlet at a second side of the nozzle chamber which is operative to expel fluid from the nozzle chamber. A high frequency wave generator is also located in the nozzle chamber which is oriented and operative to generate high frequency waves in a direction which is substantially parallel to the injection direction, whereby to impart high frequency energy to the fluid in the nozzle chamber.
摘要翻译：包括喷嘴室的喷嘴装置包括位于喷嘴室的第一侧处的流体入口，该流体入口可操作以沿喷射方向将流体引入喷嘴室，并且在喷嘴室的第二侧具有流体出口，从喷嘴室排出流体。高频波发生器也位于喷嘴室中，其定向和操作以在基本上平行于喷射方向的方向上产生高频波，从而向喷嘴室中的流体施加高频能量。

6. 发明申请

US20140328652A1 TRANSFER APPARATUS FOR TRANSFERRING ELECTRONIC DEVICES AND CHANGING THEIR ORIENTATIONS 有权
标题翻译：用于传送电子设备和更改其方位的传送装置
公开(公告)号：US20140328652A1
公开(公告)日：2014-11-06
申请号：US14258463
申请日：2014-04-22
申请人： Chi Wah CHENG , Kai Fung LAU , Hing Suen SIU
发明人： Chi Wah CHENG , Kai Fung LAU , Hing Suen SIU
IPC分类号： B65G47/84
CPC分类号： H01L21/67718 , H01L21/67132
摘要： Disclosed is a transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.
摘要翻译：公开了一种用于将电子设备从晶片传送到测试处理器的传送设备。传送装置包括：i）可围绕轴线旋转的旋转装置; 以及ii）多个保持器，其构造成保持用于从晶片转移到测试处理器的电子设备。多个保持器联接到旋转装置并且可从旋转装置延伸以从晶片拾取电子装置。具体地说，多个保持器周向地布置并相对于旋转装置的轴线倾斜，以便将晶片上的电子设备的取向改变到测试处理器上的电子设备的期望取向。

7. 发明申请

US20140049279A1 TEST CONTACTOR FOR ELECTRICAL TESTING OF ELECTRONIC COMPONENTS 有权
标题翻译：电子元器件电气测试试验接头
公开(公告)号：US20140049279A1
公开(公告)日：2014-02-20
申请号：US13584971
申请日：2012-08-14
申请人： Hing Suen SIU , Yu Sze CHEUNG , Chi Wah CHENG , Kai Fung LAU
发明人： Hing Suen SIU , Yu Sze CHEUNG , Chi Wah CHENG , Kai Fung LAU
IPC分类号： G01R1/073
CPC分类号： G01R1/06772 , G01R1/0416 , G01R1/07342
摘要： A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.
摘要翻译：一种用于电子部件的测试装置包括安装块和布置在安装块上的多个接触条。接触条被配置成使得电子部件的电引线可操作以在偏置方向上按压和弯曲接触片，以确保电子部件测试期间电引线和接触片之间的良好接触。此外，位于安装块上的预加载块可操作以在电引线和接触片之间接触之前在偏压方向上接触并施加预接触力。

8. 发明申请

US20100172734A1 TRANSFER APPARATUS FOR HANDLING ELECTRONIC COMPONENTS 有权
标题翻译：用于处理电子元件的传送装置
公开(公告)号：US20100172734A1
公开(公告)日：2010-07-08
申请号：US12348508
申请日：2009-01-05
申请人： Chi Wah CHENG , Wang Lung TSE , Chi Hang LEUNG
发明人： Chi Wah CHENG , Wang Lung TSE , Chi Hang LEUNG
IPC分类号： B65G1/133
CPC分类号： B65G47/918 , B65G47/91 , H01L21/67271
摘要： An apparatus for transferring a plurality of electronic components includes a row of pick heads operative to pick up the electronic components simultaneously from a first location and to place them at a second location. Additionally, there is a driving mechanism operative to drive the pick heads to move relative to one another in directions which are parallel to a length of the row of pick heads whereby to adjust a pitch width of the pick heads.
摘要翻译：用于传送多个电子部件的装置包括一排拾取头，其操作以从第一位置同时拾取电子部件并将其放置在第二位置。此外，存在一种驱动机构，其可操作地驱动拾取头相对于彼此在与行列拾取头的长度平行的方向上相对移动，从而调节拾取头的间距宽度。

9. 发明申请

US20090148258A1 PICK AND PLACE APPARATUS INCORPORATING DEBRIS REMOVAL DEVICE 审中-公开
标题翻译：并入装置去除装置
公开(公告)号：US20090148258A1
公开(公告)日：2009-06-11
申请号：US11952259
申请日：2007-12-07
申请人： Chi Wah CHENG , Wang Lung Alan TSE , Chi Fung Ricky CHAN
发明人： Chi Wah CHENG , Wang Lung Alan TSE , Chi Fung Ricky CHAN
IPC分类号： B65G61/00
CPC分类号： H05K13/0409 , H01L21/67144 , H01L21/6838
摘要： A pick and place apparatus is provided for picking up an electronic component from one location and placing it at another location, which comprises a pick up tool having an opening at which electronic components are configured to be held by vacuum suction. An air channel extends through the pick up tool from the opening and is connectable for fluid communication with an air supply source which is operative to blow a quantity of air out from the opening towards the electronic component for removing any debris located thereon. The air channel is also connectable for fluid communication with a vacuum suction source which is operative to generate vacuum suction force at the opening for picking up the electronic component by vacuum suction.
摘要翻译：提供了一种拾取和放置装置，用于从一个位置拾取电子部件并将其放置在另一位置，该位置包括拾取工具，该拾取工具具有开口，电子部件构造成通过真空抽吸来保持。空气通道从开口延伸穿过拾取工具，并且可连接用于与空气供应源流体连通，空气供应源可操作地将一定量的空气从开口朝向电子部件吹出以去除位于其上的任何碎片。空气通道也可连接用于与真空抽吸源的流体连通，该真空吸入源可操作以在开口处产生真空吸力，以通过真空抽吸拾取电子部件。

10. 发明申请

US20150204943A1 TEST HANDLER THAT PICKS UP ELECTRONIC DEVICES FOR TESTING AND AN ORIENTATION-CHANGING APPARATUS FOR USE IN A TEST HANDLER 有权
标题翻译：用于测试的电子设备的测试操作和用于测试处理器的方向改变设备
公开(公告)号：US20150204943A1
公开(公告)日：2015-07-23
申请号：US14603251
申请日：2015-01-22
申请人： Shing Kai YIP , Chi Wah CHENG
发明人： Shing Kai YIP , Chi Wah CHENG
IPC分类号： G01R31/28 , G01R31/26 , G01R1/067
CPC分类号： G01R31/2891 , G01N1/00 , G01N2201/00 , G01R1/00 , G01R1/06705 , G01R31/26 , G01R31/2893
摘要： A test handler comprises an orientation changing device having a device holder for holding electronic devices, the device holder having a vertical rotary axis. A conveying device is operative to convey electronic devices to the device holder, and a rotary motor connected to the device holder is operative to rotate the device holder about the vertical rotary axis to change an orientation of the electronic device held on it. A rotary turret of the test handler has a plurality of pick heads arranged on the rotary turret, and each pick head is configured to pick up electronic devices from the device holder.
摘要翻译：测试处理器包括具有用于保持电子设备的设备保持器的定向改变设备，该设备保持器具有竖直旋转轴线。传送装置用于将电子装置传送到装置保持器，并且连接到装置保持器的旋转电机可操作以围绕垂直旋转轴线旋转装置保持架以改变保持在其上的电子装置的取向。测试处理器的旋转转台具有设置在旋转转台上的多个拾取头，并且每个拾取头构造成从装置保持器拾取电子装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式