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    • 2. 发明授权
    • White light-emitting diode and method of manufacturing the same
    • 白色发光二极管及其制造方法
    • US6163038A
    • 2000-12-19
    • US78882
    • 1998-05-14
    • Chin-Yuan ChenChao-Nien HuangFei-Chang HwangMing-Huang HongEric G. Lean
    • Chin-Yuan ChenChao-Nien HuangFei-Chang HwangMing-Huang HongEric G. Lean
    • H01L33/06H01L33/08H01L33/12H01L33/32H01L33/50H01L33/00
    • H01L33/08H01L33/06H01L33/32
    • A white light-emitting diode and a method of fabricating the same diode are disclosed. The white light-emitting diode is fabricated by epitaxy, which can produce two peaks in the spectrum at the P-N junction by appropriately adjusting epitaxial parameters such as temperature, pressure, NH.sub.3 flux and the ratio of H.sub.2 to N.sub.2 or the concentration of dopant, such as Mg or Si. The diode can thus radiate white light by adjusting the wavelength and the intensity of the principal peak in the two peaks. Further, quantum well structure can be formed in the diode. By appropriately adjusting the epitaxial parameters, the spectrum of the quantum well structures may have more than one peak. Therefore, white light can be generated by combining the light with wavelengths at two or three different peaks. The white LED can radiate white light itself and need not involve combining many LEDs, so that the cost and the difficulty of fabricating the white LED lamp can be reduced. Moreover, the white LED can radiate white light itself, and does not need to excite fluorescent material to radiate white light. Accordingly, the lifetime of the white LED lamp is not limited by the relatively short lifetime of fluorescent material.
    • 公开了一种白色发光二极管及其制造方法。 白色发光二极管是通过外延制造的,其可以通过适当调整外延参数,例如温度,压力,NH 3通量以及H 2与N 2的比例或掺杂剂的浓度,在PN结的光谱中产生两个峰, 作为Mg或Si。 因此,二极管可以通过调节两个峰中的主峰的波长和强度来辐射白光。 此外,量子阱结构可以形成在二极管中。 通过适当调整外延参数,量子阱结构的光谱可能具有多于一个峰。 因此,可以通过将光与两个或三个不同峰的波长组合来产生白光。 白色LED本身可以散发白光,不需要涉及多个LED的组合,从而可以降低制造白光LED灯的成本和难度。 此外,白色LED可以自身辐射白光,不需要激发荧光材料来照射白光。 因此,白色LED灯的寿命不受荧光材料寿命相对较短的限制。
    • 6. 发明授权
    • Method for forming P-type gallium nitride
    • 形成P型氮化镓的方法
    • US5874320A
    • 1999-02-23
    • US893385
    • 1997-07-11
    • Kwang-Kuo ShihChao-Nien HuangChin-Yuan ChenBiing-Jye LeeMing-Huang Hong
    • Kwang-Kuo ShihChao-Nien HuangChin-Yuan ChenBiing-Jye LeeMing-Huang Hong
    • H01L21/205H01L21/223H01L21/324H01L21/326H01L33/32H01L21/22
    • H01L33/325H01L21/0254H01L21/02579H01L21/0262H01L21/2233H01L21/3245H01L21/326
    • A method for forming P-type gallium nitride is disclosed in the invention. In this method, Mg--H can be completly discomposed by use of an annealing process, thereby entirely dissociating the hydrogen atoms from the gallium nitride, while the nitrogen atoms are not dissociated from the gallium nitride. Therefore, the P-type gallium nitride having high conductivity is obtained and V.sub.N gap defects created in the gallium nitride do not occur. During the annealing process, nitrogen flux is added around the gallium nitride to prevent decomposition of the gallium nitride. The above-mentioned nitrogen flux can be generated by use of RF plasma, electron cyclotron resonance (ECR) or ion beam. Furthermore, since a forward current is provided across the P--N junction of the gallium nitride, the Mg--H inside the magnesium-doped gallium nitride can be decomposed by just increasing the temperature to 175.degree. C. Therefore, in the invention, when a diode structure is manufactured with gallium nitride, the hydrogen atoms can be dissociated from the gallium nitride in a low-temperature process, thereby activating the magnesium (acceptor), such that the conductivity of the P-type gallium nitride is further increased and V.sub.N gap defects caused by a high-temperature process are prevented.
    • 在本发明中公开了形成P型氮化镓的方法。 在这种方法中,Mg-H可以通过使用退火工艺完全分解,从而完全解离氮原子上的氢原子,而氮原子不会离开氮化镓。 因此,获得具有高导电性的P型氮化镓,并且不会发生在氮化镓中产生的VN间隙缺陷。 在退火过程中,在氮化镓周围添加氮通量,以防止氮化镓分解。 上述氮通量可以通过使用RF等离子体,电子回旋共振(ECR)或离子束来产生。 此外,由于在氮化镓的PN结两端提供正向电流,所以通过将温度升高到175℃,镁掺杂氮化镓内部的Mg-H可以分解。因此,在本发明中,当二极管 结构用氮化镓制造,在低温工艺中氢原子可以从氮化镓中解离,从而激活镁(受体),使得P型氮化镓的导电性进一步增加,VN间隙缺陷 防止高温过程引起的。
    • 8. 发明授权
    • Ohmic contact to semiconductor devices and method of manufacturing the same
    • 与半导体器件的欧姆接触及其制造方法
    • US07061110B2
    • 2006-06-13
    • US09388265
    • 1999-09-01
    • Jin-Kuo HoCharng-Shyang JongChao-Nien HuangChin-Yuan ChenChienchia ChiuChenn-shiung ChengKwang Kuo Shih
    • Jin-Kuo HoCharng-Shyang JongChao-Nien HuangChin-Yuan ChenChienchia ChiuChenn-shiung ChengKwang Kuo Shih
    • H01L23/48
    • H01L33/40
    • An ohmic contact of semiconductor and its manufacturing method are disclosed. The present invention provides a low resistivity ohmic contact so as to improve the performance and reliability of the semiconductor device. This ohmic contact is formed by first coating a transition metal and a noble metal on a semiconductor material; then heat-treating the transition metal and the noble metal in an oxidizing environment to oxidize the transition metal. In other words, this ohmic contact primarily includes a transition metal oxide and a noble metal. The oxide in the film can be a single oxide, or a mixture of various oxides, or a solid solution of various oxides. The metal of the film can be a single metal, or various metals or an alloy thereof. The structure of the film can be a mixture or a laminate or multilayered including oxide and metal. The layer structure includes at least one oxide layer and one metal layer, in which at least one oxide layer is contacting to semiconductor.
    • 公开了半导体的欧姆接触及其制造方法。 本发明提供一种低电阻率的欧姆接触,从而提高半导体器件的性能和可靠性。 该欧姆接触通过首先在半导体材料上涂覆过渡金属和贵金属来形成; 然后在氧化环境中对过渡金属和贵金属进行热处理以氧化过渡金属。 换句话说,该欧姆接触主要包括过渡金属氧化物和贵金属。 膜中的氧化物可以是单一氧化物,或各种氧化物的混合物,或各种氧化物的固溶体。 膜的金属可以是单一金属,或各种金属或其合金。 膜的结构可以是混合物或层压体或多层包括氧化物和金属。 层结构包括至少一个氧化物层和一个金属层,其中至少一个氧化物层与半导体接触。
    • 9. 发明授权
    • Ohmic contact to semiconductor devices and method of manufacturing the same
    • 与半导体器件的欧姆接触及其制造方法
    • US06319808B1
    • 2001-11-20
    • US09325240
    • 1999-06-03
    • Jin-Kuo HoCharng-Shyang JongChao-Nien HuangChin-Yuan ChenChienchia ChiuChenn-shiung ChengKwang Kuo Shih
    • Jin-Kuo HoCharng-Shyang JongChao-Nien HuangChin-Yuan ChenChienchia ChiuChenn-shiung ChengKwang Kuo Shih
    • H01L2144
    • H01L33/40
    • An ohmic contact of semiconductor and its manufacturing method are disclosed. The present invention provides a low resistivity ohmic contact so as to improve the performance and reliability of the semiconductor device. This ohmic contact is formed by first coating a transition metal and a noble metal on a semiconductor material; then heat-treating the transition metal and the noble metal in an oxidizing environment to oxidize the transition metal. In other words, this ohmic contact primarily includes a transition metal oxide and a noble metal. The oxide in the film can be a single oxide, or a mixture of various oxides, or a solid solution of various oxides. The metal of the film can be a single metal, or various metals or an alloy thereof. The structure of the film can be a mixture or a laminate or multilayered including oxide and metal. The layer structure includes at least one oxide layer and one metal layer, in which at least one oxide layer is contacting to semiconductor.
    • 公开了半导体的欧姆接触及其制造方法。 本发明提供一种低电阻率的欧姆接触,从而提高半导体器件的性能和可靠性。 该欧姆接触通过首先在半导体材料上涂覆过渡金属和贵金属来形成; 然后在氧化环境中对过渡金属和贵金属进行热处理以氧化过渡金属。 换句话说,该欧姆接触主要包括过渡金属氧化物和贵金属。 膜中的氧化物可以是单一氧化物,或各种氧化物的混合物,或各种氧化物的固溶体。 膜的金属可以是单一金属,或各种金属或其合金。 膜的结构可以是混合物或层压体或多层包括氧化物和金属。 层结构包括至少一个氧化物层和一个金属层,其中至少一个氧化物层与半导体接触。
    • 10. 发明授权
    • Method of oxidizing nitride material enhanced by illumination with UV light at room temperature
    • 通过在室温下用紫外光照射而增强氮化物材料的方法
    • US06190508B1
    • 2001-02-20
    • US09287326
    • 1999-04-07
    • Lung-Han PengYi-Chien HsuChin-Yuan ChenJin-Kuo HoChao-Nien Huang
    • Lung-Han PengYi-Chien HsuChin-Yuan ChenJin-Kuo HoChao-Nien Huang
    • C01B2100
    • C01G1/02C01B13/324C01P2002/72
    • A method of forming oxide from nitride, in which the oxidation is enhanced by illuminating the nitride material with UV light. This method produces a rapid growth of oxide and allows for the monitoring of the oxide thickness in situ. The method comprises the steps of (i) placing the nitride material on an illuminating holder; (ii) dipping the nitride material and the illuminating holder in an electrolyte; and (iii) illuminating the nitride material with a light having an energy larger than the energy gap of the nitride material. The nitride material can be connected to a conductive electrode located in the electrolyte via a galvanometer to monitor a photo current generated by the oxidation of the nitride material so as to monitor the thickness of the oxide formed on the nitride material in situ. A metal coating can be coated on the nitride material to define the oxide forming region. The pH value of the electrolyte is in a range of approximately 3 to 10, and is preferably about 3.5.
    • 从氮化物形成氧化物的方法,其中通过用UV光照射氮化物材料来增强氧化。 该方法产生氧化物的快速生长,并允许原位监测氧化物厚度。 该方法包括以下步骤:(i)将氮化物材料放置在照明保持器上; (ii)将氮化物材料和照明保持器浸入电解质中; 和(iii)用能量大于氮化物材料的能隙的光来照射氮化物材料。 氮化物材料可以经由电流计连接到位于电解质中的导电电极,以监测由氮化物材料的氧化产生的光电流,以便现场监测在氮化物材料上形成的氧化物的厚度。 可以在氮化物材料上涂覆金属涂层以限定氧化物形成区域。 电解液的pH值在约3〜10的范围内,优选为3.5左右。