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    • 6. 发明授权
    • Robot blade with dual offset wafer supports
    • 具有双偏移晶片支架的机器人刀片
    • US06722834B1
    • 2004-04-20
    • US08946920
    • 1997-10-08
    • Avi Tepman
    • Avi Tepman
    • B44C122
    • H01L21/68707H01L21/67742Y10S414/135
    • A robot blade and a method of using the robot blade for transferring objects, namely substrates, through a process system, the robot blade comprising an upper platform having a first object supporting surface and a lower platform having a second object supporting surface. The robot blade is mounted onto a moveable member, and the assembly facilitates substrate transfers, such as removal of a processed substrate and insertion of an unprocessed substrate within a processing chamber through a single entry of the robot blade into the processing chamber.
    • 一种机器人刀片和使用所述机器人刀片用于通过处理系统传送物体即基底的方法,所述机器人刀片包括具有第一物体支撑表面的上平台和具有第二物体支撑表面的下平台。 机器人刀片安装在可移动构件上,并且组件便于衬底转移,例如移除经处理的衬底并且通过机器人刀片的单个进入到处理室中的未处理衬底在处理室内的插入。
    • 7. 发明授权
    • Resonant chamber applicator for remote plasma source
    • 用于远程等离子体源的谐振室施加器
    • US06603269B1
    • 2003-08-05
    • US09593586
    • 2000-06-13
    • Be Van VoSalvador P. UmotoySon N. TrinhLawrence Chung-Lai LeiSergio EdelsteinAvi TepmanChien-Teh KaoKenneth Tsai
    • Be Van VoSalvador P. UmotoySon N. TrinhLawrence Chung-Lai LeiSergio EdelsteinAvi TepmanChien-Teh KaoKenneth Tsai
    • C23C1600
    • H01J37/32192
    • An improved plasma applicator for remotely generating a plasma for use in semiconductor manufacturing is provided. In one embodiment, a plasma applicator is comprised of a chamber assembly, a removable waveguide adapter and a circular clamp which secures the adapter to the chamber assembly. The chamber assembly includes an aperture plate, a microwave transparent window, a chamber body and a microwave sensor which is mounted on the chamber body. The chamber body has a proximate end opening adapted to admit microwave energy into the cavity and a distal end disposed generally on the opposite side of the cavity from the proximate end opening. The chamber body further has a gas outlet port adapted to permit the flow of an excited gas out of the cavity and a gas inlet port adapted to admit a precursor gas into the cavity. The gas inlet port has a center axis which is disposed between the proximate end opening of the chamber body and the midpoint between the proximate end opening and the distal end of the body.
    • 提供了用于远程产生用于半导体制造的等离子体的改进的等离子体施加器。 在一个实施例中,等离子体施加器由腔室组件,可移除波导适配器和将适配器固定到腔室组件的圆形夹具构成。 腔室组件包括孔板,微波透明窗,室主体和安装在腔体上的微波传感器。 室主体具有适于将微波能量引入空腔中的近端开口,以及大致位于与近端开口相反的空腔相对侧的远端。 腔体还具有气体出口端口,其适于允许将激发气体流出空腔,气体入口端口适于将前体气体引入空腔。 气体入口具有中心轴线,该中心轴线设置在腔室主体的近端开口和本体的近端开口和远端之间的中点之间。
    • 9. 发明授权
    • Apparatus for electro-chemical deposition with thermal anneal chamber
    • 具有热退火室的电化学沉积设备
    • US6136163A
    • 2000-10-24
    • US263126
    • 1999-03-05
    • Robin CheungAshok SinhaAvi TepmanDan Carl
    • Robin CheungAshok SinhaAvi TepmanDan Carl
    • B65G49/07C25D7/12H01L21/00H01L21/02H01L21/288C25D17/00C25B9/00C25B15/00
    • H01L21/6723C25D17/001H01L21/67098
    • The present invention generally provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs rules and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, a rapid thermal anneal chamber disposed adjacent the loading station, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. One aspect of the invention provides a post electrochemical deposition treatment, such as a rapid thermal anneal treatment, for enhancing deposition results. Preferably, the electro-chemical deposition system includes a system controller adapted to control the electro-chemical deposition process and the components of the electro-chemical deposition system, including the rapid thermal anneal chamber disposed adjacent the loading station.
    • 本发明通常提供一种电化学沉积系统,其被设计成具有可扩展以适应未来设计规则和间隙填充要求的柔性结构,并提供令人满意的吞吐量以满足其它处理系统的需求。 电化学沉积系统通常包括具有主机晶片传送机器人的主机,与主机连接设置的加载站,与加载站相邻设置的快速热退火室,与主机连接设置的一个或多个处理单元, 以及流体连接到所述一个或多个电处理单元的电解质供应。 本发明的一个方面提供了用于增强沉积结果的后电化学沉积处理,例如快速热退火处理。 优选地,电化学沉积系统包括适于控制电化学沉积过程和电化学沉积系统的部件的系统控制器,包括邻近加载站设置的快速热退火室。
    • 10. 发明授权
    • RF plasma etch reactor with internal inductive coil antenna and
electrically conductive chamber walls
    • RF等离子体蚀刻反应器,具有内部感应线圈天线和导电室壁
    • US6071372A
    • 2000-06-06
    • US869798
    • 1997-06-05
    • Yan YeDonald OlgadoAvi TepmanDiana MaGerald YinPeter LoewenhardtJeng H. HwangSteve Mak
    • Yan YeDonald OlgadoAvi TepmanDiana MaGerald YinPeter LoewenhardtJeng H. HwangSteve Mak
    • H05H1/46H01J37/32H01L21/302C23F1/02C23C16/00
    • H01J37/32477H01J37/321
    • An RF plasma etch reactor having an etch chamber with electrically conductive walls and a protective layer forming the portion of the walls facing the interior of the chamber. The protective layer prevents sputtering of material from the chamber walls by a plasma formed within the chamber. The etch reactor also has an inductive coil antenna disposed within the etch chamber which is used to generate the plasma by inductive coupling. Like the chamber walls, the inductive coil antenna is constructed to prevent sputtering of the material making up the antenna by the plasma. The coil antenna can take on any configuration (e.g. location, shape, orientation) that is necessary to achieve a desired power deposition pattern within the chamber. Examples of potential coil antenna configurations for achieving the desired power deposition pattern include constructing the coil antenna with a unitary or a segmented structure. The segmented structure involves the use of at least two coil segments wherein each segment is electrically isolated from the other segments and connected to a separate RF power signal. The unitary coil antenna or each of the coil segments can have a planar shape, a cylindrical shape, a truncated conical shape, a dome shape, or any combination thereof. The conductive walls are electrically grounded to serve as an electrical ground (i.e. anode) for a workpiece-supporting pedestal which is connected to a source of RF power to create a bias voltage at the surface of the workpiece.
    • RF等离子体蚀刻反应器具有具有导电壁的蚀刻室和形成面向腔室内部的部分壁的保护层。 保护层防止在室内形成的等离子体从室壁溅射材料。 蚀刻反应器还具有设置在蚀刻室内的感应线圈天线,其用于通过感应耦合产生等离子体。 类似于室壁,感应线圈天线被构造成防止由等离子体溅射构成天线的材料。 线圈天线​​可以承受在室内实现期望的功率沉积图案所必需的任何配置(例如位置,形状,取向)。 用于实现期望的功率沉积模式的电位线圈天线配置的示例包括以整体或分段结构构造线圈天线。 分段结构涉及使用至少两个线圈段,其中每个段与其它段电隔离并连接到单独的RF功率信号。 单线圈天线或每个线圈段可以具有平面形状,圆柱形,截顶圆锥形,圆顶形或其任何组合。 导电壁电接地以用作工件支撑基座的电接地(即阳极),工件支撑基座连接到RF功率源,以在工件的表面产生偏置电压。