专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08967076B2 Hydrothermal synthesis of active materials and in situ spraying deposition for lithium ion battery 有权
标题翻译：水热合成活性物质和原位喷涂沉积锂离子电池
公开(公告)号：US08967076B2
公开(公告)日：2015-03-03
申请号：US13098924
申请日：2011-05-02
申请人： Lu Yang , Hooman Bolandi , Karl Brown , Victor Pebenito , Donald Olgado
发明人： Lu Yang , Hooman Bolandi , Karl Brown , Victor Pebenito , Donald Olgado
IPC分类号： C23C4/12 , C23C26/02 , H01M4/04 , H01M4/139 , H01M4/62
CPC分类号： C23C4/121 , C23C4/123 , C23C26/02 , H01M4/0419 , H01M4/0421 , H01M4/139 , H01M4/625 , Y02E60/122 , Y02P70/54
摘要： A method and apparatus for forming an electrochemical layer of a lithium ion battery is provided. A precursor mixture in a carrying medium is activated in a reactor chamber by application of energy to synthesize active materials. The activated precursor mixture is then spray deposited on a substrate. A binder and conductive materials may be blended, or sprayed separately, with the nano- or micro-crystals as they deposit on the surface to enhance adhesion and conductivity.
摘要翻译：提供了一种用于形成锂离子电池的电化学层的方法和装置。携带介质中的前体混合物通过施加能量在反应器室中活化以合成活性材料。然后将活化的前体混合物喷雾沉积在基底上。当粘合剂和导电材料沉积在表面上时，粘合剂和导电材料可以与纳米或微晶分别共混或喷涂，以增强粘合性和导电性。

2. 发明授权

US07993485B2 Methods and apparatus for processing a substrate 有权
标题翻译：用于处理衬底的方法和设备
公开(公告)号：US07993485B2
公开(公告)日：2011-08-09
申请号：US11299295
申请日：2005-12-09
申请人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
发明人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
IPC分类号： C03C15/00 , H01I21/306
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
摘要翻译：适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和第一斜面作为基底旋转。提供了许多其他方面。

3. 发明申请

US20070131653A1 Methods and apparatus for processing a substrate 审中-公开
公开(公告)号：US20070131653A1
公开(公告)日：2007-06-14
申请号：US11298555
申请日：2005-12-09
申请人： Gary Ettinger , Erik Wasinger , Sen-Hou Ko , Wui-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
发明人： Gary Ettinger , Erik Wasinger , Sen-Hou Ko , Wui-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： B24B9/065 , B24B21/002 , B24B41/002 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

4. 发明申请

US20070111638A1 PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL POLISHING 有权
标题翻译：电化学机械抛光用PAD组件
公开(公告)号：US20070111638A1
公开(公告)日：2007-05-17
申请号：US11562320
申请日：2006-11-21
申请人： SHOU-SUNG CHANG , Stan Tsai , Donald Olgado , Liang-Yuh Chen , Alain Duboust , Ralph Wadensweiler
发明人： SHOU-SUNG CHANG , Stan Tsai , Donald Olgado , Liang-Yuh Chen , Alain Duboust , Ralph Wadensweiler
IPC分类号： B24B51/00
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.
摘要翻译：提供了用于处理基板的垫组件的实施例。焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下面的工作表面;以及电极，具有设置在处理层的工作表面下方的下表面上方的上表面。电极的上表面通过多个孔至少部分地暴露于工作表面，以在电极的上表面和焊盘组件的工作表面之间提供电解质通路。

5. 发明申请

US20060019581A1 Polishing solution retainer 有权
标题翻译：抛光液固定器
公开(公告)号：US20060019581A1
公开(公告)日：2006-01-26
申请号：US10942600
申请日：2004-09-16
申请人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
发明人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.
摘要翻译：对基板研磨装置和方法进行说明。基座包括至少一个可移动的压板以接合抛光垫。在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。抛光溶液保持机构附接到基座或承载头组件中的一个。保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。一些实施方案可以减少抛光溶液消耗并允许增加的角速度。

6. 发明申请

US20050217586A1 Lift pin alignment and operation methods and apparatus 审中-公开
公开(公告)号：US20050217586A1
公开(公告)日：2005-10-06
申请号：US11146687
申请日：2005-06-06
申请人： Dmitry Lubomirsky , Sheshraj Tulshibagwale , Donald Olgado , Avi Tepman
发明人： Dmitry Lubomirsky , Sheshraj Tulshibagwale , Donald Olgado , Avi Tepman
IPC分类号： H01L21/683 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68742 , Y10S414/135
摘要： A lifting mechanism includes a plurality of lift pins which may be driven separately and independently upward to engage an alignment surface of the chamber using ambient atmospheric pressure as the chamber is evacuated by a pump. In the illustrated embodiment, each lift pin includes a piston which is exposed to the internal chamber pressure on one side of the piston, and is exposed to the external ambient pressure on the other side of the piston. As the pump evacuates the chamber, the internal chamber pressure decreases, causing each lift pin piston to drive the associated lift pin upward. Once all the lift pins have securely engaged the alignment surface, the lift pins may be clamped to a linking mechanism to permit a motor to actuate the lift pins during processing operations.

7. 发明授权

US5817534A RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers 失效
标题翻译： RF等离子体反应器，其具有用于在半导体晶片的处理期间进行清洁的清洁电极
公开(公告)号：US5817534A
公开(公告)日：1998-10-06
申请号：US567376
申请日：1995-12-04
申请人： Yan Ye , Hiroji Hanawa , Diana Xiaobing Ma , Gerald Zheyao Yin , Peter Loewenhardt , Donald Olgado , James Papanu , Steven S.Y. Mak
发明人： Yan Ye , Hiroji Hanawa , Diana Xiaobing Ma , Gerald Zheyao Yin , Peter Loewenhardt , Donald Olgado , James Papanu , Steven S.Y. Mak
IPC分类号： H05H1/46 , H01J37/32 , H01L21/00 , H01L21/302 , H01L21/304 , H01L21/3065 , H05H1/00
CPC分类号： H01L21/67028 , H01J37/32862 , Y10S438/905
摘要： The invention is carried out in a plasma reactor for processing a semiconductor wafer, the plasma reactor having a chamber for containing a processing gas and having a conductor connected to an RF power source for coupling RF power into the reactor chamber to generate from the processing gas a plasma inside the chamber, the chamber containing at least one surface exposed toward the plasma and susceptible to contamination by particles produced during processing of the wafer, the invention being carried out by promoting, during processing of the wafer, bombarding of particles from the plasma onto the one surface to remove therefrom contaminants deposited during processing of the wafer. Such promoting of bombarding is carried out by providing an RF power supply and coupling, during processing of the wafer, RF power from the supply to the one surface. The coupling may be performed by a capacitive cleaning electrode adjacent the one surface, the capacitive cleaning electrode connected to the RF power supply. The capacitive cleaning electrode preferably is disposed on a side of the one surface opposite the plasma so as to be protected from contact with the plasma. Alternatively, the coupling may be carried out by a direct electrical connection from the RF power supply to the one surface.
摘要翻译：本发明在用于处理半导体晶片的等离子体反应器中进行，等离子体反应器具有用于容纳处理气体的室，并具有连接到RF电源的导体，用于将RF功率耦合到反应器室中以从处理气体产生腔室内的等离子体，该腔室包含至少一个暴露于等离子体的表面并容易受到在晶片加工期间产生的颗粒的污染，本发明通过在晶片加工期间促进从等离子体中轰击颗粒而进行在一个表面上去除在晶片加工期间沉积的污染物。通过在晶片的处理期间提供RF电源和耦合来进行轰击的这种促进是从电源到单个表面的RF功率。耦合可以通过与一个表面相邻的电容清洁电极，电容清洁电极连接到RF电源来进行。电容式清洁电极优选地设置在与等离子体相对的一个表面的一侧，以便被保护而不与等离子体接触。或者，耦合可以通过从RF电源到一个表面的直接电连接来执行。

8. 发明申请

US20130068320A1 PROTECTIVE MATERIAL FOR GAS DELIVERY IN A PROCESSING SYSTEM 审中-公开
标题翻译：用于加工系统中气体输送的保护材料
公开(公告)号：US20130068320A1
公开(公告)日：2013-03-21
申请号：US13525200
申请日：2012-06-15
申请人： Son Nguyen , Donald Olgado
发明人： Son Nguyen , Donald Olgado
IPC分类号： F16L53/00
CPC分类号： F16L53/00 , C23C16/4404 , C23C16/4481 , C23C16/45502 , C23C16/45565 , C30B25/14 , C30B29/403 , Y10T137/6416
摘要： Apparatus and systems are disclosed for providing a protective material for a gas-delivery system of a processing system. In an embodiment, a processing system includes a processing chamber for processing substrates and a gas-delivery system for delivering processing gases to the processing chamber. The gas-delivery system includes a protective material to protect the gas-delivery system from processing gases including at least one processing gas heated to an elevated temperature. The protective material includes a tungsten plate or a tungsten plate coated with a tantalum alloy and tantalum
摘要翻译：公开了用于为处理系统的气体输送系统提供保护材料的装置和系统。在一个实施例中，处理系统包括用于处理基板的处理室和用于将处理气体输送到处理室的气体输送系统。气体输送系统包括保护气体输送系统免受处理气体（包括加热到高温的至少一种处理气体）的保护材料。保护材料包括涂有钽合金和钽的钨板或钨板

9. 发明申请

US20090036033A1 METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：US20090036033A1
公开(公告)日：2009-02-05
申请号：US12245765
申请日：2008-10-05
申请人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
发明人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
IPC分类号： B24B1/04 , B24B9/00
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.
摘要翻译：提供了清洁基板的边缘的方法。该方法包括在框架中张紧第一抛光膜; 使所述第一抛光膜与衬底的边缘接触; 使所述第一抛光膜与所述基板的边缘一致，所述边缘包括外边缘和至少一个斜面; 并且在第一研磨膜与基板保持接触的同时旋转基板。提供了许多其他方面。

10. 发明申请

US20070238393A1 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
标题翻译：用于抛光衬底边缘的方法和装置
公开(公告)号：US20070238393A1
公开(公告)日：2007-10-11
申请号：US11693695
申请日：2007-03-29
申请人： Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
发明人： Ho Shin , Gary Ettinger , Donald Olgado , Erik Wasinger , Sen-Hou Ko , Charles Dodds , Yufei Chen , Wei-Yung Hsu
IPC分类号： B24B51/00 , B24B49/00 , B24B7/30
CPC分类号： B24B9/065 , B24B21/002 , B24B41/067 , B24B49/16 , B24B57/02
摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.
摘要翻译：提供了抛光衬底边缘的方法和系统。本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。本发明还可以包括基于在将衬底旋转抛光膜时所检测到的能量或扭矩确定从衬底边缘去除的材料量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。提供了许多其他方面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式