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    • 83. 发明申请
    • SILLICON BASED PRESSURE AND ACCELERATION OPTICAL INTERFEROMETRIC SENSORS WITH HOUSING ASSEMBLY
    • 基于SILICON的压力和加速光学干涉仪传感器与壳体组件
    • US20160273904A1
    • 2016-09-22
    • US14664187
    • 2015-03-20
    • Kulite Semiconductor Products, Inc.
    • Martin A. Sanzari
    • G01B9/02
    • G01B9/0207G01B2290/25G01L9/00G01L9/0044G01L9/0045G01L9/0047G01L9/0048G01L9/0079G01L19/04G01P15/093
    • A optical sensor assembly is disclosed that includes a sensor diaphragm configured to deflect responsive to an applied stimulus. The sensor assembly includes a first Extrinsic Fabry-Perot Interferometer (EFPI) having a first optical cavity in communication with at least a portion of the sensor diaphragm, the first EFPI is configured to interact with light to produce a combined measurement light signal and a first common-mode light signal, the measurement light signal corresponding to the applied stimulus. The sensor assembly also includes a second EFPI having a second optical cavity, the second EFPI is configured to interact with light to produce a second common mode light signal for error correction. The sensor assembly may further include a sensing optical fiber in communication with the first EFPI; a reference optical fiber in communication with the second EFPI; and a glass header configured to support the sensing optical fiber and the reference optical fiber.
    • 公开了一种光学传感器组件,其包括被配置为响应于所施加的刺激而偏转的传感器隔膜。 传感器组件包括具有与传感器膜片的至少一部分连通的第一光学腔的第一外部法布里 - 珀罗干涉仪(EFPI),第一EFPI被配置为与光相互作用以产生组合的测量光信号和第一 共模光信号,测量光信号对应于施加的刺激。 传感器组件还包括具有第二光腔的第二EFPI,第二EFPI被配置为与光相互作用以产生用于纠错的第二共模光信号。 传感器组件还可以包括与第一EFPI通信的感测光纤; 与第二EFPI通信的参考光纤; 以及玻璃接头,其被配置为支撑感测光纤和参考光纤。
    • 85. 发明授权
    • Load detection device
    • 负载检测装置
    • US09383271B2
    • 2016-07-05
    • US14394604
    • 2013-05-22
    • AISIN SEIKI KABUSHIKI KAISHA
    • Yasukuni OjimaNaoya Iesato
    • G01L1/04G01L1/22G01L5/22G01L9/00G01L5/16
    • G01L1/22G01L1/2231G01L5/161G01L5/223G01L9/0044G01L9/0051G01L9/0055
    • A highly sensitive load detection device includes a tubular peripheral wall portion; a disk-shaped disk portion that has a through hole formed coaxially with the peripheral wall portion and that is supported on an inner surface of the peripheral wall portion with a gap between the disk portion and a placement surface on which the peripheral wall portion is placed; a load input portion that is formed in a spherical shape having a diameter larger than an inside diameter of the through hole on at least a side thereof facing the through hole, that is placed on the through hole, and to which a load of an object to be detected is input; and sensors that are provided on the disk portion so as to be point-symmetric about the through hole, and that detect a strain corresponding to the load input to the load input portion.
    • 一种高灵敏度的载荷检测装置包括一个管状周壁部分; 盘形盘部,其具有与周壁部同轴地形成的贯通孔,并且在圆周部壁与放置面之间具有间隙地支撑在周壁部的内表面上 ; 负载输入部,其形成为直径大于通孔内径的球形,其至少一侧面向通孔,该通孔位于通孔上,并且物体的负载 被检测的是输入; 以及设置在所述盘部上以使所述通孔为点对称的传感器,并且检测与向所述负载输入部输入的负载相对应的应变。
    • 88. 发明申请
    • LOW PRESSURE SENSORS AND FLOW SENSORS
    • 低压传感器和流量传感器
    • US20150192487A1
    • 2015-07-09
    • US14150019
    • 2014-01-08
    • General Electric Company
    • Nickolai S. BelovLihua LiKim VuDinh Vu
    • G01L9/06B81C1/00G01L9/00
    • B81C1/00158B81B3/0072B81B2201/0264B81B2203/0127B81C2201/0133G01L9/0044G01L9/0047G01L19/0092G01L19/0618
    • Low pressure sensors and flow sensors are provided. In some embodiments, a pressure sensor can include a sensor die that includes a substrate and a cavity that is formed in a bottom side of the substrate and that defines an elastic element including a thin diaphragm area and a rigid island. A maximum thickness of the rigid island can be substantially smaller than a thickness of the substrate and can be greater than a thickness of the thin diaphragm area. Side walls of the rigid island can be substantially parallel to one another and can be substantially perpendicular to top and bottom surfaces of the wafer and substantially perpendicular to top and bottom surfaces of the die. The side walls of the at least one rigid island can be formed by wet etching the cavity into the die. The wafer can have an impurity diffused in one or more portions thereof prior to the wet etching such that the one or more portions are doped.
    • 提供低压传感器和流量传感器。 在一些实施例中,压力传感器可以包括传感器管芯,其包括衬底和形成在衬底的底侧中并且限定包括薄隔膜区域和刚性岛的弹性元件的空腔。 刚性岛的最大厚度可以基本上小于衬底的厚度,并且可以大于薄隔膜面积的厚度。 刚性岛的侧壁可以基本上彼此平行,并且可以基本上垂直于晶片的顶表面和底表面并且基本垂直于管芯的顶表面和底表面。 至少一个刚性岛的侧壁可以通过将腔浸入模具中而形成。 在湿蚀刻之前,晶片可以具有在其一个或多个部分中扩散的杂质,使得一个或多个部分被掺杂。