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1. 发明申请

US20190145844A1 PRESSURE TRANSDUCER WITH INTEGRAL BLEED VALVE 审中-公开
公开(公告)号：US20190145844A1
公开(公告)日：2019-05-16
申请号：US16184710
申请日：2018-11-08
申请人： KULITE SEMICONDUCTOR PRODUCTS, INC.
发明人： Louis DeRosa , Leo Geras , Robert Gardner
IPC分类号： G01L19/14
摘要： The disclosed technology is a pressure transducer with a bleed valve built into the body of the transducer for purging liquid systems. The transducer assembly includes a body, a bleed valve port defined in the body and configured to accept a bleed valve, an interface port attached to the body, an adapter attached to a portion of the interface port, a header attached to the adapter and the body, a pressure transducer mounted to the header, and an internal cavity in communication with the interface port, the pressure transducer, and the bleed valve port. The bleed valve port is configured to vent a gas from the internal cavity. A bleed valve disposed in the bleed valve port is configured to controllably vent a gas from the internal cavity.

2. 发明申请

US20210041318A1 HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS 有权
公开(公告)号：US20210041318A1
公开(公告)日：2021-02-11
申请号：US17079696
申请日：2020-10-26
申请人： KULITE SEMICONDUCTOR PRODUCTS, INC.
发明人： Alexander A. Ned , Leo Geras , Sorin Stefanescu
IPC分类号： G01L19/06 , G01L9/00 , G01L19/00 , G01L19/14
摘要： Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

3. 发明授权

US09772248B2 High pressure flat plate transducer 有权
公开(公告)号：US09772248B2
公开(公告)日：2017-09-26
申请号：US14659667
申请日：2015-03-17
申请人： Kulite SemiConductor Products, Inc.
发明人： Robert Gardner , Louis DeRosa , Leo Geras , Dick Martin
IPC分类号： G01L19/00 , G01L19/14
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/144 , Y10T29/49826 , Y10T29/49947
摘要： This disclosure provides example systems and methods for high pressure flat plate transducer assemblies. A first example embodiment of the transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can be configured for accepting the transducer and for mating with the housing at an interface between the header back side and the housing. The first embodiment of the transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing. A second example embodiment is provided that includes a one-piece housing having a built-in header portion configured for accepting the transducer. In this second embodiment, the interface adapter is configured for attaching to a mating surface and to the housing. In the second example embodiment, the transducer assembly is configured such that the pressure presses the transducer against the housing.

4. 发明授权

US09513181B2 Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments 有权
标题翻译：平面无铅压力传感器组件适用于极端环境中的操作
公开(公告)号：US09513181B2
公开(公告)日：2016-12-06
申请号：US14151775
申请日：2014-01-09
申请人： Kulite Semiconductor Products, Inc.
发明人： Alexander A. Ned , Joseph R. VanDeWeert , Leo Geras
IPC分类号： G01L13/02 , G01L15/00 , G01L9/00 , G01L19/06 , G01L19/00
CPC分类号： G01L19/0681 , G01L9/0044 , G01L9/0047 , G01L9/0048 , G01L9/0054 , G01L19/0076 , G01L19/0627 , Y10T29/49826
摘要： This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.
摘要翻译：本公开提供了与适于在极端环境中操作的平面覆盖的无铅压力传感器组件相关联的示例性方法，装置和系统。在一个实施例中，系统可以包括具有第一侧和第二侧的半导体衬底; 设置在所述半导体衬底的第一侧上的隔膜; 第一盖，其耦合到所述半导体基板的所述第一侧，使得其至少覆盖所述隔膜，其中施加在所述第一盖处的压力传递到所述隔膜; 以及设置在所述半导体衬底的第二侧上的感测元件，其中所述感测元件用于测量所述压力。

5. 发明申请

US20200011757A1 HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS 审中-公开
公开(公告)号：US20200011757A1
公开(公告)日：2020-01-09
申请号：US16552172
申请日：2019-08-27
申请人： KULITE SEMICONDUCTOR PRODUCTS, INC.
发明人： Alexander A. Ned , Leo Geras , Sorin Stefanescu
IPC分类号： G01L19/06 , G01L9/00 , G01L19/00
摘要： Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

6. 发明授权

US09739680B2 Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments 有权
公开(公告)号：US09739680B2
公开(公告)日：2017-08-22
申请号：US15339182
申请日：2016-10-31
申请人： KULITE SEMICONDUCTOR PRODUCTS, INC.
发明人： Alexander A. Ned , Joseph R. VanDeWeert , Leo Geras
IPC分类号： G01L7/08 , G01L19/06 , G01L9/00 , G01L19/00
CPC分类号： G01L19/0681 , G01L9/0044 , G01L9/0047 , G01L9/0048 , G01L9/0054 , G01L19/0076 , G01L19/0627 , Y10T29/49826
摘要： This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.

7. 发明申请

US20140123765A1 Flat Covered Leadless Pressure Sensor Assemblies Suitable for Operation in Extreme Environments 有权
标题翻译：平面无铅压力传感器组件适用于极端环境中的操作
公开(公告)号：US20140123765A1
公开(公告)日：2014-05-08
申请号：US14151775
申请日：2014-01-09
申请人： Kulite Semiconductor Products, Inc.
发明人： Alexander A. Ned , Joseph R. VanDeWeert , Leo Geras
IPC分类号： G01L9/00
CPC分类号： G01L19/0681 , G01L9/0044 , G01L9/0047 , G01L9/0048 , G01L9/0054 , G01L19/0076 , G01L19/0627 , Y10T29/49826
摘要： This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.
摘要翻译：本公开提供了与适于在极端环境中操作的平面覆盖的无铅压力传感器组件相关联的示例性方法，装置和系统。在一个实施例中，系统可以包括具有第一侧和第二侧的半导体衬底; 设置在所述半导体衬底的第一侧上的隔膜; 第一盖，其耦合到所述半导体基板的所述第一侧，使得其至少覆盖所述隔膜，其中施加在所述第一盖上的压力被传递到所述隔膜; 以及设置在所述半导体衬底的第二侧上的感测元件，其中所述感测元件用于测量所述压力。

8. 发明申请

US20190041288A1 HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS 审中-公开
公开(公告)号：US20190041288A1
公开(公告)日：2019-02-07
申请号：US15667117
申请日：2017-08-02
申请人： KULITE SEMICONDUCTOR PRODUCTS, INC.
发明人： Alexander A. Ned , Leo Geras , Sorin Stefanescu
IPC分类号： G01L19/06 , G01L9/00 , G01L19/00
CPC分类号： G01L19/0681 , G01L9/0042 , G01L9/0044 , G01L9/0048 , G01L9/0054 , G01L19/0069 , G01L19/0084 , G01L19/0627 , G01L19/147
摘要： Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.

9. 发明申请

US20170052084A1 Flat Covered Leadless Pressure Sensor Assemblies Suitable for Operation in Extreme Environments 有权
标题翻译：平面无铅压力传感器组件适用于极端环境中的操作
公开(公告)号：US20170052084A1
公开(公告)日：2017-02-23
申请号：US15339182
申请日：2016-10-31
申请人： KULITE SEMICONDUCTOR PRODUCTS, INC.
发明人： Alexander A. Ned , Joseph R. VanDeWeert , Leo Geras
IPC分类号： G01L19/06 , G01L9/00
CPC分类号： G01L19/0681 , G01L9/0044 , G01L9/0047 , G01L9/0048 , G01L9/0054 , G01L19/0076 , G01L19/0627 , Y10T29/49826
摘要： This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.
摘要翻译：本公开提供了与适于在极端环境中操作的平面覆盖的无铅压力传感器组件相关联的示例性方法，装置和系统。在一个实施例中，系统可以包括具有第一侧和第二侧的半导体衬底; 设置在所述半导体衬底的第一侧上的隔膜; 第一盖，其耦合到所述半导体基板的所述第一侧，使得其至少覆盖所述隔膜，其中施加在所述第一盖上的压力被传递到所述隔膜; 以及设置在所述半导体衬底的第二侧上的感测元件，其中所述感测元件用于测量所述压力。

10. 发明申请

US20150260603A1 HIGH PRESSURE FLAT PLATE TRANSDUCER 有权
标题翻译：高压平板传感器
公开(公告)号：US20150260603A1
公开(公告)日：2015-09-17
申请号：US14659667
申请日：2015-03-17
申请人： Kulite SemiConductor Products, Inc.
发明人： Robert Gardner , Louis DeRosa , Leo Geras , Dick Martin
IPC分类号： G01L19/14
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/144 , Y10T29/49826 , Y10T29/49947
摘要： This disclosure provides example systems and methods for high pressure flat plate transducer assemblies. A first example embodiment of the transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can be configured for accepting the transducer and for mating with the housing at an interface between the header back side and the housing. The first embodiment of the transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing. A second example embodiment is provided that includes a one-piece housing having a built-in header portion configured for accepting the transducer. In this second embodiment, the interface adapter is configured for attaching to a mating surface and to the housing. In the second example embodiment, the transducer assembly is configured such that the pressure presses the transducer against the housing.
摘要翻译：本公开提供了用于高压平板换能器组件的示例系统和方法。提供了换能器组件的第一示例性实施例，其包括换能器，壳体和换能器头部。换能器头部可以被配置成用于接收换能器并且在头部后侧和壳体之间的接口处与壳体配合。传感器组件的第一实施例被配置为使得施加在换能器上的压力压缩头部后侧和壳体之间的界面。提供了第二示例性实施例，其包括具有构造成用于接收换能器的内置头部部分的一体式壳体。在该第二实施例中，接口适配器构造成用于附接到配合表面和壳体。在第二示例性实施例中，换能器组件被配置成使得压力将换能器压靠在壳体上。

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