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    • 81. 发明申请
    • Diffusion furnace used for manufacturing integrated circuits and method for cooling the diffusion furnace
    • 用于制造集成电路的扩散炉和冷却扩散炉的方法
    • US20040154537A1
    • 2004-08-12
    • US10771747
    • 2004-02-03
    • Choung-Ku ChonDong-Hyun Choi
    • C23C016/00H01L021/44H01L021/04H01L021/22
    • H01L21/67109C30B25/08C30B31/10
    • A diffusion furnace includes a support member, a process chamber, a sealing member for sealing from the process chamber the outside, and a cooling system for cooling the sealing member. The process chamber is installed on the support member, and the sealing member is inserted between the support member and the chamber. The cooling system has a first fluid passage and a second fluid passage. The first and second fluid passages are formed in the support member. A first fluid flows in the first fluid passage to cool the sealing member, and a second fluid flows in the second fluid passage to cool the sealing member when the supply of the first fluid is interrupted. With the present invention, cooling water and a coolant can be prevented from being mixed together. Therefore, it is possible to prevent the contamination of an apparatus and the waste of expensive cooling water.
    • 扩散炉包括支撑构件,处理室,用于从处理室外部密封的密封构件和用于冷却密封构件的冷却系统。 处理室安装在支撑构件上,并且密封构件插入在支撑构件和腔室之间。 冷却系统具有第一流体通道和第二流体通道。 第一和第二流体通道形成在支撑构件中。 第一流体在第一流体通道中流动以冷却密封构件,并且当第一流体的供应被中断时,第二流体在第二流体通道中流动以冷却密封构件。 利用本发明,可以防止冷却水和冷却剂混合在一起。 因此,可以防止装置的污染和昂贵的冷却水的浪费。
    • 84. 发明授权
    • Device for the vacuum-tight connecting of two bodies of different materials
    • 用于真空密封连接两种不同材料的装置
    • US06412821B1
    • 2002-07-02
    • US09170091
    • 1998-10-13
    • Winfried SchulmannHelmut KaiserUdo Wenske
    • Winfried SchulmannHelmut KaiserUdo Wenske
    • F16L1700
    • C30B25/08C30B31/10F16L21/04F16L27/11Y10S285/911
    • A device for connecting two bodies, especially a quartz body and a metallic body, which assures with few and simply formed components a high sealing ability at high temperature differences and at very low pressures and makes possible an easy assembly and disassembly. The device for the vacuum-tight connecting of two bodies of different materials, each of which has an essentially tubular end section (20, 30) and in the connected state of which the tubular end section (30) of the first body surrounds at least partially the end section (20) of the second body, includes an intermediate conduit (13) for intermediate suction removal of gases and is formed between the tubular end sections (20, 30) of the bodies with two seals (100, 150) which seal off the intermediate conduit (130).
    • 一种用于连接两个主体,特别是石英体和金属体的装置,其确保在几个且简单形成的部件中在高温差和非常低的压力下具有高密封能力,并且可以容易地组装和拆卸。 用于真空紧密连接两个不同材料的主体的装置,每个主体具有基本上管状的端部部分(20,30),并且处于连接状态,第一主体的管状端部(30)至少包围 部分地是第二主体的端部部分(20)包括用于中间抽吸气体的中间管道(13),并且在主体的管状端部部分(20,30)之间形成有两个密封件(100,150),该密封件 密封中间导管(130)。
    • 90. 发明授权
    • Controlled diffusion environment capsule and system
    • 控制扩散环境胶囊和系统
    • US5178534A
    • 1993-01-12
    • US860560
    • 1992-03-30
    • Christopher J. BayneHarold C. Guiver
    • Christopher J. BayneHarold C. Guiver
    • C30B31/10C30B31/14C30B31/16
    • C30B31/10C30B31/14C30B31/16
    • A controlled diffusion environment capsule system (10) is used with a conventional tubular high temperature furnace (12) as employed in semiconductor manufacturing. The system (10) includes a cantilever boat loading apparatus (14) and a quartz diffusion capsule (16). Wafer carriers (20) support semiconductor wafers (22) concentrically with capsule (16) in closely spaced relationship for processing in the furnace (12). The diffusion capsule (16) is supported on a pair of quartz rods (24). A quartz injector tube (28) extends the length of the diffusion capsule (16). The injector tube (28) has three rows of high aspect-ratio apertures (30) extending along its length to disperse nitrogen or other inert gas uniformly across the sufaces (32) of the wafers (22). A quartz extender (34) is connected to the distal end of the diffusion capsule (16), through which reactant gases are supplied to the capsule (16) for diffusion and/or oxidation, from an inlet source (35) of the reactant gases on the furnace tube near the extender (34). The extender (34) has two apertured baffle plates (36) and (38) which have holes (40) and (42) in patterns that are offset relative to one another. A third plate (44) has a larger hole (46) at its center. The hole (46) focuses reactant gases into the capsule and the holes (40) and (42) provide turbulence to the reactant gas stream prior to its entry into the capsule (16) to assure uniform mixing.
    • 与半导体制造中使用的常规管状高温炉(12)一起使用受控扩散环境胶囊系统(10)。 系统(10)包括悬臂舟装载装置(14)和石英扩散胶囊(16)。 晶片载体(20)以与密封件(16)同心的方式支撑半导体晶片(22),用于在炉子(12)中进行加工。 扩散胶囊(16)被支撑在一对石英棒(24)上。 石英注射管(28)延伸扩散胶囊(16)的长度。 注射管(28)具有三列沿其长度延伸的高纵横比孔(30),以将氮气或其它惰性气体均匀地分散在晶片(22)的表面(32)上。 石英延长器(34)连接到扩散胶囊(16)的远端,反应气体从反应物气体的入口源(35)向反应气体供给到胶囊(16)以进行扩散和/或氧化, 在炉管附近的扩展器(34)上。 扩展器(34)具有两个有孔的挡板(36)和(38),其具有相对于彼此偏移的图案中的孔(40)和(42)。 第三板(44)在其中心具有较大的孔(46)。 孔(46)将反应物气体聚集到胶囊中,并且孔(40)和(42)在其进入胶囊(16)之前向反应物气流提供湍流以确保均匀混合。