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1. 发明申请

US20020124960A1 Substrate processing apparatus 审中-公开
标题翻译：基板加工装置
公开(公告)号：US20020124960A1
公开(公告)日：2002-09-12
申请号：US10083371
申请日：2002-02-27
申请人： Hitachi Kokusai Electric Inc.
发明人： Takanobu Nakashima , Tatsuhisa Matsunaga
IPC分类号： C23F001/00 , C23C016/00
CPC分类号： H01L21/67294 , C23C16/54 , H01L21/67772 , H01L21/67775
摘要： A substrate processing apparatus includes an opener including a closure, the opener for opening and restoring a cap of a wafer carrier, wherein the closure has three or more suction elements for holding the cap of the wafer carrier. More than two lines are required to connecting all the suction elements and a center of a largest polygon formed by lines connecting the suction elements substantially coincides with a center of the cap.
摘要翻译：基板处理装置包括开启器，其包括封闭件，用于打开和恢复晶片载体的盖的开启器，其中所述封闭件具有用于保持晶片载体的盖的三个或更多个抽吸元件。连接所有抽吸元件需要两条以上的线，并且由连接抽吸元件的线形成的最大多边形的中心基本上与盖的中心重合。

2. 发明申请

US20030077150A1 Substrate processing apparatus and a method for fabricating a semiconductor device by using same 审中-公开
标题翻译：基板处理装置及其制造方法
公开(公告)号：US20030077150A1
公开(公告)日：2003-04-24
申请号：US10255708
申请日：2002-09-27
申请人： Hitachi Kokusai Electric Inc.
发明人： Tomoyuki Matsuda , Ryuji Ishitsuka , Tatsuhisa Matsunaga , Kouichi Noto
IPC分类号： B65G049/07
CPC分类号： H01L21/67757 , H01L21/67201
摘要： A substrate processing apparatus includes a process room for treating one or more substrates, an antechamber of a loadlock type installed to be adjoined to the process room, and a buffer chamber installed to be adjoined to the antechamber, the buffer chamber being maintained at an atmospheric pressure while the one or more substrates are transferred from a carrier for accommodating the one or more substrates to the buffer chamber and at a vacuum condition while the one or more substrates are transferred from the buffer chamber to the antechamber. The buffer chamber is equipped with a loading port for loading the carrier at a top or a side portion thereof. The antechamber is equipped with a stocker for storing one or more product substrates or/and one or more dummy substrates therein. The elevator is arranged at a corner portion of the antechamber in order to reduce dead space.
摘要翻译：基板处理装置包括处理一个或多个基板的处理室，安装在与处理室相邻的负载锁型的前室，和与前室邻接安装的缓冲室，缓冲室保持在大气压同时一个或多个衬底从用于容纳一个或多个衬底的载体转移到缓冲室并且在真空状态下转移一个或多个衬底，同时一个或多个衬底从缓冲室转移到前室。缓冲室配备有用于在其顶部或侧部装载载体的装载口。前室装备有用于在其中存储一个或多个产品基板或/或一个或多个虚设基板的储料器。电梯设置在前厅的角部，以减少死空间。

3. 发明申请

US20010038783A1 Dual loading port semiconductor processing equipment 有权
标题翻译：双加载端口半导体加工设备
公开(公告)号：US20010038783A1
公开(公告)日：2001-11-08
申请号：US09834913
申请日：2001-04-16
申请人： Hitachi Kokusai Electric Inc.
发明人： Takanobu Nakashima , Tatsuhisa Matsunaga , Hidehiro Yanagawa
IPC分类号： B65G049/07
CPC分类号： H01L21/67772 , H01L21/67775 , Y10S414/14
摘要： A substrate processing equipment comprises two pod supporting stages and two independently operable pod door openers. Each pod supporting stage is capable of placing thereon a pod for containing substrates therein. Each pod door openers having means for permitting access to the substrates inside the pod placed on a corresponding pod supporting stage.
摘要翻译：基板处理设备包括两个荚支撑台和两个可独立操作的荚门开启器。每个荚支撑台能够在其上放置用于在其中容纳基底的荚。每个荚门开启器具有允许访问放置在相应的荚支撑台上的荚内的基底的装置。

4. 发明申请

US20040052618A1 Semiconductor device producing apparatus and producing method of semiconductor device 有权
标题翻译：半导体装置的制造装置及半导体装置的制造方法
公开(公告)号：US20040052618A1
公开(公告)日：2004-03-18
申请号：US10360597
申请日：2003-02-06
申请人： HITACHI KOKUSAI ELECTRIC INC.
发明人： Tatsuhisa Matsunaga , Hidehiro Yanagawa , Masaki Matsushima
IPC分类号： B65G001/00 , B65G049/07
CPC分类号： H01L21/67757 , Y10S414/137 , Y10S414/139
摘要： A semiconductor device producing apparatus comprises a carrier-holding stage at which a carrier is to be placed which accommodates a substrate or substrates; a processing chamber in which the substrate or the substrates are processed; a first stage which is to hold first and second boats one at a time which are respectively to hold the substrate or the substrates and which first stage is to move the first and second boats one at a time into and out from the processing chamber; a second stage which is to hold the first and second boats one at a time; a third stage which is to hold the first and second boats one at a time; a boat transfer mechanism which transfers the first and second boats between the first, second and third stages; a substrate transfer mechanism which transfers the substrate or substrates from the carrier placed at the carrier-holding stage to either one of the first and second boats which is held by the first stage; and a controller which controls the first stage; the boat transfer mechanism and the substrate transfer mechanism such that the boat transfer mechanism transfers one of the first and second boats from the second stage to the first stage, the wafer transfer mechanism thereafter transfers the substrate or the substrates from the carrier held at the carrier-holding stage to the one of the first and second boats held by the first stage, and the first stage thereafter moves the one of the first and second boats into the processing chamber to process the substrate or the substrates in the processing chamber.
摘要翻译：一种半导体器件制造装置，包括：托架保持台，载置台，容纳基板或基板; 处理所述基板或所述基板的处理室; 分别保持第一和第二船只分别保持基板或基板的第一阶段，并且第一阶段将一次一个地移动到处理室中并从处理室中移出第一台; 第二个阶段是一次把第一只和第二只船一个地保持在一起; 第三个阶段是一次把第一和第二个船一个一个地举行; 在第一，第二和第三阶段之间传送第一和第二船的船只传送机构; 基板传送机构，其将设置在载体保持台的载体的基板或基板转移到由第一载台保持的第一和第二船只中的任一个; 以及控制器，其控制第一阶段; 船传送机构和基板传送机构，使得船传送机构将第一和第二船中的一个从第二阶段转移到第一阶段，然后晶片传送机构从保持在载体处的载体传送基板或基板保持阶段到第一级保持的第一和第二船中的一个，然后第一级将第一和第二船中的一个移动到处理室中，以处理处理室中的基板或基板。

5. 发明申请

US20030183614A1 Heat treatment apparatus and method for processing substrates 有权
标题翻译：热处理装置及其处理方法
公开(公告)号：US20030183614A1
公开(公告)日：2003-10-02
申请号：US10395179
申请日：2003-03-25
申请人： HITACHI KOKUSAI ELECTRIC INC.
发明人： Takatomo Yamaguchi , Kazuhiro Morimitsu , Tatsuhisa Matsunaga
IPC分类号： F27D011/00 , F27B005/14
CPC分类号： H01L21/67303 , C30B31/10 , H01L21/67109
摘要： A heat treatment apparatus includes a vertically disposed process tube defining a reaction chamber therein; a main heater for heating the reaction chamber, the main heater being disposed outside of the process tube; a boat for holding a plurality of wafers, the boat being loaded into and unloaded from the reaction chamber; and a boat rotating device for rotating the boat. The boat rotating device is provided with a rotatable hollow shaft assembly and a fixed shaft coaxially disposed inside the rotatable hollow shaft assembly. A sub-heater is attached to an upper end of the fixed shaft, and the boat and an insulating portion are disposed on the rotatable hollow shaft assembly.
摘要翻译：一种热处理设备，包括在其中限定反应室的垂直设置的处理管; 用于加热反应室的主加热器，主加热器设置在处理管的外部; 用于保持多个晶片的船，所述船被装载到所述反应室中并从所述反应室卸载; 以及用于旋转船的船旋转装置。船用旋转装置设置有可旋转的空心轴组件和同轴地设置在可旋转中空轴组件内部的固定轴。副加热器附接到固定轴的上端，并且船和绝缘部分设置在可旋转的中空轴组件上。

6. 发明申请

US20030053893A1 Substrate processing apparatus and a method for fabricating a semiconductor device by using same 审中-公开
标题翻译：基板处理装置及其制造方法
公开(公告)号：US20030053893A1
公开(公告)日：2003-03-20
申请号：US10230181
申请日：2002-08-29
申请人： Hitachi Kokusai Electric Inc.
发明人： Tatsuhisa Matsunaga , Hiroshi Sekiyama , Kouichi Noto
IPC分类号： H01L021/205
CPC分类号： C23C16/54
摘要： A substrate processing apparatus includes at least two processing units provided around a substrate transfer chamber including a substrate transfer device for transferring substrates, wherein said at least two processing units include at least one batch processing unit, an M number of product substrates being processed simultaneously in one batch process with M being set to be less than or equal to the number of product substrates carried by a product substrate carrier, and all the product substrates contained in a product substrate carried by the product substrate carrier being processed in one batch process of said at least one batch processing unit. A method for fabricating a semiconductor device includes the step of sequentially processing plural product substrates in at least two processing units arranged around a substrate transfer chamber.
摘要翻译：基板处理装置包括设置在基板传送室周围的至少两个处理单元，所述基板传送室包括用于传送基板的基板传送装置，其中所述至少两个处理单元包括至少一个批处理单元，M个同时处理的产品基板将M设定为小于或等于由产品基板载体承载的产品基板的数量的一批次处理，并且由所述产品基板载体承载的产品基板中包含的所有产品基板在所述至少一个批处理单元。一种制造半导体器件的方法包括在布置在衬底传送室周围的至少两个处理单元中顺序地处理多个产品衬底的步骤。

7. 发明申请

US20040177926A1 Method and apparatus for processing substrates and method for manufacturing a semiconductor device 有权
标题翻译：用于处理衬底的方法和装置以及用于制造半导体器件的方法
公开(公告)号：US20040177926A1
公开(公告)日：2004-09-16
申请号：US10674345
申请日：2003-10-01
申请人： Hitachi Kokusai Electric Inc.
发明人： Tatsuhisa Matsunaga , Masahiro Teramoto , Norio Akutsu , Kouichi Noto
IPC分类号： C23F001/00
CPC分类号： H01L21/67757 , C23C16/54 , H01L21/28556 , H01L21/67781 , H01L21/68707
摘要： A substrate processing apparatus includes a housing, a process tube for performing variable batch processes on substrates, and product substrate carriers. The product substrate carriers have a capacity of a predetermined number of substrates. A number of the product substrates processed during one batch process are less than or equal to the predetermined number of the substrates. All of the product substrates contained in one product substrate carrier is processed in the process tube at a same time.
摘要翻译：基板处理装置包括壳体，用于在基板上进行可变批处理的处理管和产品基板载体。产品基板载体具有预定数量的基板的容量。在一个批处理过程中处理的许多产品基底小于或等于预定数量的基底。包含在一个产品衬底载体中的所有产品基底在处理管中同时被处理。

8. 发明申请

US20020037645A1 Method and apparatus for processing substrates and method for manufacturing a semiconductor device 有权
标题翻译：用于处理衬底的方法和装置以及用于制造半导体器件的方法
公开(公告)号：US20020037645A1
公开(公告)日：2002-03-28
申请号：US09963382
申请日：2001-09-27
申请人： Hitachi Kokusai Electric, Inc.
发明人： Tatsuhisa Matsunaga , Masahiro Teramoto , Norio Akutsu , Kouichi Noto
IPC分类号： H01L021/31 , H01L021/469 , C23C016/00 , H01L021/44
CPC分类号： H01L21/67757 , C23C16/54 , H01L21/28556 , H01L21/67781 , H01L21/68707
摘要： A substrate processing apparatus includes a housing, a process tube for performing variable batch processes on substrates, and product substrate carriers. The product substrate carriers have a capacity of a predetermined number of substrates. A number of the product substrates processed during one batch process are less than or equal to the predetermined number of the substrates. All of the product substrates contained in one product substrate carrier is processed in the process tube at a same time.
摘要翻译：基板处理装置包括壳体，用于在基板上进行可变批处理的处理管和产品基板载体。产品基板载体具有预定数量的基板的容量。在一个批处理过程中处理的许多产品基底小于或等于预定数量的基底。包含在一个产品衬底载体中的所有产品基底在处理管中同时被处理。

9. 发明申请

US20020037210A1 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US20020037210A1
公开(公告)日：2002-03-28
申请号：US09945643
申请日：2001-09-05
申请人： Hitachi Kokusai Electric Inc.
发明人： Tatsuhisa Matsunaga , Kouichi Noto
IPC分类号： B65G049/07
CPC分类号： H01L21/67757 , C23C16/54 , H01L21/67781 , Y10S414/137
摘要： A substrate processing apparatus includes a process tube for processing a plurality of substrates, two boats for accommodating the substrates, two boat elevators, a substrate transfer unit for loading and unloading the substrates into and from the boats when the boats are at the first position. In this apparatus, each boat elevator has one boat mounted thereon and each of the boat elevators carries a corresponding boat between a first position located below the process tube and two corresponding second positions. Each of the boat elevators performs loading and unloading the corresponding boat into and from the process tube at the first position. Further, in the apparatus, a center position of the process tube is disposed inside a triangle formed by connecting the substrate transfer unit and the two boat elevators.
摘要翻译：基板处理装置包括用于处理多个基板的处理管，用于容纳基板的两个船，两个船升降机，当船处于第一位置时，用于将基板装载和卸载到船上的基板传送单元。在该装置中，每个船用升降机具有安装在其上的一个船，并且每个船升降机在位于处理管下方的第一位置和两个对应的第二位置之间承载相应的船。每个船用电梯在第一位置上将相应的船进行加载和卸载。此外，在该装置中，处理管的中心位置设置在通过连接基板传送单元和两个船舶电梯形成的三角形内部。

10. 发明申请

US20030000476A1 Substrate processing apparatus, conveying unit thereof, and semiconductor device fabricating Method 审中-公开
标题翻译：基板处理装置及其输送单元及半导体装置的制造方法
公开(公告)号：US20030000476A1
公开(公告)日：2003-01-02
申请号：US10106200
申请日：2002-03-27
申请人： Hitachi Kokusai Electric Inc.
发明人： Tatsuhisa Matsunaga , Hiroshi Sekiyama
IPC分类号： C23C016/00
CPC分类号： H01L21/67757 , C23C16/54 , H01L21/67781
摘要： A substrate processing apparatus includes a process chamber, a sealed chamber arranged, a movable member disposed inside the sealed chamber, an extendable/contractible structure having a first and a second extendable/contractible member respectively disposed on both opposing sides of the movable member, and a driving mechanism, disposed in the extendable/contractible structure, for driving the movable member. The driving mechanism is isolated from an inner surface of the sealed chamber. The interiors of the first and the second extendable/contractible member communicate with an exterior of the sealed chamber.
摘要翻译：基板处理装置包括处理室，密封室，布置在密封室内的可动件，可伸缩结构，其具有分别设置在可移动件的两个相对侧上的第一和第二可伸缩构件;以及驱动机构，设置在可伸缩结构中，用于驱动可动件。驱动机构与密封室的内表面隔离。第一和第二可延伸/收缩构件的内部与密封室的外部连通。

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