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81. 发明申请

US20080047841A1 ELECTROPROCESSING PROFILE CONTROL 审中-公开
标题翻译：电子轮廓控制
公开(公告)号：US20080047841A1
公开(公告)日：2008-02-28
申请号：US11877223
申请日：2007-10-23
申请人： ANTOINE MANENS , Vladimir Galburt , Yan Wang , Alain Duboust , Donald Olgado , Liang-Yuh Chen
发明人： ANTOINE MANENS , Vladimir Galburt , Yan Wang , Alain Duboust , Donald Olgado , Liang-Yuh Chen
IPC分类号： C25F3/02 , C25F7/00
CPC分类号： B23H5/08 , B24B37/042 , C25D17/10 , C25F7/00
摘要： Embodiments of the present invention provide an apparatus for electrochemically processing a substrate. The apparatus comprises a processing layer having a surface adapted for processing a substrate thereon, a polishing head for retaining a substrate against the processing surface, a retaining ring a terminal adapted for coupling to a power source, and a plurality of independently biasable electrodes disposed below the processing layer.
摘要翻译：本发明的实施例提供了一种用于电化学处理衬底的装置。该装置包括具有适于在其上处理基板的表面的处理层，用于将基板保持在处理表面上的抛光头，保持环用于耦合到电源的端子和设置在电源下方的多个可独立施加的电极处理层。

82. 发明授权

US07329335B2 Device providing electrical contact to the surface of a semiconductor workpiece during processing 有权
标题翻译：在处理过程中提供与半导体工件的表面的电接触的装置
公开(公告)号：US07329335B2
公开(公告)日：2008-02-12
申请号：US10459323
申请日：2003-06-10
申请人： Homayoun Talieh , Cyprian Uzoh , Bulent M. Basol
发明人： Homayoun Talieh , Cyprian Uzoh , Bulent M. Basol
IPC分类号： B23H3/00 , C25F3/30 , B23H7/12
CPC分类号： B23H3/04 , B23H5/08 , C25D5/08 , C25D17/00 , C25D17/001 , C25D17/005 , C25F7/00 , H01L21/2885
摘要： Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
摘要翻译：可以通过包括第一和第二导电元件的特定装置来提供导电材料在包含导电材料的电解质的衬底的包括半导体晶片的表面上的基本均匀沉积。第一导电元件可以具有相同或不同构造的多个电触点，或者可以是导电焊盘的形式，并且可以在基本上所有的衬底表面上与衬底表面接触或以其他方式电互连。当在电解质与衬底表面和第二导电元件物理接触的同时在第一和第二导电元件之间施加电势时，导电材料沉积在衬底表面上。可以使施加在阳极和阴极之间的电压的极性反转，从而可以对沉积的导电材料进行电蚀刻。

83. 发明申请

US20070289878A1 Method and Device for Picking Metals 审中-公开
标题翻译：采摘金属的方法和装置
公开(公告)号：US20070289878A1
公开(公告)日：2007-12-20
申请号：US11632757
申请日：2005-07-11
申请人： Andreas Stepan , Juanito Horn
发明人： Andreas Stepan , Juanito Horn
IPC分类号： C25F1/06 , C25F7/00
CPC分类号： C25F1/06 , C25F7/00
摘要： A method and a device (13) are disclosed for the electrolytic pickling of flat metal products (2), in particular special steel and/or carbon steel strips. At least one diamond electrode and/or at least one lead/tin electrode, for example a lead 93/tin7 electrode (15) is used. The special characteristic of the diamond electrodes and/or lead/tin electrodes is the form of water replacement. Whereas in electrolysis water is usually split into hydrogen and oxygen, the diamond electrode and/or lead tin electrode provides a working range in which ozone or highly reactive hydroxyl radicals are formed instead of oxygen. As a result the pickling times are significantly reduced in comparison to the conventional chemical descaling, and also in comparison to the conventional electrolytic pickling.
摘要翻译：公开了用于平面金属产品（2）的电解酸洗的方法和装置（13），特别是特殊的钢和/或碳钢带。使用至少一个金刚石电极和/或至少一个引线/锡电极，例如引线93 /锡7电极（15）。金刚石电极和/或铅/锡电极的特殊特性是取代水的形式。而电解水通常分为氢和氧，金刚石电极和/或铅锡电极提供了形成臭氧或高反应性羟基自由基而不是氧的工作范围。结果，与常规化学除锈相比，酸洗时间显着降低，并且与传统的电解酸洗相比也是显着降低的。

84. 发明申请

US20070272562A1 Electrolytic Processing Apparatus and Electrolytic Processing Method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070272562A1
公开(公告)日：2007-11-29
申请号：US10560623
申请日：2004-07-14
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
IPC分类号： H01L21/3063
CPC分类号： C25F3/00 , C25F7/00
摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can effectively prevent the formation of pits that would impair the quality of the processed product. The electrolytic processing apparatus including: a processing electrode (210) for processing a workpiece; a feeding electrode (212) for feeding electricity to the workpiece; a power source (232) for applying a voltage between the processing electrode (210) and the feeding electrode (212); a pressure tight container (200) housing the processing electrode (210) and the feeding electrode (212) therein; and a high-pressure liquid supply system (204) for supplying a high-pressure liquid into the pressure tight container (210).
摘要翻译：本发明提供一种电解处理装置和电解处理方法，其可以有效地防止会影响加工产品质量的凹坑的形成。电解处理装置包括：处理工件的处理电极; 用于向工件供电的供电电极（212）; 用于在处理电极（210）和馈电电极（212）之间施加电压的电源（232）; 容纳所述处理电极（210）和所述馈电电极（212）的压力容器（200）; 以及用于将高压液体供应到耐压容器（210）中的高压液体供给系统（204）。

85. 发明申请

US20070209929A1 Electropolishing apparatus and method for medical implants 有权
标题翻译：医疗植入物的电抛光装置及方法
公开(公告)号：US20070209929A1
公开(公告)日：2007-09-13
申请号：US11803103
申请日：2007-05-11
申请人： Darin Schaeffer , Randy Myers
发明人： Darin Schaeffer , Randy Myers
IPC分类号： C25F3/16
CPC分类号： C25F7/00 , A61F2/91 , A61F2240/00 , C25F3/16
摘要： An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One of the advantages of the apparatus and method is that marks generated around the electrical contact between the anode and the medical implant are minimized. In addition, the medical implant is polished more evenly than conventional electropolishing systems.
摘要翻译：提供了用于抛光支架和其他医疗植入物的电抛光装置和方法。该装置包括使滚筒旋转的马达。滚筒将医疗植入物连续旋转以进行电解抛光。该装置和方法的优点之一是使阳极和医用植入物之间的电接触周围产生的标记最小化。此外，医疗植入物比常规电抛光系统更均匀地抛光。

86. 发明申请

US20070187259A1 Substrate processing apparatus and method 审中-公开
标题翻译：基板加工装置及方法
公开(公告)号：US20070187259A1
公开(公告)日：2007-08-16
申请号：US11715971
申请日：2007-03-09
申请人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
发明人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
IPC分类号： B23H5/00
CPC分类号： H01L21/6708 , C25F3/00 , C25F7/00
摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.
摘要翻译：基板处理装置可以执行与普通的常规蚀刻不同的电解处理，以去除（清除）形成在或附着于基板的斜面部分等上的导电材料（膜）或处理通过电化学作用的衬底的周边部分。基板处理装置包括：具有多个电极的电极部，该多个电极层叠有绝缘体，并且具有与基板的周边部相对的保持部; 设置在电极部的保持部中的离子交换部; 液体供应部分，用于将液体供应到电极部分的保持位置; 以及用于向电极部分的电极施加电压使得电极交替具有不同极性的电源。

87. 发明授权

US07252746B2 Electropolishing apparatus and method for medical implants 有权
公开(公告)号：US07252746B2
公开(公告)日：2007-08-07
申请号：US10712420
申请日：2003-11-12
申请人： Darin G. Schaeffer
发明人： Darin G. Schaeffer
IPC分类号： B23H9/04 , C25F3/16
CPC分类号： C25F7/00 , A61F2/91 , A61F2240/00 , C25F3/16
摘要： An electropolishing apparatus and method are provided for polishing stents and other medical implants. The apparatus includes a motor that rotates a roller. The roller continuously rotates the medical implant to be electropolished. One of the advantages of the apparatus and method is that marks generated around the electrical contact between the anode and the medical implant are minimized. In addition, the medical implant is polished more evenly than conventional electropolishing systems.

88. 发明申请

US20070125661A1 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication 审中-公开
标题翻译：控制集成电路制造中电解抛光工艺的去除率均匀性
公开(公告)号：US20070125661A1
公开(公告)日：2007-06-07
申请号：US10590460
申请日：2005-02-23
申请人： Hui Wang , Afnan Muhammed , Jian Wang , Felix Gutman , Frederick Ho , Himanshu Chocshi
发明人： Hui Wang , Afnan Muhammed , Jian Wang , Felix Gutman , Frederick Ho , Himanshu Chocshi
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , B24B37/04 , C25F3/02 , C25F5/00 , C25F7/00 , H01L21/32115
摘要： A metal layer formed on a wafer, the wafer having a center portion and an edge portion, is electropolished by aligning a nozzle and the wafer to position the nozzle adjacent to the center portion of the wafer. The wafer is rotated. As the wafer is rotated, a stream of electrolyte is applied from the nozzle onto a portion of the metal layer adjacent to the center portion of the wafer to begin to electropolish the portion of the metal layer with a triangular polishing profile to initially expose an underlying layer underneath the metal layer at a point.
摘要翻译：在晶片上形成的金属层（具有中心部分和边缘部分的晶片）通过对准喷嘴和晶片以将喷嘴定位成与晶片的中心部分相邻来进行电抛光。晶圆旋转。当晶片旋转时，电解质流从喷嘴施加到与晶片的中心部分相邻的金属层的一部分上，以开始以三角抛光轮廓对金属层的部分进行电解抛光，以最初暴露下面的在一点上金属层下方的层。

89. 发明申请

US20070111641A1 METHODS AND APPARATUS FOR ELECTROMECHANICALLY AND/OR ELECTROCHEMICALLY-MECHANICALLY REMOVING CONDUCTIVE MATERIAL FROM A MICROELECTRONIC SUBSTRATE 失效
标题翻译：用于电化学和/或电化学机械地从微电子基板去除导电材料的方法和装置
公开(公告)号：US20070111641A1
公开(公告)日：2007-05-17
申请号：US11616683
申请日：2006-12-27
申请人： Whonchee Lee , Scott Moore , Scott Meikle
发明人： Whonchee Lee , Scott Moore , Scott Meikle
IPC分类号： B24B7/30 , B24B51/00
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02 , C25F7/00
摘要： Methods and apparatuses for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate. An apparatus in accordance with one embodiment includes a support member configured to releasably carry a microelectronic substrate and first and second electrodes spaced apart from each other and from the microelectronic substrate. A polishing medium is positioned between the electrodes and the support member and has a polishing surface positioned to contact the microelectronic substrate. At least a portion of the first and second electrodes can be recessed from the polishing surface. A liquid, such as an electrolytic liquid, can be provided in the recess, for example, through flow passages in the electrodes and/or the polishing medium. A variable electrical signal is passed from at least one of the electrodes, through the electrolyte and to the microelectronic substrate to remove material from the substrate.
摘要翻译：从微电子衬底机电和/或电化学机械去除导电材料的方法和装置。根据一个实施例的装置包括被配置为可释放地携带微电子衬底和彼此间隔开的微电子衬底的第一和第二电极的支撑构件。抛光介质位于电极和支撑构件之间，并且具有定位成接触微电子衬底的抛光表面。第一和第二电极的至少一部分可以从抛光表面凹陷。诸如电解液体的液体可以例如通过电极和/或抛光介质中的流动通道设置在凹部中。可变电信号从至少一个电极通过电解质并传递到微电子衬底以从衬底去除材料。

90. 发明申请

US20070052977A1 Method and apparatus for end-point detection 审中-公开
标题翻译：端点检测方法和装置
公开(公告)号：US20070052977A1
公开(公告)日：2007-03-08
申请号：US11595311
申请日：2006-11-10
申请人： Hui Wang
发明人： Hui Wang
IPC分类号： G01B11/28
CPC分类号： B24B49/10 , B24B37/013 , C25F3/22 , C25F7/00 , G01N21/55 , H01L21/32115 , H01L21/32134 , H01L21/7684
摘要： An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.
摘要翻译：用于检测形成在晶片上的金属层的电解抛光工艺的端点的装置包括端点检测器。端点检测器设置在用于电抛光晶片的喷嘴附近。在一个实施例中，端点检测器被配置为测量正被电抛光的晶片的部分的光学反射率。

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