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81. 发明申请

US20110017702A1 METHOD OF MANUFACTURE OF AN ELECTRODE FOR A FUEL CELL 有权
标题翻译：燃料电池电极的制造方法
公开(公告)号：US20110017702A1
公开(公告)日：2011-01-27
申请号：US12866161
申请日：2008-10-03
申请人： William John Waugh , Alan MacDonald Davidson
发明人： William John Waugh , Alan MacDonald Davidson
IPC分类号： B05D3/10 , B05D5/12 , B05D3/14 , B05D3/00
CPC分类号： C23C18/1605 , C23C18/1662 , C23C18/1879 , C23C18/285 , C23C18/30 , H01M4/8821 , H01M4/8853 , H01M4/9016 , H01M2008/1293
摘要： A method of manufacture of an electrode for a fuel cell, the method comprising at least the steps of: (a) providing an electrode substrate; (b) contacting at least a part of the electrode substrate with an electroless plating solution comprising a reducing agent, a metal precursor and a suspension of particulate material; and (c) electrolessly plating the metal from the metal precursor onto the contacted part of the electrode substrate, thereby co-depositing the particulate material on the contacted part of the electrode substrate to provide the electrode.
摘要翻译：一种制造燃料电池用电极的方法，所述方法至少包括以下步骤：（a）提供电极基板; （b）使电极基板的至少一部分与包含还原剂，金属前体和颗粒材料的悬浮液的化学镀溶液接触; 和（c）将金属从金属前体无电镀敷到电极基板的接触部分上，从而将该颗粒材料共沉积在电极基板的接触部分上以提供电极。

82. 发明授权

US07867686B2 Metal deposition 有权
标题翻译：金属沉积
公开(公告)号：US07867686B2
公开(公告)日：2011-01-11
申请号：US10588945
申请日：2005-02-10
申请人： Michael J. Banach , John Mills , James Watts , Alan Lionel Hudd , James Edward Fox , Philip Gareth Bentley
发明人： Michael J. Banach , John Mills , James Watts , Alan Lionel Hudd , James Edward Fox , Philip Gareth Bentley
IPC分类号： G03F7/00 , G03F7/20 , B05D3/00 , G21H5/00
CPC分类号： C23C18/30 , C23C18/1608 , C23C18/1612 , C23C18/1865 , C23C18/1868 , C23C18/1879 , C23C18/1882 , C23C18/1893 , C23C18/204 , C23C18/206 , C23C18/2066 , C23C18/2086 , C23C18/405 , H01L51/0022 , H01L51/102 , H05K3/185 , Y10T29/49117 , Y10T428/24917
摘要： A method for electroless plating of metal on a laser-patterned substrate. A substrate is provided on which both a thermal imaging layer and catalytic layer are deposited. On exposure to a laser beam, sufficient levels of radiation are converted to heat in the thermal imaging layer to render the exposed regions of the adjacent catalytic layer inactive. The laser-patterned substrate is then exposed to a reaction solution which initiates the growth of a metal film on the unexposed regions of the catalytic layer.
摘要翻译：在激光图案化基板上进行金属化学镀的方法。提供了其上沉积有热成像层和催化剂层的衬底。在暴露于激光束时，足够的辐射水平被转换成热成像层中的热量，以使相邻催化剂层的暴露区域不起作用。然后将激光图案化的衬底暴露于反应溶液，其引发金属膜在催化剂层的未曝光区域上的生长。

83. 发明申请

US20100323115A1 METALLIZATION OF DIELECTRICS 审中-公开
标题翻译：电介质金属化
公开(公告)号：US20100323115A1
公开(公告)日：2010-12-23
申请号：US12862574
申请日：2010-08-24
申请人： Frank Scaraglino , Walter Sommer , Neil D. Brown , Kai Wang
发明人： Frank Scaraglino , Walter Sommer , Neil D. Brown , Kai Wang
IPC分类号： B05D1/36 , B05D1/00
CPC分类号： C23C18/48 , C23C18/1653 , C23C18/208 , C23C18/30 , C25D5/54 , Y10T428/31678
摘要： A composition and method are disclosed. The composition both conditions and activates a dielectric material for metal deposition. The metal may be deposited on the dielectric by electroless methods. The metallized dielectric may be used in electronic devices.
摘要翻译：公开了组合物和方法。组合物既条件又激活用于金属沉积的介电材料。金属可以通过无电镀方法沉积在电介质上。金属化电介质可以用于电子器件。

84. 发明申请

US20100294539A1 ELECTRICALLY CONDUCTIVE MICROPARTICLE, ANISOTROPIC ELECTRICALLY CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE MICROPARTICLE 有权
标题翻译：导电导电微电解电路，电导电导体材料，连接结构及电导电微生物的制造方法
公开(公告)号：US20100294539A1
公开(公告)日：2010-11-25
申请号：US12734162
申请日：2008-10-24
申请人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
发明人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
IPC分类号： H01B5/14 , H01B1/22 , B05D5/12
CPC分类号： H05K3/323 , C23C18/1635 , C23C18/2086 , C23C18/30 , C23C18/38 , C23C18/40 , C23C18/405 , C25D5/56 , H01B1/22 , H01R13/035 , H05K2201/0221
摘要： It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.
摘要翻译：本发明的目的是提供一种具有低初始连接电阻并且即使长时间存放也难以增加连接电阻的导电颗粒。本发明是一种导电性粒子，其特征在于，在树脂粒子的表面形成有铜层，其特征在于，在铜层中，与厚度方向的截面相对应的面积的面积比为5％以下，构成铜层的铜的平均微晶直径为40nm以上。

85. 发明申请

US20100247880A1 NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL 审中-公开
标题翻译：新型共聚物，新型含共聚物的组合物，层合体，金属薄膜包覆材料的制造方法，金属薄膜包覆材料，金属型材承载材料和金属型材承载材料的制造方法
公开(公告)号：US20100247880A1
公开(公告)日：2010-09-30
申请号：US12749531
申请日：2010-03-30
申请人： Takeyoshi KANO , Tomomi TATEISHI , Tokihiko MATSUMURA
发明人： Takeyoshi KANO , Tomomi TATEISHI , Tokihiko MATSUMURA
IPC分类号： B32B3/10 , C08F222/30 , C08L39/00 , B32B27/00 , B32B15/08 , C25D5/56
CPC分类号： C08F222/30 , B32B27/28 , C08F220/60 , C23C18/1641 , C23C18/1653 , C23C18/30 , Y10T428/24917 , Y10T428/31504 , Y10T428/31678
摘要： There is provided a polymer containing a unit represented by the following Formula (1), and a unit represented by following Formula (2). In Formula (1) and Formula (2), R1 to R5 each independently represent a hydrogen atom, a substituted or unsubstituted alkyl group; R6 represents an unsubstituted alkyl group, alkenyl group, alkynyl group or an aryl group; V and Z each independently represent a single bond, a substituted or unsubstituted divalent organic group, an ester group, an amide group or an ether group, and L1 and L2 each independently represent a substituted or unsubstituted divalent organic group.
摘要翻译：提供含有由下式（1）表示的单元的聚合物和由下式（2）表示的单元。在式（1）和式（2）中，R 1至R 5各自独立地表示氢原子，取代或未取代的烷基; R6表示未取代的烷基，烯基，炔基或芳基; V和Z各自独立地表示单键，取代或未取代的二价有机基团，酯基，酰胺基或醚基，L1和L2各自独立地表示取代或未取代的二价有机基团。

86. 发明申请

US20100221545A1 COATED CONDUCTIVE POWDER AND CONDUCTIVE ADHESIVE USING THE SAME 有权
标题翻译：涂层导电粉末和导电胶粘剂使用它
公开(公告)号：US20100221545A1
公开(公告)日：2010-09-02
申请号：US12738029
申请日：2008-10-21
申请人： Shinji Abe
发明人： Shinji Abe
IPC分类号： B32B17/02 , B32B27/02 , B32B15/02
CPC分类号： H01B1/22 , C08K3/10 , C08K5/3445 , C09J9/02 , C09J163/00 , C23C18/1635 , C23C18/1651 , C23C18/1689 , C23C18/30 , C23C18/32 , C23C18/42 , H05K3/323 , H05K2201/0209 , H05K2201/0224 , Y10T428/2991 , Y10T428/2993 , Y10T428/2996 , Y10T428/2998
摘要： It is an object of the present invention to provide a coated conductive powder particularly useful as the conductive filler of an anisotropic conductive adhesive used for electrically interconnecting circuit boards, circuit parts, and the like, and a conductive adhesive that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with an insulating substance, wherein the insulating substance is a powdery, thermally latent curing agent. Also, in the present invention, the particle surfaces of the coated conductive powder are further coated with insulating inorganic fine particles.
摘要翻译：本发明的目的是提供一种特别用作用于将电路板，电路部件等电连接的各向异性导电粘合剂的导电填料特别有用的涂覆导电粉末，以及可提供与高电气连接的导电粘合剂即使对于诸如IC芯片的小型化电子部件的电极和电路板的连接也是可靠的。本发明的涂覆导电粉末是通过用绝缘物质涂覆导电颗粒的表面而获得的涂覆的导电粉末，其中绝缘物质是粉末状的热潜固化剂。此外，在本发明中，涂覆的导电粉末的颗粒表面进一步涂覆绝缘无机细颗粒。

87. 发明申请

US20100143727A1 Method for Partially Metallizing a Product 失效
标题翻译：部分金属化产品的方法
公开(公告)号：US20100143727A1
公开(公告)日：2010-06-10
申请号：US11992339
申请日：2006-09-22
申请人： Roland Anthony Tacken , Franky Flory Vercauteren , Hendrik Rendering
发明人： Roland Anthony Tacken , Franky Flory Vercauteren , Hendrik Rendering
IPC分类号： B32B15/04 , B05D3/00 , B05D5/00
CPC分类号： C23C18/2086 , C23C18/1608 , C23C18/30 , Y10T428/12569 , Y10T428/12576 , Y10T428/1352 , Y10T428/31678 , Y10T428/31692 , Y10T428/31855
摘要： Method for metallizing a product (11) comprising a first component (12) and a second component (13). The product is exposed to a first environment (14) causing the surface of the first component to be hydrophilic and the surface of the second component to be hydrophobic. The product is exposed to a watery solution (15a). Next, the product is exposed to a solution (17a) of a film former and subsequently to a second environment (17b), wherein the solvent evaporates and a film (18) is formed covering the whole product, while maintaining the water film under the film. The product then is rinsed out (17c), causing that the film is removed at the locations of the hydrophilic surface of the first component. Next, the product is nucleated, thus forming a nuclei layer (20) and subsequently the film is removed (19b) only leaving the nuclei layer at the hydrophilic surface of the first component. Finally, the surface of the product is exposed to a metallizing environment (21), causing a metallized layer (22) upon the surface of (only) the first component.
摘要翻译：用于金属化包括第一部件（12）和第二部件（13）的产品（11）的方法。产品暴露于第一环境（14），导致第一组分的表面是亲水性的，并且第二组分的表面是疏水的。将产物暴露于水溶液（15a）。接下来，将产品暴露于成膜剂的溶液（17a），然后暴露于第二环境（17b），其中溶剂蒸发并形成覆盖整个产品的膜（18），同时将水膜保持在电影。然后将产品冲洗掉（17c），导致在第一组分的亲水表面的位置处除去膜。接下来，产物成核，从而形成核层（20），随后除去膜（19b），仅使细胞核层留在第一组分的亲水表面。最后，产品的表面暴露于金属化环境（21），从而在（仅）第一组分的表面上形成金属化层（22）。

88. 发明申请

US20100113264A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM 有权
标题翻译：导电性物质 - 吸附树脂膜，用于生产导电性物质 - 吸附树脂膜的方法，使用其的金属层涂覆树脂膜以及用于生产金属层涂树脂膜的方法
公开(公告)号：US20100113264A1
公开(公告)日：2010-05-06
申请号：US12593922
申请日：2008-01-11
申请人： Mitsuyuki Tsurumi , Shiki Ueki
发明人： Mitsuyuki Tsurumi , Shiki Ueki
IPC分类号： B01J20/26 , B32B37/14 , B32B38/04
CPC分类号： H05K3/387 , C23C18/1641 , C23C18/1653 , C23C18/1658 , C23C18/206 , C23C18/208 , C23C18/2086 , C23C18/24 , C23C18/26 , C23C18/285 , C23C18/30 , C25D5/56 , H05K1/0393 , H05K3/105 , H05K3/426 , H05K2203/1105 , H05K2203/1157 , H05K2203/121 , Y10T156/1052 , Y10T156/1062
摘要： The invention provides a conductive substance-adsorbing resin film on which a conductive layer being excellent in adhesion to the resin film and having less unevenness at the interface with the resin film can easily be formed, a method for producing the same, a metal layer-coated resin film on which a high definition wiring excellent in adhesion to the insulating resin film can easily be formed, which is obtained by using the conductive substance-adsorbing resin film of the invention, and a method for producing a metal layer-coated resin film that is a material capable of easily producing a printed-wiring board having a high definition wiring. The invention also provides a conductive substance-adsorbing resin film including at least two resin layers, wherein at least one of the resin layers is an adsorbing resin layer having a property of adsorbing a conductive substance or a metal. This conductive substance-adsorbing resin film is allowed to adsorb a metal and subjected to plating, whereby a metal layer-coated resin film can be obtained.
摘要翻译：本发明提供一种导电性物质吸附树脂膜，其中可以容易地形成其与树脂膜的粘附性优异并且在与树脂膜的界面处具有较小不均匀性的导电层，其制造方法，金属层 - 通过使用本发明的导电性物质吸附树脂膜可以容易地形成具有优异的与绝缘树脂膜的粘附性的高分辨率布线的涂布树脂膜，以及金属层涂覆树脂膜的制造方法这是能够容易地制造具有高清晰度布线的印刷电路板的材料。本发明还提供一种包含至少两个树脂层的导电物质吸附树脂膜，其中至少一个树脂层是具有吸附导电物质或金属的吸附树脂层。使该导电性物质吸附树脂膜吸附金属并进行电镀，由此可以得到金属层被覆的树脂膜。

89. 发明申请

US20100092739A1 COATING FOR MICROWAVABLE FOOD PRODUCT 审中-公开
公开(公告)号：US20100092739A1
公开(公告)日：2010-04-15
申请号：US12520934
申请日：2007-12-21
申请人： Anton Kaasjager , Arjan Hovestad , Hein Jager
发明人： Anton Kaasjager , Arjan Hovestad , Hein Jager
IPC分类号： C23C18/30 , A41D10/00 , A41D1/00 , G01R27/28 , H01Q1/36
CPC分类号： C23C18/1608 , C23C18/2006 , C23C18/206 , C23C18/30 , C23C18/31 , D06M10/025 , D06M10/06 , D06M11/83 , D06M23/16 , Y10T428/24917
摘要： The invention relates to an aqueous composition for preparing an edible coating on a microwavable food, which composition comprises at least one prolamin and at least one hydrocolloid or gelling agent. The invention further relates to a microwavable food comprising an edible coating, which coating comprises at least one prolamin and at least one hydrocolloid or gelling agent.

90. 发明申请

US20100080969A1 METHOD FOR METALLIZING A COMPONENT 审中-公开
标题翻译：用于金属化元件的方法
公开(公告)号：US20100080969A1
公开(公告)日：2010-04-01
申请号：US12441578
申请日：2007-09-25
申请人： Jacob Koenen , Luc Elza Florent Leemans
发明人： Jacob Koenen , Luc Elza Florent Leemans
IPC分类号： B32B3/10 , B05D5/00 , B32B15/08 , C23C18/20
CPC分类号： C23C18/1608 , C23C18/1641 , C23C18/208 , C23C18/285 , C23C18/30 , Y10T428/24917 , Y10T428/31681
摘要： The invention relates to a method for metallizing a component comprising a first part constituted of a polyester comprising thermoplastic composition first material, and a second part constituted by a polyamide comprising thermoplastic composition, wherein a metallizing seed layer is applied, the component is exposed to an discriminating etching liquid, and thereafter exposed to a metallizing environment The invention also relates to a metallized component obtainable by said method.
摘要翻译：本发明涉及一种用于金属化部件的方法，包括由包含热塑性组合物第一材料的聚酯构成的第一部分和由包含热塑性组合物的聚酰胺构成的第二部分，其中施加金属化种子层，将该组分暴露于识别蚀刻液体，然后暴露于金属化环境本发明还涉及可通过所述方法获得的金属化部件。

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