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1. 发明授权

US08981226B2 Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle 有权
标题翻译：导电性微粒，各向异性导电材料，连接结构以及导电性微粒的制造方法
公开(公告)号：US08981226B2
公开(公告)日：2015-03-17
申请号：US12734162
申请日：2008-10-24
申请人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
发明人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
IPC分类号： H01B5/14 , H01B1/22 , B05D5/12 , H05K3/32 , C23C18/16 , C23C18/30 , C23C18/38 , C23C18/40 , C25D5/56 , H01R13/03 , C23C18/20
CPC分类号： H05K3/323 , C23C18/1635 , C23C18/2086 , C23C18/30 , C23C18/38 , C23C18/40 , C23C18/405 , C25D5/56 , H01B1/22 , H01R13/035 , H05K2201/0221
摘要： The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.
摘要翻译：本发明是在树脂粒子的表面形成有铜层的导电性粒子，其特征在于，在铜层中，与厚度方向的截面相当的空隙面积的面积率为5％以下，构成铜层的铜的平均微晶直径为40nm以上。本发明的目的是提供一种具有低初始连接电阻并且即使长时间存放也难以增加连接电阻的导电颗粒。

2. 发明授权

US08609246B2 Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure 有权
标题翻译：导电细颗粒，各向异性导电材料和导电连接结构
公开(公告)号：US08609246B2
公开(公告)日：2013-12-17
申请号：US12450704
申请日：2008-03-31
申请人： Ren-de Sun , Kiyoto Matsushita , Taku Sasaki , Shinya Uenoyama , Masaki Okuda , Nobuyuki Okinaga
发明人： Ren-de Sun , Kiyoto Matsushita , Taku Sasaki , Shinya Uenoyama , Masaki Okuda , Nobuyuki Okinaga
IPC分类号： B32B15/02
CPC分类号： H05K3/323 , B23K35/262 , B23K2101/36 , C23C18/1635 , C23C18/1653 , C23C18/1692 , C23C18/30 , C23C18/34 , C23C18/54 , H01L24/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29311 , H01L2224/2939 , H01L2224/29411 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01R13/03 , H05K2201/0221 , H05K2203/0425 , Y10T428/2982 , Y10T428/2998 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00012 , H01L2924/00014
摘要： A conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.
摘要翻译：导电性细颗粒，用于细电极之间的导电连接，并且即使具有落下冲击，也不会引起焊料层中的裂纹或由于电极和导电性细颗粒之间的连接界面的断裂而导致的断开，即使在重复加热和冷却之后也不会有疲劳; 通过使用导电性微粒获得的各向异性导电材料; 和导电连接结构。

3. 发明授权

US07410698B2 Conductive particle with protrusions and anisotropic conductive material therefrom 有权
标题翻译：具有突起的导电粒子及其各向异性导电材料
公开(公告)号：US07410698B2
公开(公告)日：2008-08-12
申请号：US10559688
申请日：2005-01-27
申请人： Hiroya Ishida , Takeshi Wakiya , Shinya Uenoyama
发明人： Hiroya Ishida , Takeshi Wakiya , Shinya Uenoyama
IPC分类号： B32B5/16
CPC分类号： H01R13/03 , B22F1/025 , B22F2999/00 , C23C18/1635 , C23C18/1641 , C23C18/30 , H05K3/323 , H05K2201/0218 , H05K2201/0272 , Y10T428/12181 , Y10T428/24612 , Y10T428/2991 , C23C18/16
摘要： A conductive particle having a low connection resistance, a small variation of conduction performance, and excellent conduction reliability and an anisotropic conductive material using such particles are disclosed. Conventional anisotropic conductive materials using conductive particles are used in the form that they are interposed between opposed boards or between opposed electrode terminals of electronic devices such as mobile telephones. However, as electronic devices have been recently developing, enhancement of the conduction reliability of the conductive particles used for the anisotropic conductive materials have been required. The surface (2) of the base particle of a conductive particle (1) of the invention used for an anisotropic conductive material is covered with a conductive film or films (4, 5). The conductive particle (1) has projections (5b) projecting from the conductive film or films. A core material (3)for projecting the surface of the conductive film is provided on the surface of the base particle. The core material (3) is different from the conductive material of the conductive films. By thus using such conductive particles, the conduction reliability is enhanced.
摘要翻译：公开了具有低连接电阻，导电性能变化小，导电可靠性优异的导电颗粒和使用这种颗粒的各向异性导电材料。使用导电颗粒的传统的各向异性导电材料以它们被插入相对的板之间或电子设备例如移动电话的相对的电极端子之间的形式使用。然而，随着电子器件近来的发展，需要提高用于各向异性导电材料的导电粒子的导电可靠性。用于各向异性导电材料的本发明的导电颗粒（1）的基础颗粒的表面（2）被导电膜或膜（4,5）覆盖。导电粒子（1）具有从导电膜或膜突出的突起（5b）。在基体颗粒的表面上设置用于投射导电膜表面的芯材（3）。芯材（3）与导电膜的导电材料不同。通过这样使用这样的导电粒子，可以提高导通可靠性。

4. 发明申请

US20070092698A1 Conductive particle and anisotropic conductive material 有权
标题翻译：导电颗粒和各向异性导电材料
公开(公告)号：US20070092698A1
公开(公告)日：2007-04-26
申请号：US10559688
申请日：2005-01-27
申请人： Hiroya Ishida , Takeshi Wakiya , Shinya Uenoyama
发明人： Hiroya Ishida , Takeshi Wakiya , Shinya Uenoyama
IPC分类号： B32B1/00 , B32B3/00
CPC分类号： H01R13/03 , B22F1/025 , B22F2999/00 , C23C18/1635 , C23C18/1641 , C23C18/30 , H05K3/323 , H05K2201/0218 , H05K2201/0272 , Y10T428/12181 , Y10T428/24612 , Y10T428/2991 , C23C18/16
摘要： A conductive particle having a low connection resistance, a small variation of conduction performance, and excellent conduction reliability and an anisotropic conductive material using such particles are disclosed. Conventional anisotropic conductive materials using conductive particles are used in the form that they are interposed between opposed boards or between opposed electrode terminals of electronic devices such as mobile telephones. However, as electronic devices have been recently developing, enhancement of the conduction reliability of the conductive particles used for the anisotropic conductive materials have been required. The surface (2) of the base particle of a conductive particle (1) of the invention used for an anisotropic conductive material is covered with a conductive film or films (4, 5). The conductive particle (1) has projections (5b) projecting from the conductive film or films. A core material (3) for projecting the surface of the conductive film is provided on the surface of the base particle. The core material (3) is different from the conductive material of the conductive films. By thus using such conductive particles, the conduction reliability is enhanced.
摘要翻译：公开了具有低连接电阻，导电性能变化小，导电可靠性优异的导电颗粒和使用这种颗粒的各向异性导电材料。使用导电颗粒的传统的各向异性导电材料以它们被插入相对的板之间或电子设备例如移动电话的相对的电极端子之间的形式使用。然而，随着电子器件近来的发展，需要提高用于各向异性导电材料的导电粒子的导电可靠性。用于各向异性导电材料的本发明的导电颗粒（1）的基础颗粒的表面（2）被导电膜或膜（4,5）覆盖。导电粒子（1）具有从导电膜或膜突出的突起（5b）。在基体颗粒的表面上设置用于投射导电膜表面的芯材（3）。芯材（3）与导电膜的导电材料不同。通过这样使用这样的导电粒子，可以提高导通可靠性。

5. 发明申请

US20100294539A1 ELECTRICALLY CONDUCTIVE MICROPARTICLE, ANISOTROPIC ELECTRICALLY CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE MICROPARTICLE 有权
标题翻译：导电导电微电解电路，电导电导体材料，连接结构及电导电微生物的制造方法
公开(公告)号：US20100294539A1
公开(公告)日：2010-11-25
申请号：US12734162
申请日：2008-10-24
申请人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
发明人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
IPC分类号： H01B5/14 , H01B1/22 , B05D5/12
CPC分类号： H05K3/323 , C23C18/1635 , C23C18/2086 , C23C18/30 , C23C18/38 , C23C18/40 , C23C18/405 , C25D5/56 , H01B1/22 , H01R13/035 , H05K2201/0221
摘要： It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.
摘要翻译：本发明的目的是提供一种具有低初始连接电阻并且即使长时间存放也难以增加连接电阻的导电颗粒。本发明是一种导电性粒子，其特征在于，在树脂粒子的表面形成有铜层，其特征在于，在铜层中，与厚度方向的截面相对应的面积的面积比为5％以下，构成铜层的铜的平均微晶直径为40nm以上。

6. 发明申请

US20100112353A1 ELECTROCONDUCTIVE FINE PARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND ELECTROCONDUCTIVE CONNECTION STRUCTURE 有权
标题翻译：电磁精细颗粒，非均质电极材料和电磁连接结构
公开(公告)号：US20100112353A1
公开(公告)日：2010-05-06
申请号：US12450704
申请日：2008-03-31
申请人： Ren-de Sun , Kiyoto Matsushita , Taku Sasaki , Shinya Uenoyama , Masaki Okuda , Nobuyuki Okinaga
发明人： Ren-de Sun , Kiyoto Matsushita , Taku Sasaki , Shinya Uenoyama , Masaki Okuda , Nobuyuki Okinaga
IPC分类号： B32B15/02
CPC分类号： H05K3/323 , B23K35/262 , B23K2101/36 , C23C18/1635 , C23C18/1653 , C23C18/1692 , C23C18/30 , C23C18/34 , C23C18/54 , H01L24/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29311 , H01L2224/2939 , H01L2224/29411 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01R13/03 , H05K2201/0221 , H05K2203/0425 , Y10T428/2982 , Y10T428/2998 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00012 , H01L2924/00014
摘要： It is an object of the present invention to provide: a conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.The present invention relates to a conductive fine particle, which comprises a solder layer containing tin and being formed on a surface of a resin fine particle, with nickel adhered to a surface of the solder layer, and contains 0.0001 to 5.0% by weight of the nickel with respect to a total of a metal contained in the solder layer and the nickel adhered to the surface of the solder layer.
摘要翻译：本发明的目的是提供：导电性微粒，用于在细电极之间进行导电连接，并且不会引起焊料层中的裂纹或由电极之间的连接界面中的断裂引起的断开导电性细颗粒即使具有液滴冲击等，并且即使在重复加热和冷却之后也不会有疲劳; 通过使用导电性微粒获得的各向异性导电材料; 和导电连接结构。本发明涉及一种导电性细颗粒，其包含含锡的焊料层，并且形成在树脂细颗粒的表面上，镍附着在焊料层的表面上，并且含有0.0001至5.0重量％的镍相对于焊料层中包含的总量和附着到焊料层表面的镍。

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