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1. 发明申请

US20100143727A1 Method for Partially Metallizing a Product 失效
标题翻译：部分金属化产品的方法
公开(公告)号：US20100143727A1
公开(公告)日：2010-06-10
申请号：US11992339
申请日：2006-09-22
申请人： Roland Anthony Tacken , Franky Flory Vercauteren , Hendrik Rendering
发明人： Roland Anthony Tacken , Franky Flory Vercauteren , Hendrik Rendering
IPC分类号： B32B15/04 , B05D3/00 , B05D5/00
CPC分类号： C23C18/2086 , C23C18/1608 , C23C18/30 , Y10T428/12569 , Y10T428/12576 , Y10T428/1352 , Y10T428/31678 , Y10T428/31692 , Y10T428/31855
摘要： Method for metallizing a product (11) comprising a first component (12) and a second component (13). The product is exposed to a first environment (14) causing the surface of the first component to be hydrophilic and the surface of the second component to be hydrophobic. The product is exposed to a watery solution (15a). Next, the product is exposed to a solution (17a) of a film former and subsequently to a second environment (17b), wherein the solvent evaporates and a film (18) is formed covering the whole product, while maintaining the water film under the film. The product then is rinsed out (17c), causing that the film is removed at the locations of the hydrophilic surface of the first component. Next, the product is nucleated, thus forming a nuclei layer (20) and subsequently the film is removed (19b) only leaving the nuclei layer at the hydrophilic surface of the first component. Finally, the surface of the product is exposed to a metallizing environment (21), causing a metallized layer (22) upon the surface of (only) the first component.
摘要翻译：用于金属化包括第一部件（12）和第二部件（13）的产品（11）的方法。产品暴露于第一环境（14），导致第一组分的表面是亲水性的，并且第二组分的表面是疏水的。将产物暴露于水溶液（15a）。接下来，将产品暴露于成膜剂的溶液（17a），然后暴露于第二环境（17b），其中溶剂蒸发并形成覆盖整个产品的膜（18），同时将水膜保持在电影。然后将产品冲洗掉（17c），导致在第一组分的亲水表面的位置处除去膜。接下来，产物成核，从而形成核层（20），随后除去膜（19b），仅使细胞核层留在第一组分的亲水表面。最后，产品的表面暴露于金属化环境（21），从而在（仅）第一组分的表面上形成金属化层（22）。

2. 发明授权

US08158267B2 Method for partially metallizing a product 失效
标题翻译：产品部分金属化的方法
公开(公告)号：US08158267B2
公开(公告)日：2012-04-17
申请号：US11992339
申请日：2006-09-22
申请人： Roland Anthony Tacken , Franky Flory Vercauteren , Hendrik Rendering
发明人： Roland Anthony Tacken , Franky Flory Vercauteren , Hendrik Rendering
IPC分类号： B32B15/04 , B32B15/08
CPC分类号： C23C18/2086 , C23C18/1608 , C23C18/30 , Y10T428/12569 , Y10T428/12576 , Y10T428/1352 , Y10T428/31678 , Y10T428/31692 , Y10T428/31855
摘要： A method for partially metallizing a product comprising a first surface, a first polymer material, and a second surface, a second polymer material, wherein the method comprises the sequential steps of exposing the first and second surfaces to conditions which render the first surface hydrophilic, and the second surface hydrophobic; contacting the first and second surfaces with water or aqueous solution; contacting the first and second surfaces with a solution of a film former in a water-immiscible solvent; evaporating the solvent to allow formation of a film by the film former on the second surface; adherence of a film by the film former on the first surface is prevented by the presence of the water or aqueous solution thereupon; performing a conventional metallization process to deposit a metal layer on the first and second surface; and removing the metallized film from the second surface to render the first surface metallized.
摘要翻译：一种用于部分金属化产品的方法，包括第一表面，第一聚合物材料和第二表面，第二聚合物材料，其中所述方法包括将第一表面和第二表面暴露于使第一表面亲水的条件的顺序步骤，第二表面疏水; 使第一和第二表面与水或水溶液接触; 使第一和第二表面与成膜剂在与水不混溶的溶剂中的溶液接触; 蒸发溶剂以允许通过第二表面上的成膜剂形成膜; 通过在其上存在水或水溶液来防止由成膜剂在第一表面上的膜的附着; 执行传统的金属化工艺以在第一和第二表面上沉积金属层; 以及从所述第二表面去除所述金属化膜以使所述第一表面金属化。

3. 发明申请

US20100119701A1 Method For Preparing a Conductive Strain Sensor on the Surface of a Device 审中-公开
标题翻译：在器件表面上制备导电应变传感器的方法
公开(公告)号：US20100119701A1
公开(公告)日：2010-05-13
申请号：US12615342
申请日：2009-11-10
申请人： Raymond Turk , Hendrik Enting , Roland Anthony Tacken , Hendrik Rendering , René Jos Houben
发明人： Raymond Turk , Hendrik Enting , Roland Anthony Tacken , Hendrik Rendering , René Jos Houben
IPC分类号： B05D5/00 , C23C28/02 , C23C28/00
CPC分类号： G01L1/2287
摘要： The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of (a) providing a device; (b) optionally applying an isolating layer on a surface of the device; (c) establishing a distribution of particles of a first metal on the isolating layer obtained in step (b); and (d) depositing a layer of a second metal on at least part of the distribution of the particles of the first metal as obtained in step (c) by means of an electroless plating process or electro-deposition process.
摘要翻译：本发明提供一种在器件表面上制备导电应变传感器以测量器件表面的应变的方法，该方法包括以下步骤：（a）提供器件; （b）任选地在所述装置的表面上施加隔离层; （c）在步骤（b）中获得的隔离层上建立第一金属颗粒的分布; 和（d）通过无电解电镀工艺或电沉积工艺在步骤（c）中获得的至少部分第一金属颗粒的分布上沉积第二金属层。

4. 发明申请

US20110292622A1 METHOD FOR ELECTRIC CIRCUIT DEPOSITION 审中-公开
标题翻译：电路沉积方法
公开(公告)号：US20110292622A1
公开(公告)日：2011-12-01
申请号：US13132004
申请日：2009-12-11
申请人： Arjan Hovestad , Roland Anthony Tacken , Hendrik Rendering , Hero Hendrik 't Mannetje
发明人： Arjan Hovestad , Roland Anthony Tacken , Hendrik Rendering , Hero Hendrik 't Mannetje
IPC分类号： H05K7/00 , H05K1/00 , B05D5/12 , H05K3/06 , B82Y99/00
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1608 , C23C18/1872 , C23C18/31 , H05K3/182 , H05K2201/0236 , H05K2201/0257 , H05K2203/0108 , H05K2203/0713 , H05K2203/122 , H05K2203/1407
摘要： The invention is directed to a method for preparing a substrate with an electrically conductive pattern for an electric circuit, to the substrate with the electrically conductive pattern, and to a device comprising the substrate with the electrically conductive pattern.The method of the invention comprises (a) providing an electrically insulating or semiconductive substrate, which substrate comprises a distribution of nanoparticles of a first metal or alloy thereof; (b) applying a layer of an inhibiting material onto said substrate, and locally removing or deactivating, light-induced, thermally, chemically and/or electrochemically, the layer of inhibiting material and thereby exposing at least part of the first metal or alloy thereof so as to obtain a pattern for an electric circuit; (c) depositing by means of an electroless process a layer of a second metal or alloy thereof on the exposed part of the first metal or alloy thereof present in the substrate as obtained in step (b), whereby inhibiting material that is still present on the substrate after step (b) locally inhibits the second metal or alloy thereof to be deposited on the first metal or alloy thereof, ensuring that the second metal or alloy thereof will selectively be deposited on the exposed part of the first metal or alloy thereof as obtained in step (b).
摘要翻译：本发明涉及一种用于制备具有用于电路的导电图案，具有导电图案的衬底以及包括具有导电图案的衬底的器件的衬底的方法。本发明的方法包括（a）提供电绝缘或半导体衬底，该衬底包括第一金属或其合金的纳米颗粒的分布; （b）将一层抑制材料施加到所述基底上，并且将光诱导的，热的，化学的和/或电化学的方法局部去除或者化学地抑制所述抑制材料层，从而暴露其第一金属或其合金的至少一部分以获得电路图案; （c）在步骤（b）中获得的在基板上存在的第一金属或其合金的暴露部分上通过无电镀方法沉积第二金属或其合金层，由此抑制仍然存在的材料步骤（b）之后的基板局部地抑制第二金属或其合金沉积在第一金属或其合金上，确保其第二金属或合金将选择性地沉积在第一金属或其合金的暴露部分上，作为在步骤（b）中获得。

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