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1. 发明授权

US08981226B2 Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle 有权
标题翻译：导电性微粒，各向异性导电材料，连接结构以及导电性微粒的制造方法
公开(公告)号：US08981226B2
公开(公告)日：2015-03-17
申请号：US12734162
申请日：2008-10-24
申请人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
发明人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
IPC分类号： H01B5/14 , H01B1/22 , B05D5/12 , H05K3/32 , C23C18/16 , C23C18/30 , C23C18/38 , C23C18/40 , C25D5/56 , H01R13/03 , C23C18/20
CPC分类号： H05K3/323 , C23C18/1635 , C23C18/2086 , C23C18/30 , C23C18/38 , C23C18/40 , C23C18/405 , C25D5/56 , H01B1/22 , H01R13/035 , H05K2201/0221
摘要： The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.
摘要翻译：本发明是在树脂粒子的表面形成有铜层的导电性粒子，其特征在于，在铜层中，与厚度方向的截面相当的空隙面积的面积率为5％以下，构成铜层的铜的平均微晶直径为40nm以上。本发明的目的是提供一种具有低初始连接电阻并且即使长时间存放也难以增加连接电阻的导电颗粒。

2. 发明申请

US20100294539A1 ELECTRICALLY CONDUCTIVE MICROPARTICLE, ANISOTROPIC ELECTRICALLY CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE MICROPARTICLE 有权
标题翻译：导电导电微电解电路，电导电导体材料，连接结构及电导电微生物的制造方法
公开(公告)号：US20100294539A1
公开(公告)日：2010-11-25
申请号：US12734162
申请日：2008-10-24
申请人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
发明人： Taku Sasaki , Hiroshi Natsui , Shinya Uenoyama , Ren-de Sun
IPC分类号： H01B5/14 , H01B1/22 , B05D5/12
CPC分类号： H05K3/323 , C23C18/1635 , C23C18/2086 , C23C18/30 , C23C18/38 , C23C18/40 , C23C18/405 , C25D5/56 , H01B1/22 , H01R13/035 , H05K2201/0221
摘要： It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.
摘要翻译：本发明的目的是提供一种具有低初始连接电阻并且即使长时间存放也难以增加连接电阻的导电颗粒。本发明是一种导电性粒子，其特征在于，在树脂粒子的表面形成有铜层，其特征在于，在铜层中，与厚度方向的截面相对应的面积的面积比为5％以下，构成铜层的铜的平均微晶直径为40nm以上。

3. 发明授权

US08506850B2 Conductive fine particles, anisotropic conductive element, and connection structure 有权
标题翻译：导电微粒，各向异性导电元件和连接结构
公开(公告)号：US08506850B2
公开(公告)日：2013-08-13
申请号：US13262326
申请日：2010-03-17
申请人： Taku Sasaki , Hiroshi Natsui
发明人： Taku Sasaki , Hiroshi Natsui
IPC分类号： H01B1/02 , H01B1/22 , B32B5/16 , B05D7/00
CPC分类号： H01B1/22 , H05K3/323 , H05K2201/0218 , Y10T428/2991 , Y10T428/2998
摘要： The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure.The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.
摘要翻译：本发明提供能够抑制保存期间的黑化现象的导电性微粒，从而提供高连接可靠性; 含有导电性细颗粒的各向异性导电材料; 和连接结构。具有基础细颗粒的导电颗粒以及在基体细颗粒的表面上按顺序形成的导电层和低熔点金属层，其中低熔点金属层具有算术平均值表面粗糙度为50nm以下。

4. 发明申请

US20120056136A1 CONDUCTIVE FINE PARTICLES, ANISOTROPIC CONDUCTIVE ELEMENT, AND CONNECTION STRUCTURE 有权
标题翻译：导电精细颗粒，各向异性导电元件和连接结构
公开(公告)号：US20120056136A1
公开(公告)日：2012-03-08
申请号：US13262326
申请日：2010-03-17
申请人： Taku Sasaki , Hiroshi Natsui
发明人： Taku Sasaki , Hiroshi Natsui
IPC分类号： H01B1/22 , H01B1/02 , B05D5/12
CPC分类号： H01B1/22 , H05K3/323 , H05K2201/0218 , Y10T428/2991 , Y10T428/2998
摘要： The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure.The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.
摘要翻译：本发明提供能够抑制保存期间的黑化现象的导电性微粒，从而提供高连接可靠性; 含有导电性细颗粒的各向异性导电材料; 和连接结构。具有基础细颗粒的导电颗粒以及在基体细颗粒的表面上按顺序形成的导电层和低熔点金属层，其中低熔点金属层具有算术平均值表面粗糙度为50nm以下。

5. 发明授权

US09504980B2 Thermally expandable microcapsule 有权
标题翻译：热膨胀型微胶囊
公开(公告)号：US09504980B2
公开(公告)日：2016-11-29
申请号：US13637243
申请日：2011-03-14
申请人： Hiroshi Natsui , Hiroshi Yamauchi , Hiroyuki Morita
发明人： Hiroshi Natsui , Hiroshi Yamauchi , Hiroyuki Morita
IPC分类号： C08L33/20 , B01J13/14 , C08J9/32 , B01J13/18 , C08F283/10
CPC分类号： B01J13/14 , B01J13/185 , C08F283/10 , C08J9/32 , C08J2201/024 , C08J2203/22 , C08J2300/22 , C08F220/44 , C08F220/06
摘要： The present invention provides a thermally expandable microcapsule that maintains a high expansion ratio and hardly bursts and shrinks even at a high temperature, a foamable thermoplastic resin masterbatch and a foam molded product that are produced using the thermally expandable microcapsule, and a method for producing the thermally expandable microcapsule. The thermally expandable microcapsule comprises a volatile expansion agent included in a shell as a core agent and the shell formed of a polymer, the shell containing a thermosetting resin and a polymer obtainable by polymerization of a monomer composition containing a nitrile-type monomer and a monomer having a carboxyl group, and the thermosetting resin having no radical-polymerizable double bond and at least two functional groups reactive with a carboxyl group per molecule.
摘要翻译：本发明提供一种热膨胀性微胶囊，其即使在高温下也保持高膨胀率且几乎不会发生爆裂和收缩，使用该热膨胀性微胶囊制造的可发泡热塑性树脂母料和发泡成型体，热膨胀微胶囊。热膨胀性微胶囊包含作为核心试剂的外壳中含有的挥发性膨胀剂，由聚合物形成的壳，含有热固性树脂的壳和可通过聚合含有腈型单体和单体的单体组合物得到的聚合物具有羧基，所述热固性树脂不具有自由基聚合性双键和至少两个与每个分子具有羧基反应的官能团。

6. 发明申请

US20130085192A1 THERMALLY EXPANDABLE MICROCAPSULE AND PROCESS FOR PRODUCTION OF THERMALLY EXPANDABLE MICROCAPSULE 审中-公开
标题翻译：热膨胀微生物的热膨胀微生物和生产方法
公开(公告)号：US20130085192A1
公开(公告)日：2013-04-04
申请号：US13637462
申请日：2011-03-03
申请人： Hiroshi Yamauchi , Hiroyuki Morita , Hiroshi Natsui
发明人： Hiroshi Yamauchi , Hiroyuki Morita , Hiroshi Natsui
IPC分类号： C08L33/26 , C08L33/20
CPC分类号： C08L33/26 , B01J13/14 , C08F220/44 , C08F220/56 , C08L33/20
摘要： The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing methacrylic monomer and an amide group-containing methacrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing methacrylic monomer and an ester group-containing methacrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, a weight ratio of the monomer A and the monomer B being 5:5 to 9:1, and the monomer mixture containing methacrylonitrile and methacrylic acid in a total amount of not more than 70% by weight of the monomer mixture.
摘要翻译：本发明提供耐热性和耐久性优异的热膨胀性微胶囊。本发明是一种热可膨胀微胶囊，其包含含有共聚物的壳和包含在壳中的作为核心试剂的挥发性液体，该共聚物可通过含有单体A和单体B的单体混合物的聚合获得，单体A是选自含腈基的甲基丙烯酸单体和含酰胺基的甲基丙烯酸单体中的至少一种，单体B是选自含羧基的甲基丙烯酸单体和含有酯基的甲基丙烯酸单体，单体A和单体B的总量占单体混合物的70重量％以上，单体A和单体B的重量比为5:5〜9:1 ，并且含有甲基丙烯腈和甲基丙烯酸的单体混合物的总量不超过单体混合物的70重量％。

7. 发明申请

US20130303639A1 RESIN COMPOSITION FOR EXPANSION MOLDING 审中-公开
标题翻译：树脂组合物用于膨胀成型
公开(公告)号：US20130303639A1
公开(公告)日：2013-11-14
申请号：US13976629
申请日：2011-12-28
申请人： Hiroshi Yamauchi , Hiroyuki Morita , Hiroshi Natsui
发明人： Hiroshi Yamauchi , Hiroyuki Morita , Hiroshi Natsui
IPC分类号： C08L63/00
CPC分类号： C08L63/00 , C08G59/40 , C08J9/32 , C08J2203/22 , C08J2205/052 , C08J2300/22 , C08J2300/26 , C08J2353/02 , C08J2423/06 , C08J2463/00
摘要： The present invention provides a resin composition for foam molding which can achieve high expansion ratio and can significantly improve tactile impression and vibration damping properties of the foam molding to be obtained.The present invention relates to a resin composition for foam molding comprising: a thermally expandable microcapsule that includes a shell containing an epoxy resin and a core agent that is a volatile expansion agent encapsulated by the shell; a thermoplastic resin; and a curable compound having two or more functional groups each selected from the group consisting of a carboxy group, a hydroxy group, an amino group, an amido group, and an acid anhydride group in each molecule.
摘要翻译：本发明提供一种发泡成型用树脂组合物，其能够实现高膨胀率，能够显着提高要获得的发泡成型体的触感和振动阻尼性。泡沫塑料用树脂组合物技术领域本发明涉及发泡成型用树脂组合物，其特征在于，包括含有环氧树脂的外壳和由壳包封的挥发性膨胀剂的芯剂的热膨胀性微胶囊，热塑性树脂; 以及在各分子中具有选自羧基，羟基，氨基，酰胺基和酸酐基的两个以上官能团的固化性化合物。

8. 发明申请

US20130065976A1 THERMALLY EXPANDABLE MICROCAPSULE, METHOD FOR PRODUCING THERMALLY EXPANDABLE MICROCAPSULE, FOAMABLE MASTERBATCH, AND FOAM MOLDED ARTICLE 有权
标题翻译：热膨胀微生物，生产热膨胀微球的方法，可泡沫主板和泡沫塑料制品
公开(公告)号：US20130065976A1
公开(公告)日：2013-03-14
申请号：US13637216
申请日：2011-03-03
申请人： Hiroyuki Morita , Hiroshi Yamauchi , Hiroshi Natsui
发明人： Hiroyuki Morita , Hiroshi Yamauchi , Hiroshi Natsui
IPC分类号： C08L33/08 , C08J9/16 , C08L33/26 , C08L33/02 , C08L33/10 , C08L33/20
CPC分类号： B01J13/14 , C08F220/44 , C08F220/56
摘要： The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability and exhibits an excellent foaming property in a wide temperature range from low temperatures to high temperatures. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing acrylic monomer and an amide group-containing acrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing acrylic monomer and an ester group-containing acrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, and a weight ratio of the monomer A and the monomer B being 5:5 to 9:1.
摘要翻译：本发明提供耐热性和耐久性优异的热膨胀性微胶囊，并且在从低温到高温的宽温度范围内具有优异的发泡性。本发明是一种热可膨胀微胶囊，其包含含有共聚物的壳和包含在壳中的作为核心试剂的挥发性液体，该共聚物可通过含有单体A和单体B的单体混合物的聚合获得，单体A是选自含有腈基的丙烯酸类单体和含酰胺基的丙烯酸类单体中的至少一种，单体B是选自含羧基的丙烯酸类单体和含有酯基的丙烯酸类单体，单体A和单体B的总量占单体混合物的70重量％以上，单体A和单体B的重量比为5：5〜9： 1。

9. 发明授权

US09776157B2 Thermally expandable microcapsule, method for producing thermally expandable microcapsule, foamable masterbatch, and foam molded article 有权
公开(公告)号：US09776157B2
公开(公告)日：2017-10-03
申请号：US13637216
申请日：2011-03-03
申请人： Hiroyuki Morita , Hiroshi Yamauchi , Hiroshi Natsui
发明人： Hiroyuki Morita , Hiroshi Yamauchi , Hiroshi Natsui
IPC分类号： C08L33/08 , C08J9/16 , C08L33/26 , C08L33/02 , C08L33/10 , C08L33/20 , B01J13/14 , C08F220/44 , C08F220/56
CPC分类号： B01J13/14 , C08F220/44 , C08F220/56
摘要： The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability and exhibits an excellent foaming property in a wide temperature range from low temperatures to high temperatures. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing acrylic monomer and an amide group-containing acrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing acrylic monomer and an ester group-containing acrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, and a weight ratio of the monomer A and the monomer B being 5:5 to 9:1.

10. 发明申请

US20130184362A1 FOAMABLE RESIN COMPOSITION AND FOAM MOLDED BODY 审中-公开
标题翻译：可泡沫树脂组合物和泡沫模体
公开(公告)号：US20130184362A1
公开(公告)日：2013-07-18
申请号：US13820800
申请日：2011-09-01
申请人： Hiroshi Yamauchi , Hiroyuki Morita , Hiroshi Natsui
发明人： Hiroshi Yamauchi , Hiroyuki Morita , Hiroshi Natsui
IPC分类号： C08J9/228
CPC分类号： C08J9/228 , C08J9/0066 , C08J9/06 , C08J9/32 , C08J2201/024 , C08J2203/02 , C08J2203/04 , C08J2203/10 , C08J2203/22 , C08J2300/22 , C08J2323/06
摘要： The present invention aims to provide a foamable resin composition which enables foam molding at high expansion ratios and reduction of open cells. The present invention also aims to provide a foam molded body produced from the foamable resin composition. The present invention is a foamable resin composition including a thermoplastic resin, thermal expansion microcapsules, and a chemical foaming agent, wherein Ts is not lower than 120° C., Tmax is not lower than 190° C., and Ts-Tc is not lower than −30° C. and not higher than 6° C., where Ts denotes a foaming starting temperature of the thermal expansion microcapsules, Tmax denotes a maximum foaming temperature of the thermal expansion microcapsules, and Tc denotes a decomposition temperature of the chemical foaming agent.
摘要翻译：本发明的目的在于提供一种发泡性树脂组合物，其能够以高膨胀率进行发泡成型并使开孔减少。本发明的目的还在于提供一种由发泡性树脂组合物制成的发泡成型体。本发明是一种发泡性树脂组合物，其包含热塑性树脂，热膨胀微胶囊和化学发泡剂，其中Ts不低于120℃，Tmax不低于190℃，Ts-Tc不为低于-30℃且不高于6℃，其中Ts表示热膨胀微胶囊的发泡起始温度，Tmax表示热膨胀微胶囊的最大发泡温度，Tc表示化学品的分解温度发泡剂。

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