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81. 发明申请

US20120073503A1 PROCESSING SYSTEMS AND APPARATUSES HAVING A SHAFT COVER 审中-公开
标题翻译：加工系统和具有轴承盖的装置
公开(公告)号：US20120073503A1
公开(公告)日：2012-03-29
申请号：US13098241
申请日：2011-04-29
申请人： Juno Yu-Ting Huang , Sang Won Kang , David H. Quach , Wei-Yung Hsu
发明人： Juno Yu-Ting Huang , Sang Won Kang , David H. Quach , Wei-Yung Hsu
IPC分类号： C30B25/08 , C30B25/12
CPC分类号： C30B25/08 , C30B25/12 , C30B29/403
摘要： Apparatus and systems are disclosed for processing a substrate. In an embodiment, a system includes a processing chamber, which includes a substrate support to support the substrate. The chamber further includes a plate member positioned below the substrate support and designed to improve heating efficiency within the processing chamber. The processing chamber further includes a lower dome positioned below the plate member. The plate member is designed to prevent a coating from being deposited on the lower dome during processing conditions. The plate member is designed to prevent particles and debris from falling below the plate member. The plate member is designed to improve heating uniformity between the plate member and the substrate within the processing chamber.
摘要翻译：公开了用于处理衬底的装置和系统。在一个实施例中，系统包括处理室，其包括用于支撑衬底的衬底支撑件。腔室还包括位于衬底支撑件下方并被设计成提高处理室内的加热效率的板构件。处理室还包括位于板构件下方的下拱顶。板构件被设计成防止在加工条件下涂层沉积在下圆顶上。板构件被设计成防止颗粒和碎屑落在板构件下方。板构件被设计成改善处理室内的板构件和衬底之间的加热均匀性。

82. 发明申请

US20120052216A1 GAS DISTRIBUTION SHOWERHEAD WITH HIGH EMISSIVITY SURFACE 审中-公开
标题翻译：具有高功率表面的气体分配淋浴
公开(公告)号：US20120052216A1
公开(公告)日：2012-03-01
申请号：US13154060
申请日：2011-06-06
申请人： Hiroji Hanawa , Kyawwin Jason Maung , Hua Chung , Jie Cui , David Bour , Wei-Yung Hsu , Liang-Yuh Chen
发明人： Hiroji Hanawa , Kyawwin Jason Maung , Hua Chung , Jie Cui , David Bour , Wei-Yung Hsu , Liang-Yuh Chen
IPC分类号： C23C16/48
CPC分类号： C23C16/45565 , C23C16/45574 , C23C16/481 , C23C16/52
摘要： Embodiments of the present invention provide methods and apparatus for surface coatings applied to process chamber components utilized in chemical vapor deposition processes. In one embodiment, the apparatus provides a showerhead apparatus comprising a body, a plurality of conduits extending through the body, each of the plurality of conduits having an opening extending to a processing surface of the body, and a coating disposed on the processing surface, the coating being about 50 microns to about 200 microns thick and comprising a coefficient of emissivity of about 0.8, an average surface roughness of about 180 micro-inches to about 220 micro-inches, and a porosity of about 15% or less.
摘要翻译：本发明的实施例提供了应用于化学气相沉积工艺中使用的处理腔室部件的表面涂层的方法和装置。在一个实施例中，该装置提供一种喷头装置，其包括主体，延伸穿过主体的多个导管，多个导管中的每一个具有延伸到主体的处理表面的开口，以及设置在处理表面上的涂层，该涂层为约50微米至约200微米厚，并且包括约0.8的发射率系数，约180微英寸至约220微英寸的平均表面粗糙度，以及约15％或更小的孔隙率。

83. 发明申请

US20120012049A1 HVPE CHAMBER 审中-公开
标题翻译： HVPE室
公开(公告)号：US20120012049A1
公开(公告)日：2012-01-19
申请号：US13184390
申请日：2011-07-15
申请人： Wei-Yung Hsu , Donald J.K. Olgado , Anzhong Chang
发明人： Wei-Yung Hsu , Donald J.K. Olgado , Anzhong Chang
IPC分类号： C30B25/08 , C30B35/00 , C30B25/12
CPC分类号： C30B25/12 , C23C16/303 , C23C16/45502 , C23C16/45565 , C23C16/45574 , C23C16/45578 , C30B25/08 , C30B25/14
摘要： Embodiments disclosed herein generally relate to an HVPE chamber. The chamber may have one or more precursor sources coupled thereto. For example, a gallium source and a separate aluminum source may be coupled to the processing chamber to permit gallium nitride and aluminum nitride to be separately deposited onto a substrate in the same processing chamber. The nitrogen may be introduced to the processing chamber at a separate location from the precursors and at a lower temperature. The chamber has a truncated box shape formed by a curved cover which improves the flow of the nitrogen and precursor gases and the uniformity of the film deposition.
摘要翻译：本文公开的实施例通常涉及HVPE室。腔室可以具有一个或多个耦合到其上的前体源。例如，镓源和单独的铝源可以耦合到处理室以允许氮化镓和氮化铝分别沉积在相同处理室中的衬底上。氮可以在与前体和较低温度的分开的位置处引入处理室。该腔室具有由弯曲盖形成的截头形箱形状，其改善了氮气和前体气体的流动以及膜沉积的均匀性。

84. 发明授权

US07520795B2 Grooved retaining ring 失效
标题翻译：沟槽护环
公开(公告)号：US07520795B2
公开(公告)日：2009-04-21
申请号：US11468267
申请日：2006-08-29
申请人： Shi-Ping Wang , Alain Duboust , Antoine P. Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
发明人： Shi-Ping Wang , Alain Duboust , Antoine P. Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/32
摘要： A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.
摘要翻译：描述了用于化学机械抛光的保持环。环具有具有不相交槽的底面。交替的槽彼此成相对的角度。

85. 发明申请

US20090029629A1 METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
标题翻译：用于抛光衬底边缘的方法和装置
公开(公告)号：US20090029629A1
公开(公告)日：2009-01-29
申请号：US12239726
申请日：2008-09-26
申请人： Ho Seon Shin , Gary C. Ettinger , Donald J.K. Olgado , Erik C. Wasinger , Sen-Hou Ko , Charles I. Dodds , Yufei Chen , Wei-Yung Hsu
发明人： Ho Seon Shin , Gary C. Ettinger , Donald J.K. Olgado , Erik C. Wasinger , Sen-Hou Ko , Charles I. Dodds , Yufei Chen , Wei-Yung Hsu
IPC分类号： B24B49/00
CPC分类号： B24B9/065 , B24B21/002 , B24B41/067 , B24B49/16 , B24B57/02
摘要： Methods for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of force exerted in pressing the polishing film against the substrate. Numerous other aspects are provided.
摘要翻译：提供了抛光衬底边缘的方法。本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将抛光膜压在基板上时施加的力的量。提供了许多其他方面。

86. 发明申请

US20080277787A1 METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTROCHEMICAL MECHANICAL PROCESSING 审中-公开
标题翻译：通过电化学机械加工去除障壁材料的方法和设计
公开(公告)号：US20080277787A1
公开(公告)日：2008-11-13
申请号：US11746135
申请日：2007-05-09
申请人： Feng Q. Liu , Alain Duboust , Yan Wang , Wei-Yung Hsu , Tianbo Du
发明人： Feng Q. Liu , Alain Duboust , Yan Wang , Wei-Yung Hsu , Tianbo Du
IPC分类号： H01L23/485 , H01L21/4763
CPC分类号： B23H5/08 , H01L21/32125
摘要： A method and apparatus for processing barrier and metals disposed on a substrate in an electrochemical mechanical planarizing system are provided. In certain embodiments a method for electroprocessing a substrate is provided. The method comprises contacting the substrate with the non-conductive surface of a polishing pad assembly, establishing a first electrically conductive path through an electrolyte between an exposed layer of barrier material and a first electrode, establishing a second electrically conductive path through the electrolyte between the exposed layer of barrier material and a second electrode, applying a voltage to the first electrode to cause a voltage drop between the substrate and the second electrode, and removing the barrier material from the substrate.
摘要翻译：提供了一种用于在电化学机械平面化系统中处理设置在基板上的屏障和金属的方法和装置。在某些实施例中，提供了一种用于对基底进行电处理的方法。该方法包括使衬底与抛光垫组件的非导电表面接触，建立穿过暴露的阻挡材料层和第一电极之间的电解质的第一导电路径，建立通过电解质之间的第二导电路径暴露的阻挡材料层和第二电极，向第一电极施加电压以在衬底和第二电极之间引起电压降，以及从衬底去除阻挡材料。

87. 发明申请

US20080242202A1 EXTENDED PAD LIFE FOR ECMP AND BARRIER REMOVAL 失效
标题翻译：用于ECMP和BARRIER移除的扩展垫生活
公开(公告)号：US20080242202A1
公开(公告)日：2008-10-02
申请号：US11695484
申请日：2007-04-02
申请人： Yuchun Wang , Robert A. Ewald , Wei-Yung Hsu , Liang-Yuh Chen
发明人： Yuchun Wang , Robert A. Ewald , Wei-Yung Hsu , Liang-Yuh Chen
IPC分类号： B24B7/22
CPC分类号： B23H5/08
摘要： A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.
摘要翻译：描述了一种用于在具有多个压板的抛光工具上延伸抛光制品寿命的方法和装置。该设备包括具有可在其上使用的抛光制品的多个实施例的可推进的辊对辊压盘。抛光制品适于通过从衬底移除导电和电介质材料，同时最小化抛光工具的停机时间来执行抛光工艺。在一些实施例中，抛光制品可以是介电材料或导电材料，并且被配置为包括更长的可用寿命以最小化工具的更换和停机时间。

88. 发明授权

US07323095B2 Integrated multi-step gap fill and all feature planarization for conductive materials 失效
标题翻译：集成的多步间隙填充和导电材料的所有特征平面化
公开(公告)号：US07323095B2
公开(公告)日：2008-01-29
申请号：US10792069
申请日：2004-03-03
申请人： Wei-Yung Hsu , Liang-Yuh Chen , Ratson Morad , Daniel A. Carl , Sasson Somekh
发明人： Wei-Yung Hsu , Liang-Yuh Chen , Ratson Morad , Daniel A. Carl , Sasson Somekh
IPC分类号： C25D21/00 , C25D7/12
CPC分类号： C25D7/123 , C25D5/06 , C25D5/22 , C25D17/001 , C25D17/008 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/7684 , H01L21/76877
摘要： A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc. During the deposition, the partial enclosure and the substrate are rotated relative one another.
摘要翻译：提供了一种用于沉积和平坦化衬底上的材料层的方法和装置。在一个实施例中，提供了一种装置，其包括部分外壳，可渗透盘，漫射板和任选的阳极。衬底载体可定位在部分外壳上方，并且适于将衬底移动到与可渗透盘接触或接近的位置。部分外壳和基板载体可旋转以提供基板和可渗透盘之间的相对运动。在另一方面，提供了一种方法，其中将基底定位在其中具有电解质的部分封闭体中，其中离开可渗透盘的第一距离处。任选地将电流施加到衬底的表面，并且在衬底上沉积第一厚度。接下来，将基板定位成更靠近可渗透盘。在沉积期间，部分封闭物和基底相对彼此旋转。

89. 发明申请

US20070131654A1 Methods and apparatus for processing a substrate 有权
标题翻译：用于处理衬底的方法和设备
公开(公告)号：US20070131654A1
公开(公告)日：2007-06-14
申请号：US11299295
申请日：2005-12-09
申请人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
发明人： Erik Wasinger , Gary Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
摘要翻译：适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和第一斜面作为基底旋转。提供了许多其他方面。

90. 发明申请

US20060025049A1 Spray slurry delivery system for polish performance improvement and cost reduction 审中-公开
标题翻译：喷涂浆料输送系统，用于抛光性能改进和降低成本
公开(公告)号：US20060025049A1
公开(公告)日：2006-02-02
申请号：US11115634
申请日：2005-04-27
申请人： Lizhong Sun , Lei Zhu , Gary Lam , Robert Jackson , Wei-Yung Hsu
发明人： Lizhong Sun , Lei Zhu , Gary Lam , Robert Jackson , Wei-Yung Hsu
IPC分类号： B24B51/00
CPC分类号： B24B37/04 , B24B57/02
摘要： Methods and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one aspect, the apparatus comprises a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size, and at least a second nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a second adjustable droplet size. In another aspect of the invention, the apparatus comprises a horizontal arm having a delivery portion disposed at least partially over a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size across a first region of the polishing surface, and at least a second nozzle disposed horizontally spaced from the first nozzle on the delivery portion, and adapted to dispense the polishing fluid with a second adjustable droplet size across a second region of the polishing surface.
摘要翻译：提供了将抛光液输送到化学机械抛光表面的方法和设备。一方面，该装置包括垂直臂，其具有位于抛光表面的圆周附近的输送部分，设置在输送部分上并适于以第一可调液滴尺寸分配抛光流体的第一喷嘴，以及至少一第二喷嘴，其布置在输送部分上并且适于以第二可调液滴尺寸分配抛光流体。在本发明的另一方面，该装置包括水平臂，其具有至少部分地设置在抛光表面上的输送部分，设置在输送部分上的第一喷嘴，并且适于以第一可调液滴大小分配抛光流体，抛光表面的区域，以及至少第二喷嘴，其在输送部分上与第一喷嘴水平间隔设置，并且适于在抛光表面的第二区域上分配具有第二可调液滴尺寸的抛光流体。

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