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1. 发明申请

US20070084729A1 Contact assembly cleaning in an electrochemical mechanical processing apparatus 审中-公开
标题翻译：在电化学机械处理设备中接触组件清洁
公开(公告)号：US20070084729A1
公开(公告)日：2007-04-19
申请号：US11251581
申请日：2005-10-14
申请人： Antoine Manens , Alain Duboust , Paul Butterfield , Ricardo Martinez , Yan Wang , Jose Salas-Vernis
发明人： Antoine Manens , Alain Duboust , Paul Butterfield , Ricardo Martinez , Yan Wang , Jose Salas-Vernis
IPC分类号： C25D21/06
CPC分类号： C25F7/00 , B23H5/08 , B24B37/16 , B24B53/017
摘要： Embodiments of the invention generally provide a method and apparatus for cleaning an electrical contact in an electrochemical mechanical planarizing apparatus. In one embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of draining electrolyte from the contact assembly and flowing a rinsing fluid into the contact assembly. In another embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of preventing fluid from passing between an interface of the contact assembly and a pad disposed outward thereof, flowing a rinsing fluid into the contact assembly and draining fluid flowing out of the contact assembly.
摘要翻译：本发明的实施例通常提供一种用于清洁电化学机械平面化装置中的电接触的方法和装置。在一个实施例中，用于在电加工设备中清洁接触组件的方法包括以下步骤：从接触组件排出电解液并将冲洗流体流动到接触组件中。在另一个实施例中，用于清洁电加工设备中的接触组件的方法包括以下步骤：防止流体在接触组件的界面和设置在其外部的垫片之间通过，将冲洗流体流动到接触组件中并排出流出的流体的接触组件。

2. 发明申请

US20070219103A1 Novel rinse solution to remove cross-contamination 审中-公开
标题翻译：新型冲洗液可以消除交叉污染
公开(公告)号：US20070219103A1
公开(公告)日：2007-09-20
申请号：US11378521
申请日：2006-03-17
申请人： Tianbao Du , Feng Liu , Alain Duboust , Jose Salas-Vernis , Wei-Yung Hsu
发明人： Tianbao Du , Feng Liu , Alain Duboust , Jose Salas-Vernis , Wei-Yung Hsu
IPC分类号： B08B3/00 , C11D7/32
CPC分类号： C11D7/265 , C11D3/2075 , C11D11/0047 , H01L21/02074 , H01L21/67051 , H01L21/67219 , H01L21/67745
摘要： A composition for rinsing a substrate including deionized water, one or more carboxylate acid containing compounds, one or more surfactants, and one or more corrosion inhibitors and a method of using the same is provided. Also a method for rinsing a substrate between exposure to platens including moving the substrate from a first platen to a second platen and exposing the substrate to a rinse solution comprising one or more carboxylate acid containing compounds, one or more surfactants, and one or more corrosion inhibitors.
摘要翻译：提供了一种用于漂洗包括去离子水，一种或多种含羧酸的化合物，一种或多种表面活性剂和一种或多种腐蚀抑制剂的基质的组合物及其使用方法。还有一种用于在暴露于压板之间冲洗衬底的方法，包括将衬底从第一压板移动到第二压板并将衬底暴露于包含一种或多种含羧酸的化合物，一种或多种表面活性剂和一种或多种腐蚀的冲洗溶液抑制剂。

3. 发明申请

US20070096315A1 BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION 审中-公开
标题翻译：用于铜减少和减少焦距的球接触罩
公开(公告)号：US20070096315A1
公开(公告)日：2007-05-03
申请号：US11555588
申请日：2006-11-01
申请人： Antoine Manens , Alain Duboust , Donald Olgado , Yan Wang , Jose Salas-Vernis , Shou-Sung Chang
发明人： Antoine Manens , Alain Duboust , Donald Olgado , Yan Wang , Jose Salas-Vernis , Shou-Sung Chang
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B24B37/16 , B23H5/08 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。该球适于在加工过程中从壳体部分延伸以接触基底。壳体包括导电材料。在另一个实施例中，壳体包括下壳体和接触盖，其中接触盖包括导电材料。

4. 发明申请

US20070044913A1 Grooved Retaining Ring 失效
标题翻译：凹槽保持环
公开(公告)号：US20070044913A1
公开(公告)日：2007-03-01
申请号：US11468267
申请日：2006-08-29
申请人： Shi-Ping Wang , Alain Duboust , Antoine Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
发明人： Shi-Ping Wang , Alain Duboust , Antoine Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： B24B37/32
摘要： A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.
摘要翻译：描述了用于化学机械抛光的保持环。环具有具有不相交槽的底面。交替的槽彼此成相对的角度。

5. 发明申请

US20140030956A1 CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：化学机械抛光中相同板上多个基板的抛光控制
公开(公告)号：US20140030956A1
公开(公告)日：2014-01-30
申请号：US13558140
申请日：2012-07-25
申请人： Jimin Zhang , Jose Salas-Vernis , Ingemar Carlsson , David H. Mai , Huyen Tran , Zhihong Wang , Wen-Chiang Tu , Stephen Jew , Boguslaw A. Swedek , Shih-Haur Shen , James C. Wang , Yen-Chu Yang
发明人： Jimin Zhang , Jose Salas-Vernis , Ingemar Carlsson , David H. Mai , Huyen Tran , Zhihong Wang , Wen-Chiang Tu , Stephen Jew , Boguslaw A. Swedek , Shih-Haur Shen , James C. Wang , Yen-Chu Yang
IPC分类号： B24B51/00
CPC分类号： B24B51/00 , B24B37/013
摘要： A polishing method includes positioning two substrates in contact with the same polishing pad. Prior to commencement of polishing and while the two substrates are in contact with the polishing pad, two starting values are generated from an in-situ monitoring system. Either a starting polishing time or a pressure applied to one of the substrates can be adjusted so that the two substrates have closer endpoint conditions. During polishing the two substrates are monitored with the in-situ monitoring system to generate a two sequences of values, and a polishing endpoint can be detected or an adjustment for a polishing parameter can be based on the two sequences of values.
摘要翻译：抛光方法包括将两个基板定位成与相同的抛光垫接触。在开始抛光之前，当两个基板与抛光垫接触时，从原位监测系统产生两个起始值。可以调整施加到一个基板的起始抛光时间或压力，使得两个基板具有更接近的端点条件。在抛光期间，用原位监测系统监测两个基底以产生两个值序列，并且可以检测抛光终点，或者可以基于两个值序列来调整抛光参数。

6. 发明授权

US07520795B2 Grooved retaining ring 失效
标题翻译：沟槽护环
公开(公告)号：US07520795B2
公开(公告)日：2009-04-21
申请号：US11468267
申请日：2006-08-29
申请人： Shi-Ping Wang , Alain Duboust , Antoine P. Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
发明人： Shi-Ping Wang , Alain Duboust , Antoine P. Manens , Wei-Yung Hsu , Jose Salas-Vernis , Zhihong Wang
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/32
摘要： A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.
摘要翻译：描述了用于化学机械抛光的保持环。环具有具有不相交槽的底面。交替的槽彼此成相对的角度。

7. 发明申请

US20090061617A1 EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY 审中-公开
标题翻译：带ECMP技术的边缘除鳞工艺
公开(公告)号：US20090061617A1
公开(公告)日：2009-03-05
申请号：US11849714
申请日：2007-09-04
申请人： Alain Duboust , Jose Salas-Vernis , Antoine P. Manens
发明人： Alain Duboust , Jose Salas-Vernis , Antoine P. Manens
IPC分类号： H01L21/3063
CPC分类号： H01L21/3063 , H01L21/02087
摘要： A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using a power ring configured to electro polish an edge of the substrate are provided. The electro polishing of the substrate edge may occur simultaneously with the electrochemical mechanical processing of a substrate face. In certain embodiments a method of electrochemically polishing a substrate having a conductive material disposed thereon is provided. A substrate is coupled with a carrier head comprising a power ring which surrounds an edge of the substrate, wherein the edge of the substrate includes the conductive material. A polishing pad is contacted with a face of the substrate. A first voltage is applied to the power ring to remove conductive material from the edge of the substrate. A second voltage different from the first voltage is applied to the polishing pad to remove a portion of the conductive material from the face of the substrate.
摘要翻译：提供了一种用于使用构造为电抛光衬底的边缘的功率环沿着衬底的边缘去除沉积的导电层的方法和装置。衬底边缘的电抛光可以与衬底面的电化学机械加工同时发生。在某些实施例中，提供了一种电化学抛光其上布置有导电材料的基板的方法。衬底与包括围绕衬底的边缘的功率环的载体头耦合，其中衬底的边缘包括导电材料。抛光垫与基板的表面接触。向功率环施加第一电压以从衬底的边缘去除导电材料。将不同于第一电压的第二电压施加到抛光垫，以从衬底的表面去除一部分导电材料。

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