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    • 81. 发明授权
    • Method of determining photo mask, method of manufacturing semiconductor device, and computer program product
    • 确定光掩模的方法,制造半导体器件的方法以及计算机程序产品
    • US07925090B2
    • 2011-04-12
    • US11601797
    • 2006-11-20
    • Toshiya KotaniKazuya FukuharaKyoko Izuha
    • Toshiya KotaniKazuya FukuharaKyoko Izuha
    • G06K9/34
    • G03F7/70441
    • A method of determining a photo mask, includes specifying a mask pattern for a photo mask for a first exposure apparatus, specifying a plurality of exposure conditions allowed to be set for a second exposure apparatus, predicting a projection image of the mask pattern to be projected on a substrate by the second exposure apparatus, for each of the exposure conditions, predicting a processed pattern to be formed on a substrate surface on the basis of the projection image, for each of the exposure conditions, determining whether or not the processed pattern meets a predetermined condition for each of the exposure conditions, and determining that the photo mask is applicable to the second exposure apparatus if the processed pattern meets the predetermined condition for at least one of the exposure conditions.
    • 一种确定光掩模的方法包括:为第一曝光装置指定用于光掩模的掩模图案,指定允许为第二曝光装置设置的多个曝光条件,预测要投影的掩模图案的投影图像 在第二曝光装置的基板上,对于每个曝光条件,对于每个曝光条件,基于投影图像预测要在基板表面上形成的处理图案,确定处理图案是否满足 对于每个曝光条件的预定条件,并且如果处理的图案满足至少一个曝光条件的预定条件,则确定光掩模适用于第二曝光装置。
    • 82. 发明授权
    • Method for selecting photomask substrate, method for manufacturing photomask, and method for manufacturing semiconductor device
    • 光掩模基板的选择方法,光掩模的制造方法以及半导体装置的制造方法
    • US07740994B2
    • 2010-06-22
    • US11585130
    • 2006-10-24
    • Kazuya FukuharaMasamitsu Itoh
    • Kazuya FukuharaMasamitsu Itoh
    • G03F1/00
    • G03F1/84G03F1/44
    • According to an aspect of the invention, there is provided a method for selecting a photomask substrate, including dividing a chip area scheduled to be arranged on the photomask substrate regarding a specific transfer pattern layer into a management pattern area in which an element pattern changed in shape by birefringence of the photomask substrate is arranged, and an area other than the management pattern area, setting a standard value of a size of birefringence of an area in which the management pattern area of the photomask substrate is arranged, inspecting the size of the birefringence of each of a plurality of photomask substrate candidates, and selecting a photomask substrate, in which the size of the birefringence satisfies the standard value, as a photomask substrate of the specific transfer pattern layer from the plurality of photomask substrate candidates.
    • 根据本发明的一个方面,提供了一种用于选择光掩模衬底的方法,包括将针对特定传输图案层布置在光掩模衬底上的芯片区域划分成其中元件图案改变的管理图案区域 布置光掩模基板的双折射形状,并且设置管理图案区域以外的区域,设置布置有光掩模基板的管理图案区域的区域的双折射尺寸的标准值,检查 多个光掩模衬底候选中的每一个的双折射,并且从多个光掩模衬底候选中选择其中双折射的尺寸满足标准值的光掩模衬底作为特定转移图案层的光掩模衬底。
    • 83. 发明申请
    • EXPOSURE APPARATUS INSPECTION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 曝光装置检查方法和制造半导体器件的方法
    • US20100081093A1
    • 2010-04-01
    • US12554782
    • 2009-09-04
    • Kentaro KasaTakashi SatoKazuya Fukuhara
    • Kentaro KasaTakashi SatoKazuya Fukuhara
    • G03F7/20G03B27/32G03B27/42
    • G03F7/70641
    • A mask pattern includes a first pattern having a line-and-space pattern extending in a first direction, a second pattern formed as a line-and-space pattern having a larger period than the first pattern and extending in the first direction, a third pattern having a line-and-space pattern extending in a second direction, and a fourth pattern formed as a line-and-space pattern having a larger period than the third pattern and extending in the second direction. Illumination light is obliquely incident on the first pattern and the second pattern from a first oblique direction, illumination light is obliquely incident on the third pattern and the fourth pattern from a second oblique direction, and a relative distance from the first pattern to the second pattern transferred on to an image receptor and a relative distance from the third pattern to the fourth pattern transferred onto the image receptor are measured and an optical characteristic of an exposure apparatus is ascertained based on the relative distances.
    • 掩模图案包括具有沿第一方向延伸的线间距图案的第一图案,形成为具有比第一图案更长的周期并沿第一方向延伸的线间距图案的第二图案,第三图案 图案具有沿第二方向延伸的线间距图案,以及形成为具有比第三图案更大的周期并沿第二方向延伸的线间距图案的第四图案。 照明光从第一倾斜方向倾斜入射在第一图案和第二图案上,照明光从第二倾斜方向倾斜入射在第三图案和第四图案上,并且从第一图案到第二图案的相对距离 转印到图像接收器上,并且测量从第三图案到转印到图像接收器上的第四图案的相对距离,并且基于相对距离确定曝光设备的光学特性。
    • 85. 发明授权
    • Inspection method, processor and method for manufacturing a semiconductor device
    • 用于制造半导体器件的检查方法,处理器和方法
    • US07676078B2
    • 2010-03-09
    • US10776591
    • 2004-02-12
    • Kazuya Fukuhara
    • Kazuya Fukuhara
    • G06K9/00G01B11/00H01L21/00G03C5/00
    • G03F7/70133G01N21/95607G03F7/70591G03F7/70616
    • An inspection method for an illumination optical system of an exposure tool includes coating a surface of an exposure target substrate with a resist film; placing a plurality of imaging components deviating from an optical conjugate plane of a surface of the resist film; generating a plurality of inspection patterns of the resist film having a plurality of openings, by projecting exposure beams output from a plurality of effective light sources onto the resist film via the imaging components; measuring one of the inspection patterns as a reference image, and processing the reference image so as to provide reference image data; and determining an abnormal inspection image by measuring inspection images of the inspection patterns and comparing a plurality of inspection image data provided by processing the inspection images with the reference image data.
    • 曝光工具的照明光学系统的检查方法包括用抗蚀剂膜涂覆曝光对象基板的表面; 放置偏离抗蚀膜的表面的光共轭面的多个成像组件; 通过经由成像部件将从多个有效光源输出的曝光光束投影到抗蚀剂膜上,产生具有多个开口的抗蚀剂膜的多个检查图案; 测量所述检查图案之一作为参考图像,并处理所述参考图像以便提供参考图像数据; 以及通过测量所述检查图案的检查图像并将通过处理所述检查图像而提供的多个检查图像数据与所述参考图像数据进行比较来确定异常检查图像。
    • 86. 发明申请
    • PROJECTION EXPOSURE METHOD
    • 投影曝光方法
    • US20090244504A1
    • 2009-10-01
    • US12395513
    • 2009-02-27
    • Yosuke KitamuraMasaki SatakeShoji MimotogiKazuya Fukuhara
    • Yosuke KitamuraMasaki SatakeShoji MimotogiKazuya Fukuhara
    • G03B27/42G03B27/72
    • G03B27/42G03B27/72
    • A projection exposure method that projects the shape of a hole onto a wafer by projecting a diffracted light, which is produced by applying light to a mask having a pattern for forming a hole pattern, onto the wafer through a projection optical system for exposure, wherein, in a plane substantially perpendicular to an optical axis, the light applied to the mask has a first intensity distribution in which the intensity is higher in the vicinity of eight apexes of an octagon centered at the optical axis than in other areas, the mask has a plurality of first opening patterns are arranged in a rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis, and a plurality of second opening patterns are arranged in a face-centered rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis.
    • 一种投影曝光方法,其通过将通过将具有用于形成孔图案的图案的掩模施加光而产生的衍射光投射到晶片上的投影光学系统进行曝光,将衍射光投射到晶片上,其中 在基本上垂直于光轴的平面中,施加到掩模的光具有第一强度分布,其中在光轴中心的八边形的八个顶点附近的强度比在其它区域中的强度高,掩模具有 多个第一开口图案被布置成矩形格子构型,其具有平行于通过光轴的八边形的对角线的边,并且多个第二开口图案以面向中心的矩形格子构造布置,具有平行于 八角形通过光轴。