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    • 81. 发明申请
    • EXPOSURE APPARATUS INSPECTION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 曝光装置检查方法和制造半导体器件的方法
    • US20100081093A1
    • 2010-04-01
    • US12554782
    • 2009-09-04
    • Kentaro KasaTakashi SatoKazuya Fukuhara
    • Kentaro KasaTakashi SatoKazuya Fukuhara
    • G03F7/20G03B27/32G03B27/42
    • G03F7/70641
    • A mask pattern includes a first pattern having a line-and-space pattern extending in a first direction, a second pattern formed as a line-and-space pattern having a larger period than the first pattern and extending in the first direction, a third pattern having a line-and-space pattern extending in a second direction, and a fourth pattern formed as a line-and-space pattern having a larger period than the third pattern and extending in the second direction. Illumination light is obliquely incident on the first pattern and the second pattern from a first oblique direction, illumination light is obliquely incident on the third pattern and the fourth pattern from a second oblique direction, and a relative distance from the first pattern to the second pattern transferred on to an image receptor and a relative distance from the third pattern to the fourth pattern transferred onto the image receptor are measured and an optical characteristic of an exposure apparatus is ascertained based on the relative distances.
    • 掩模图案包括具有沿第一方向延伸的线间距图案的第一图案,形成为具有比第一图案更长的周期并沿第一方向延伸的线间距图案的第二图案,第三图案 图案具有沿第二方向延伸的线间距图案,以及形成为具有比第三图案更大的周期并沿第二方向延伸的线间距图案的第四图案。 照明光从第一倾斜方向倾斜入射在第一图案和第二图案上,照明光从第二倾斜方向倾斜入射在第三图案和第四图案上,并且从第一图案到第二图案的相对距离 转印到图像接收器上,并且测量从第三图案到转印到图像接收器上的第四图案的相对距离,并且基于相对距离确定曝光设备的光学特性。
    • 83. 发明授权
    • Inspection method, processor and method for manufacturing a semiconductor device
    • 用于制造半导体器件的检查方法,处理器和方法
    • US07676078B2
    • 2010-03-09
    • US10776591
    • 2004-02-12
    • Kazuya Fukuhara
    • Kazuya Fukuhara
    • G06K9/00G01B11/00H01L21/00G03C5/00
    • G03F7/70133G01N21/95607G03F7/70591G03F7/70616
    • An inspection method for an illumination optical system of an exposure tool includes coating a surface of an exposure target substrate with a resist film; placing a plurality of imaging components deviating from an optical conjugate plane of a surface of the resist film; generating a plurality of inspection patterns of the resist film having a plurality of openings, by projecting exposure beams output from a plurality of effective light sources onto the resist film via the imaging components; measuring one of the inspection patterns as a reference image, and processing the reference image so as to provide reference image data; and determining an abnormal inspection image by measuring inspection images of the inspection patterns and comparing a plurality of inspection image data provided by processing the inspection images with the reference image data.
    • 曝光工具的照明光学系统的检查方法包括用抗蚀剂膜涂覆曝光对象基板的表面; 放置偏离抗蚀膜的表面的光共轭面的多个成像组件; 通过经由成像部件将从多个有效光源输出的曝光光束投影到抗蚀剂膜上,产生具有多个开口的抗蚀剂膜的多个检查图案; 测量所述检查图案之一作为参考图像,并处理所述参考图像以便提供参考图像数据; 以及通过测量所述检查图案的检查图像并将通过处理所述检查图像而提供的多个检查图像数据与所述参考图像数据进行比较来确定异常检查图像。
    • 84. 发明申请
    • EXPOSURE METHOD, MASK DATA PRODUCING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    • 曝光方法,掩模数据生产方法和半导体器件制造方法
    • US20100035167A1
    • 2010-02-11
    • US12536758
    • 2009-08-06
    • Satoshi NagaiKazuya Fukuhara
    • Satoshi NagaiKazuya Fukuhara
    • G03F7/20G06F17/50
    • G03F7/70433
    • An exposure method has irradiating a mask with light based on an exposure performing condition, a first mask pattern and a second mask pattern being formed in the mask, and projecting images of the first mask pattern and second mask pattern onto a wafer through a projection lens, a lower-layer film material and a photoresist being sequentially laminated on the wafer, wherein the exposure performing condition is a condition on which, when exposure is performed on a predetermined exposure condition, the predetermined exposure condition is adjusted such that a difference between a wafer position at which a best focus is obtained for the image of the first mask pattern and a wafer position at which a best focus is obtained for the image of the second mask pattern falls within a predetermined range, the wafer position of the first mask pattern and the wafer position of the second mask pattern being predicted using film thicknesses and optical characteristics of the photoresist and the lower-layer film material.
    • 曝光方法基于曝光执行条件照射具有光的掩模,在掩模中形成第一掩模图案和第二掩模图案,并且通过投影透镜将第一掩模图案和第二掩模图案的图像投影到晶片上 ,下层薄膜材料和光致抗蚀剂依次层压在晶片上,其中曝光执行条件是当在预定曝光条件下进行曝光时,调整预定曝光条件使得在 对于第一掩模图案的图像获得最佳聚焦的晶片位置和对于第二掩模图案的图像获得最佳聚焦的晶片位置落在预定范围内,第一掩模图案的晶片位置 并且使用光致抗蚀剂和下层的膜厚度和光学特性来预测第二掩模图案的晶片位置 层膜材料。
    • 85. 发明申请
    • PROJECTION EXPOSURE METHOD
    • 投影曝光方法
    • US20090244504A1
    • 2009-10-01
    • US12395513
    • 2009-02-27
    • Yosuke KitamuraMasaki SatakeShoji MimotogiKazuya Fukuhara
    • Yosuke KitamuraMasaki SatakeShoji MimotogiKazuya Fukuhara
    • G03B27/42G03B27/72
    • G03B27/42G03B27/72
    • A projection exposure method that projects the shape of a hole onto a wafer by projecting a diffracted light, which is produced by applying light to a mask having a pattern for forming a hole pattern, onto the wafer through a projection optical system for exposure, wherein, in a plane substantially perpendicular to an optical axis, the light applied to the mask has a first intensity distribution in which the intensity is higher in the vicinity of eight apexes of an octagon centered at the optical axis than in other areas, the mask has a plurality of first opening patterns are arranged in a rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis, and a plurality of second opening patterns are arranged in a face-centered rectangular lattice configuration having sides parallel to diagonals of the octagon passing through the optical axis.
    • 一种投影曝光方法,其通过将通过将具有用于形成孔图案的图案的掩模施加光而产生的衍射光投射到晶片上的投影光学系统进行曝光,将衍射光投射到晶片上,其中 在基本上垂直于光轴的平面中,施加到掩模的光具有第一强度分布,其中在光轴中心的八边形的八个顶点附近的强度比在其它区域中的强度高,掩模具有 多个第一开口图案被布置成矩形格子构型,其具有平行于通过光轴的八边形的对角线的边,并且多个第二开口图案以面向中心的矩形格子构造布置,具有平行于 八角形通过光轴。