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61. 发明授权

US5589668A Multi-metal layer wiring tab tape carrier and process for fabricating the same 失效
标题翻译：多金属层接线片带载体及其制造方法
公开(公告)号：US5589668A
公开(公告)日：1996-12-31
申请号：US149795
申请日：1993-11-10
申请人： Kenji Yamaguchi , Shoji Takagi , Sadahiko Mitsugi , Mamoru Mita , Tomio Murakami
发明人： Kenji Yamaguchi , Shoji Takagi , Sadahiko Mitsugi , Mamoru Mita , Tomio Murakami
IPC分类号： H01L23/498 , H05K3/40 , H05K1/14
CPC分类号： H01L23/4985 , H05K3/4076 , H01L2924/0002 , H01L2924/3011
摘要： A multi-metal layer wiring TAB tape carrier capable of forming a fine pattern without affecting the thicknesses of conductive metal layers, and a process for fabricating the multi-metal layer wiring TAB tape carrier. This TAB tape carrier is constructed such that respective dielectric film layers are interposed between adjacent ones of plurality of conductive metal layers having a predetermined wiring pattern, such that the dielectric film layer is formed with interfacial connection holes, and such that a conductive via layer is formed in the interfacial connection holes to electrically connect adjacent conductive metal layers. The conductive via layer is formed by a vapor deposition method such as evaporation, ion plating or sputtering. Alternatively, a portion of the conductive metal layers and the conductive via layer are simultaneously formed. Especially according to the latter method of forming a portion of the conductive metal layers and the conductive via layer simultaneously, the conductive via layer need not be formed after the conductive metal layers so that the fabrication steps are simplified. Moreover, the thicknesses of the conductive metal layers are not adversely affected later, and the conductive metal layers and the conductive via layer can be positioned highly precisely to form a fine wiring pattern.
摘要翻译：能够形成精细图案而不影响导电金属层的厚度的多金属层布线TAB带载体，以及制造多金属层布线TAB带载体的工艺。该TAB带载体被构造成使得各个电介质膜层插入具有预定布线图案的多个导电金属层的相邻的导电金属层之间，使得电介质膜层形成有界面连接孔，并且导电通孔层为形成在界面连接孔中以电连接相邻的导电金属层。导电通孔层通过蒸发，离子镀或溅射等气相沉积法形成。或者，同时形成一部分导电金属层和导电通孔层。特别地，根据后一种形成导电金属层和导电通路层的一部分的方法，导电通孔层不需要在导电金属层之后形成，从而简化制造步骤。此外，导电性金属层的厚度以后不会受到不利影响，并且可以高精度地定位导电金属层和导电通孔层以形成精细的布线图案。

62. 发明授权

US5442229A Metal lead-film carrier assembly having a plurality of film carriers, and film carrier-semiconductor chip assembly and semiconductor device containing such metal lead-film carrier assembly 失效
标题翻译：具有多个膜载体的金属铅膜载体组件和包含这种金属引线膜载体组件的膜载体 - 半导体芯片组件和半导体装置
公开(公告)号：US5442229A
公开(公告)日：1995-08-15
申请号：US118646
申请日：1993-09-10
申请人： Takao Mori , Satoshi Yoshida , Tadahiko Nishimukai , Kenji Yamaguchi
发明人： Takao Mori , Satoshi Yoshida , Tadahiko Nishimukai , Kenji Yamaguchi
IPC分类号： H01L21/60 , H01L23/495 , H01L23/50 , H01L25/04 , H01L25/18 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L24/81 , H01L23/49572 , H01L2224/13111 , H01L2224/13144 , H01L2224/16145 , H01L2224/73253 , H01L2224/81801 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/16195 , H01L2924/30105 , H01L2924/30107
摘要： A method of assembling a semiconductor chip on a tape carrier has the steps of stacking, on a film carrier having a first group of metal leads, another film carrier having a second group of metal leads and bonding the two film carriers together by adhesive to form a laminated structure. The first and second groups of metal leads are so disposed that they do not contact and do not cross one another. The tips of the metal leads of the two groups are bonded to the electrodes on the semiconductor chip. The metal leads are formed in advance on the corresponding film carriers by etching. By stacking the plurality of film carriers, the connection pitch can be reduced while eliminating a necessity for reducing the thickness of each lead.
摘要翻译：将半导体芯片组装在带载体上的方法具有以下步骤：在具有第一组金属引线的薄膜载体上堆叠具有第二组金属引线的另一薄膜载体，并通过粘合剂将两个薄膜载体粘合在一起形成层压结构。金属引线的第一组和第二组被布置成使它们不接触并且不互相交叉。两组的金属引线的尖端接合到半导体芯片上的电极。金属引线通过蚀刻预先形成在相应的载体上。通过堆叠多个薄膜载体，可以减少连接间距，而不需要减少每个导线的厚度。

63. 发明授权

US5277009A Exterior wall units comprising siding members and tiles 失效
标题翻译：外墙单元包括壁板和瓷砖
公开(公告)号：US5277009A
公开(公告)日：1994-01-11
申请号：US809480
申请日：1992-01-08
申请人： Kenji Yamaguchi , Shun-ichi Kobayashi , Fumitoshi Okazaki
发明人： Kenji Yamaguchi , Shun-ichi Kobayashi , Fumitoshi Okazaki
IPC分类号： E04F13/08 , E04F13/14
CPC分类号： E04F13/0889 , E04F13/0862 , E04F13/14
摘要： According to the invention, there is provided an exterior wall unit for an exterior wall of a building structure, which comprises a siding member (10) made of a metal and one or more porcelain tiles (20) corresponding in size to and fitted to the outside surface of the siding member (10), the siding member (10) having the outside surface formed with engaging means (16) extending in the horizontal direction for engagement with the tile or tiles (20), each tile (20) being formed with engaging means (23) for engagement with the engaging means (16) of the siding member (10), each tile (20) being coupled to the outside surface of the siding member (10) to be integral therewith with the engagement of both the engaging means (16, 23). In a basic mode of invention, the engaging means (16) of the siding member (10) is constituted by a downwardly directed and an upwardly directed L-shaped portion formed along the upper and lower edges, respectively, and the engaging means (23) of each tile (20) is constituted by upper and lower edge portions capable of being fitted in the spaces defined by the L-shaped portions, each tile being fitted in the siding member (10) with sidewise sliding therealong, the engaging means of the siding member (10) forming a tile cross joint (19) when vertically adjacent siding members (10) are coupled together.
摘要翻译： PCT No.PCT / JP90 / 00647 Sec。 371日期1992年1月8日 102（e）日期1992年1月8日PCT提交1990年5月22日PCT公布。 WO91 / 18159 PCT公开号根据本发明，提供了一种用于建筑结构的外壁的外壁单元，其包括由金属制成的壁板构件（10）和一个或多个瓷砖（20）对应尺寸设置在壁板构件（10）的外表面上，具有外表面的壁板构件（10）形成有沿水平方向延伸的接合装置（16），用于与瓦片（20）接合，每个瓦片（20）形成有用于与壁板构件（10）的接合装置（16）接合的接合装置（23），每个瓦片（20）联接到壁板构件（10）的外表面，以便与啮合装置（16,23）的接合一体。在本发明的基本模式中，壁板构件（10）的接合装置（16）分别由沿着上边缘和下边缘形成的向下和向上的L形部分构成，并且接合装置（23 ）由上下边缘部分构成，上边缘部分和下边缘部分能够嵌合在由L形部分限定的空间中，每个瓦片沿着侧向滑动装配在壁板部件（10）中，接合装置当垂直相邻的壁板构件（10）联接在一起时，形成瓦片十字接头（19）的壁板构件（10）。

64. 外观设计

USD328795S Skylight 失效
公开(公告)号：USD328795S
公开(公告)日：1992-08-18
申请号：US440048
申请日：1989-11-21
申请人： Kenji Yamaguchi , Daisuke Hozumi
设计人： Kenji Yamaguchi , Daisuke Hozumi

65. 发明授权

US4359425A Organo-platinum complex 失效
标题翻译：有机铂复合物
公开(公告)号：US4359425A
公开(公告)日：1982-11-16
申请号：US249455
申请日：1981-03-31
申请人： Tetsushi Totani , Kenji Yamaguchi
发明人： Tetsushi Totani , Kenji Yamaguchi
IPC分类号： A61K31/28 , A61K31/282 , A61P35/00 , C07C53/16 , C07C55/07 , C07C55/08 , C07C59/06 , C07C63/307 , C07F15/00
CPC分类号： C07C59/06 , C07C53/16 , C07C55/07 , C07C55/08 , C07C63/307 , C07F15/0093 , Y10S514/908
摘要： Organo-platinum complexes of the following formula having excellent antitumor actions: ##STR1## X and Y each or taken together is a mono- or bi-functional ligand selected from the group consisting of halogeno, nitrato, sulfonato, monocarboxylato (mono-functional), sulfato, and dicarboxylato (bi-functional);and each of n and m is an integer of 1 or 2.
摘要翻译：具有优异抗肿瘤作用的下式的有机铂络合物：各自或一起取代的单一或二官能配体是选自卤代，硝酸根，磺酸根，单羧基（单官能），硫酸酯和二羧酸（双功能）; n和m各自为1或2的整数。

66. 发明授权

US08310514B2 Line head control method, image forming method, and image forming apparatus 有权
标题翻译：线头控制方法，图像形成方法和图像形成装置
公开(公告)号：US08310514B2
公开(公告)日：2012-11-13
申请号：US12333961
申请日：2008-12-12
申请人： Kenji Yamaguchi , Nozomu Inoue
发明人： Kenji Yamaguchi , Nozomu Inoue
IPC分类号： B41J2/45
CPC分类号： H04N1/506 , G03G15/043 , G03G2215/0132 , G03G2215/0158
摘要： A control method of a line head including a first image forming system; a first light emission element which emits light for forming an image by an image forming lens of the first image forming system; a second image forming system disposed in a first direction of the first image forming system; and a second light emission element which emits light for forming an image by an image forming lens of the second image forming system is disclosed. The method includes, when the first light emission element emits light at a time t0 and then emits light after a time t1 from the time t0, and also when the second light emission element emits light after a time t2 from the time t0, controlling the time t1 and the time t2 such that t2≠n·t1 (n: 2 or larger integer) holds.
摘要翻译：一种包括第一图像形成系统的行头的控制方法; 第一发光元件，其通过第一图像形成系统的图像形成透镜发射用于形成图像的光; 设置在第一图像形成系统的第一方向上的第二图像形成系统; 并且公开了通过第二图像形成系统的图像形成透镜发射用于形成图像的光的第二发光元件。该方法包括：当第一发光元件在时间t0发光，然后在从时刻t0开始的时间t1之后发光，并且当第二发光元件在从时刻t0开始的时间t2之后发光时，时间t1和时间t2使得t2≠n·t1（n：2或更大的整数）成立。

67. 发明申请

US20110012231A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110012231A1
公开(公告)日：2011-01-20
申请号：US12891214
申请日：2010-09-27
申请人： Hiroyuki AMISHIRO , Toshio Kumamoto , Motoshige Igarashi , Kenji Yamaguchi
发明人： Hiroyuki AMISHIRO , Toshio Kumamoto , Motoshige Igarashi , Kenji Yamaguchi
IPC分类号： H01L29/8605
CPC分类号： H01L27/0207 , H01L27/0629 , H01L27/0802 , H01L28/20
摘要： A semiconductor device of the invention has a plurality of resistor elements formed on an element isolating oxide film in predetermined regions on a surface of a semiconductor substrate. Active regions are furnished close to the resistor elements. This allows the element isolating oxide film near the resistor elements to be divided into suitable strips, forestalling a concave formation at the center of the element isolating oxide film upon polishing of the film by CMP and thereby enhancing dimensional accuracy of the resistor elements upon fabrication.
摘要翻译：本发明的半导体器件具有在半导体衬底的表面上的预定区域中的元件隔离氧化膜上形成的多个电阻元件。有源区靠近电阻元件配置。这允许电阻元件附近的元件隔离氧化膜被分成合适的条，在通过CMP抛光膜时防止元件隔离氧化膜中心处的凹陷形成，从而提高制造时电阻器元件的尺寸精度。

68. 发明授权

US07821078B2 Semiconductor device having resistor elements and method for manufacturing the same 有权
标题翻译：具有电阻元件的半导体器件及其制造方法
公开(公告)号：US07821078B2
公开(公告)日：2010-10-26
申请号：US12007496
申请日：2008-01-11
申请人： Hiroyuki Amishiro , Toshio Kumamoto , Motoshige Igarashi , Kenji Yamaguchi
发明人： Hiroyuki Amishiro , Toshio Kumamoto , Motoshige Igarashi , Kenji Yamaguchi
IPC分类号： H01L27/088
CPC分类号： H01L27/0207 , H01L27/0629 , H01L27/0802 , H01L28/20
摘要： A semiconductor device of the invention has a plurality of resistor elements formed on an element isolating oxide film in predetermined regions on a surface of a semiconductor substrate. Active regions are furnished close to the resistor elements. This allows the element isolating oxide film near the resistor elements to be divided into suitable strips, forestalling a concave formation at the center of the element isolating oxide film upon polishing of the film by CMP and thereby enhancing dimensional accuracy of the resistor elements upon fabrication.
摘要翻译：本发明的半导体器件具有在半导体衬底的表面上的预定区域中的元件隔离氧化膜上形成的多个电阻元件。有源区靠近电阻元件配置。这允许电阻元件附近的元件隔离氧化膜被分成合适的条，在通过CMP抛光膜时防止元件隔离氧化膜中心处的凹陷形成，从而提高制造时电阻器元件的尺寸精度。

69. 发明申请

US20070073812A1 Terminal device 有权
标题翻译：终端设备
公开(公告)号：US20070073812A1
公开(公告)日：2007-03-29
申请号：US10562912
申请日：2004-06-30
申请人： Kenji Yamaguchi
发明人： Kenji Yamaguchi
IPC分类号： G06F15/16
CPC分类号： H04M1/72547
摘要： The present invention is a terminal device for transmitting and receiving mails, comprising: a mail receiving unit; a judging unit operable to judge whether a command declaration is included in a received mail; a command interpreting unit operable to extract and interpret a specific command following the command-declaration if the judgment of the judging unit is affirmative; a creating unit operable to create, if the specific command is interpreted as target list creation, a list of corresponding targets in memory of the terminal device; and a mail transmitting unit operable to create and transmit a mail having the created list as a mail main body and addressed to a requester.
摘要翻译：本发明是一种用于发送和接收邮件的终端设备，包括：邮件接收单元; 判断单元，用于判断在接收到的邮件中是否包括命令声明; 命令解释单元，用于在判断单元的判断为肯定的情况下，提取和解释命令声明之后的特定命令; 创建单元，其可操作以在所述特定命令被解释为目标列表创建时创建所述终端设备的存储器中的相应目标的列表; 以及邮件发送单元，用于创建并发送具有创建的列表作为邮件主体并且寻址到请求者的邮件。

70. 发明申请

US20060194035A1 Die-expanded molding apparatus and method for synthetic resin, and die-expanded molded foam obtained thereby 审中-公开
公开(公告)号：US20060194035A1
公开(公告)日：2006-08-31
申请号：US11430870
申请日：2006-05-10
申请人： Iwao Nohara , Tomio Nakajima , Kiyotaka Ida , Masahiko Sameshima , Yoshiyuki Kobayashi , Kenji Yamaguchi
发明人： Iwao Nohara , Tomio Nakajima , Kiyotaka Ida , Masahiko Sameshima , Yoshiyuki Kobayashi , Kenji Yamaguchi
IPC分类号： B32B3/26 , B29C67/20 , B29C44/00
CPC分类号： B29C44/445 , Y10T428/249953
摘要： A die-expanded molding apparatus comprising starting material bead supply for supplying beads on a current of air from a tank through a packer into a cavity formed by a core and cavity molds; a plurality of air expulsion devices having air pressure-adjusting components communicating with the cavity, a dual-system air expulsion device being such that steam chambers on the back side of the core mold and the cavity mold are used as the air pressure-adjusting components, each communicating with the cavity through through-holes formed in the core and cavity molds, respectively; an air expulsion device having one or more air pressure-adjusting components communicating with a clearance between the core and cavity molds; and a control for controlling the air pressure in each of the air pressure-adjusting components to be pressurized less than the pressure in the tank.

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