专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5589668A Multi-metal layer wiring tab tape carrier and process for fabricating the same 失效
标题翻译：多金属层接线片带载体及其制造方法
公开(公告)号：US5589668A
公开(公告)日：1996-12-31
申请号：US149795
申请日：1993-11-10
申请人： Kenji Yamaguchi , Shoji Takagi , Sadahiko Mitsugi , Mamoru Mita , Tomio Murakami
发明人： Kenji Yamaguchi , Shoji Takagi , Sadahiko Mitsugi , Mamoru Mita , Tomio Murakami
IPC分类号： H01L23/498 , H05K3/40 , H05K1/14
CPC分类号： H01L23/4985 , H05K3/4076 , H01L2924/0002 , H01L2924/3011
摘要： A multi-metal layer wiring TAB tape carrier capable of forming a fine pattern without affecting the thicknesses of conductive metal layers, and a process for fabricating the multi-metal layer wiring TAB tape carrier. This TAB tape carrier is constructed such that respective dielectric film layers are interposed between adjacent ones of plurality of conductive metal layers having a predetermined wiring pattern, such that the dielectric film layer is formed with interfacial connection holes, and such that a conductive via layer is formed in the interfacial connection holes to electrically connect adjacent conductive metal layers. The conductive via layer is formed by a vapor deposition method such as evaporation, ion plating or sputtering. Alternatively, a portion of the conductive metal layers and the conductive via layer are simultaneously formed. Especially according to the latter method of forming a portion of the conductive metal layers and the conductive via layer simultaneously, the conductive via layer need not be formed after the conductive metal layers so that the fabrication steps are simplified. Moreover, the thicknesses of the conductive metal layers are not adversely affected later, and the conductive metal layers and the conductive via layer can be positioned highly precisely to form a fine wiring pattern.
摘要翻译：能够形成精细图案而不影响导电金属层的厚度的多金属层布线TAB带载体，以及制造多金属层布线TAB带载体的工艺。该TAB带载体被构造成使得各个电介质膜层插入具有预定布线图案的多个导电金属层的相邻的导电金属层之间，使得电介质膜层形成有界面连接孔，并且导电通孔层为形成在界面连接孔中以电连接相邻的导电金属层。导电通孔层通过蒸发，离子镀或溅射等气相沉积法形成。或者，同时形成一部分导电金属层和导电通孔层。特别地，根据后一种形成导电金属层和导电通路层的一部分的方法，导电通孔层不需要在导电金属层之后形成，从而简化制造步骤。此外，导电性金属层的厚度以后不会受到不利影响，并且可以高精度地定位导电金属层和导电通孔层以形成精细的布线图案。

IPRDB

热门服务

关于我们

友情链接

联系方式