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51. 外观设计

USD725613S1 LED package 有权
公开(公告)号：USD725613S1
公开(公告)日：2015-03-31
申请号：US29424861
申请日：2012-06-15
申请人： Theodore Lowes , Eric J. Tarsa , Sten Heikman , Bernd Keller , John A. Edmond , Jesse Reiherzer , Hormoz Benjamin
设计人： Theodore Lowes , Eric J. Tarsa , Sten Heikman , Bernd Keller , John A. Edmond , Jesse Reiherzer , Hormoz Benjamin

52. 外观设计

USD718258S1 LED package 有权
公开(公告)号：USD718258S1
公开(公告)日：2014-11-25
申请号：US29431064
申请日：2012-09-02
申请人： Theodore Lowes , Eric J. Tarsa , Sten Heikman , Bernd Keller , John A. Edmond , Jesse Reiherzer , Hormoz Benjamin , Christopher P. Hussell
设计人： Theodore Lowes , Eric J. Tarsa , Sten Heikman , Bernd Keller , John A. Edmond , Jesse Reiherzer , Hormoz Benjamin , Christopher P. Hussell

53. 外观设计

USD711840S1 LED package 有权
标题翻译： LED封装
公开(公告)号：USD711840S1
公开(公告)日：2014-08-26
申请号：US29424353
申请日：2012-06-11
申请人： Theodore Lowes , Eric J. Tarsa , Sten Heikman , Bernd Keller , John A. Edmond , Jesse Reiherzer , Hormoz Benjamin
设计人： Theodore Lowes , Eric J. Tarsa , Sten Heikman , Bernd Keller , John A. Edmond , Jesse Reiherzer , Hormoz Benjamin

54. 发明授权

US10147853B2 Encapsulant with index matched thixotropic agent 有权
公开(公告)号：US10147853B2
公开(公告)日：2018-12-04
申请号：US13051894
申请日：2011-03-18
申请人： Bernd Keller , Theodore Lowes
发明人： Bernd Keller , Theodore Lowes
IPC分类号： H01L33/52 , H01L33/56
摘要： Emitter packages are disclosed having a thixotropic agent or material, with the encapsulant exhibiting significant reduction of thixotropic agent scattering. The packages exhibit a corresponding reduction or elimination of encapsulant clouding and increased package emission efficiency. This allows for the thixotropic agents to be included in the encapsulant to alter certain properties (e.g. mechanical or thermal) while not significantly altering the optical properties of the encapsulant. One embodiment of a light emitting diode (LED) package according to the present invention comprises an LED chip with an encapsulant over the LED chip. The encapsulant has an encapsulant refractive index and also has a thixotropic material with a refractive index that is substantially the same as the encapsulant refractive index.

55. 发明授权

US09159888B2 Wafer level phosphor coating method and devices fabricated utilizing method 有权
标题翻译：晶圆级荧光粉涂布方法及利用方法制造的器件
公开(公告)号：US09159888B2
公开(公告)日：2015-10-13
申请号：US11899790
申请日：2007-09-07
申请人： Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , Yankun Fu
发明人： Ashay Chitnis , James Ibbetson , Bernd Keller , David T. Emerson , John Edmond , Michael J. Bergmann , Jasper S. Cabalu , Jeffrey C. Britt , Arpan Chakraborty , Eric Tarsa , James Seruto , Yankun Fu
IPC分类号： H01L33/00 , H01L33/50 , H01L33/62 , H01L33/38 , H01L33/36 , H01L33/44 , H01L33/54
CPC分类号： H01L33/508 , H01L33/0095 , H01L33/36 , H01L33/387 , H01L33/44 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.
摘要翻译：制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。基座沉积在LED上，每个基座与其中一个LED电接触。在LED上形成涂层，其中涂层埋入至少一些基座。然后将涂层平坦化以暴露至少一些埋置的基座，同时在所述LED上留下至少一些所述涂层。然后可以例如通过引线接合露出的基座。本发明公开了用于制造LED芯片的类似方法，所述LED芯片具有倒装芯片接合在载体基板上并用于制造其它半导体器件的LED。还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。

56. 发明申请

US20140009932A1 LIGHT EMITTING DIODE PRIMARY OPTIC FOR BEAM SHAPING 有权
标题翻译：光发射二极管主光学用于光束形状
公开(公告)号：US20140009932A1
公开(公告)日：2014-01-09
申请号：US13544662
申请日：2012-07-09
申请人： Eric Tarsa , Monica Hansen , Bernd Keller
发明人： Eric Tarsa , Monica Hansen , Bernd Keller
IPC分类号： F21V7/04 , F21V7/00
CPC分类号： H01L33/54 , F21K9/233 , F21S8/026 , F21V7/0008 , F21V7/005 , F21V13/04 , F21V29/74 , F21Y2115/10
摘要： LED components are described having primary optics provide improved LED component emission characteristics. Light fixtures are also described that utilize the LED components to provide improved light fixture emissions. One LED component according to the present invention comprises an LED chip emitting an LED chip emission pattern. A primary optic is included directly on the LED chip with LED light from the LED chip passing through the primary optic. The primary optic shapes the LED emission pattern into an LED component emission pattern with the LED component emission pattern being broader than the LED chip emission pattern.
摘要翻译：描述了具有主要光学器件的LED组件，提供了改进的LED组件发射特性。还描述了利用LED组件来提供改进的灯具排放物的灯具。根据本发明的一个LED组件包括发射LED芯片发射图案的LED芯片。主要光学元件直接包含在LED芯片上，LED芯片的LED光通过主光学元件。主要光学器件将LED发射图案形成LED组件发射图案，其中LED组件发射图案比LED芯片发射图案更宽。

57. 发明申请

US20080012036A1 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices 有权
标题翻译：用于固态发光器件的基于引线框的封装以及用于形成固态发光器件的基于引线框的封装的方法
公开(公告)号：US20080012036A1
公开(公告)日：2008-01-17
申请号：US11657347
申请日：2007-01-24
申请人： Ban Loh , Nicholas Medendorp , Eric Tarsa , Bernd Keller
发明人： Ban Loh , Nicholas Medendorp , Eric Tarsa , Bernd Keller
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括引线框架，该引线框架包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域。引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。热固性封装体可以在第二区域的顶表面和底表面上。泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

58. 发明申请

US20070120129A1 Rare earth doped layer or substrate for light conversion 有权
标题翻译：用于光转换的稀土掺杂层或衬底
公开(公告)号：US20070120129A1
公开(公告)日：2007-05-31
申请号：US11353647
申请日：2006-02-13
申请人： Steven DenBaars , Eric Tarsa , Michael Mack , Bernd Keller , Brian Thibeault , Adam Saxler
发明人： Steven DenBaars , Eric Tarsa , Michael Mack , Bernd Keller , Brian Thibeault , Adam Saxler
IPC分类号： H01L33/00
CPC分类号： H01L33/08 , H01L25/0756 , H01L27/15 , H01L33/025 , H01L33/30 , H01L33/343 , H01L33/465 , H01L33/502 , H01L2224/8592 , H01L2924/0002 , H01S5/405 , H01S5/4087 , H01L2924/00
摘要： A solid state light emitting device comprising an emitter structure having an active region of semiconductor material and a pair of oppositely doped layers of semiconductor material on opposite sides of the active region. The active region emits light at a predetermined wavelength in response to an electrical bias across the doped layers. An absorption layer of semiconductor material is included that is integral to said emitter structure and doped with at least one rare earth or transition element. The absorption layer absorbs at least some of the light emitted from the active region and re-emits at least one different wavelength of light. A substrate is included with the emitter structure and absorption layer disposed on the substrate.
摘要翻译：一种固态发光器件，包括具有半导体材料的有源区的发射极结构和在该有源区的相对侧上的一对相对掺杂的半导体材料层。响应于穿过掺杂层的电偏压，有源区域以预定波长发光。包括与所述发射极结构成一体并掺杂有至少一种稀土或过渡元素的半导体材料的吸收层。吸收层吸收从有源区域发射的至少一些光并且再发射至少一个不同波长的光。发射体结构和衬底上设置的吸收层包括衬底。

59. 发明申请

US20060131599A1 Light emitting diodes including pedestals 审中-公开
标题翻译：包括基座的发光二极管
公开(公告)号：US20060131599A1
公开(公告)日：2006-06-22
申请号：US11338918
申请日：2006-01-25
申请人： David Slater , Robert Glass , Charles Swoboda , Bernd Keller , James Ibbetson , Brian Thibeault , Eric Tarsa
发明人： David Slater , Robert Glass , Charles Swoboda , Bernd Keller , James Ibbetson , Brian Thibeault , Eric Tarsa
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L33/10 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/32014 , H01L2224/48091 , H01L2224/73265 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. The first face of the substrate may include therein a plurality of grooves that define the plurality of triangular pedestals in the substrate. The grooves may include tapered sidewalls and/or a beveled floor. The first face of the substrate also may include therein an array of via holes. The via holes may include tapered sidewalls and/or a floor.
摘要翻译：发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向第二张脸。第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。衬底的第一面可以包括在衬底中限定多个三角形基座的多个凹槽。凹槽可以包括锥形侧壁和/或斜面底板。衬底的第一面也可以包括一组通孔。通孔可以包括锥形侧壁和/或底板。

60. 发明授权

US08735920B2 Light emitting diode package with optical element 有权
标题翻译：具有光学元件的发光二极管封装
公开(公告)号：US08735920B2
公开(公告)日：2014-05-27
申请号：US11496922
申请日：2006-07-31
申请人： James Ibbetson , Eric Tarsa , Michael Leung , Maryanne Becerra , Bernd Keller
发明人： James Ibbetson , Eric Tarsa , Michael Leung , Maryanne Becerra , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2933/005 , H01L2924/00014
摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.
摘要翻译：一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。在基板和透镜之间布置粘合剂以将透镜保持在基板上并补偿透镜与封装的其余部分之间的不同热膨胀系数（CTE）。一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

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