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1. 发明申请

US20080012036A1 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices 有权
标题翻译：用于固态发光器件的基于引线框的封装以及用于形成固态发光器件的基于引线框的封装的方法
公开(公告)号：US20080012036A1
公开(公告)日：2008-01-17
申请号：US11657347
申请日：2007-01-24
申请人： Ban Loh , Nicholas Medendorp , Eric Tarsa , Bernd Keller
发明人： Ban Loh , Nicholas Medendorp , Eric Tarsa , Bernd Keller
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/483 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
摘要翻译：用于发光器件的模块化封装包括引线框架，该引线框架包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域。引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。热固性封装体可以在第二区域的顶表面和底表面上。泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

2. 发明申请

US20070253209A1 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same 有权
标题翻译：用于半导体发光器件封装的底座以及包括其的半导体发光器件封装
公开(公告)号：US20070253209A1
公开(公告)日：2007-11-01
申请号：US11412381
申请日：2006-04-27
申请人： Ban Loh , Nicholas Medendorp , Bernd Keller
发明人： Ban Loh , Nicholas Medendorp , Bernd Keller
IPC分类号： B60Q1/124
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译：一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫，接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域并且延伸到所述支撑构件的第二侧表面的延伸区域。第二电接合板的管芯安装区域可以被配置为接收电子设备。底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

3. 外观设计

USD594827S1 Lamp package 有权
公开(公告)号：USD594827S1
公开(公告)日：2009-06-23
申请号：US29250973
申请日：2006-12-07
申请人： Ban Loh , Nicholas W. Medendorp, Jr. , Bernd Keller , Eric Tarsa
设计人： Ban Loh , Nicholas W. Medendorp, Jr. , Bernd Keller , Eric Tarsa

4. 发明申请

US20110267801A1 LED LAMP OR BULB WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION WITH ENHANCED SCATTERING PROPERTIES 有权
标题翻译：带有远程磷光体的LED灯或灯泡和具有增强散射特性的差分配置
公开(公告)号：US20110267801A1
公开(公告)日：2011-11-03
申请号：US13018291
申请日：2011-01-31
申请人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas Medendorp, JR. , Antony van de Ven , Gerald Negley
发明人： Tao Tong , Ronan Le Toquin , Bernd Keller , Eric Tarsa , Mark Youmans , Theodore Lowes , Nicholas Medendorp, JR. , Antony van de Ven , Gerald Negley
IPC分类号： F21V9/16 , F21V9/00
CPC分类号： F21V9/30 , F21K9/232 , F21K9/64 , F21V3/00 , F21V3/02 , F21V29/505 , F21V29/767 , F21V29/773 , F21Y2115/10
摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.
摘要翻译：公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。荧光体载体包括导热透明材料并且热耦合到散热器结构。基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。扩散器的性质，如几何形状，散射层的散射特性，表面粗糙度或平滑度以及散射层性质的空间分布可用于控制各种灯具性能，如颜色均匀性和光强度分布，作为可视角度。

5. 发明申请

US20070161135A1 Method for coating semiconductor device using droplet deposition 有权
标题翻译：使用液滴沉积涂覆半导体器件的方法
公开(公告)号：US20070161135A1
公开(公告)日：2007-07-12
申请号：US11328887
申请日：2006-01-09
申请人： Bernd Keller , Ban Loh
发明人： Bernd Keller , Ban Loh
IPC分类号： H01L21/00
CPC分类号： B41J3/407 , H01L21/6715 , H01L33/505 , H01L2224/48463 , H01L2224/73265 , H01L2224/8592 , H01L2933/0041
摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.
摘要翻译：在液体介质中使用波长转换或荧光体颗粒的液滴涂覆半导体器件的方法和系统。多个喷嘴将受控量的基质材料输送到半导体器件的表面，其中每个所述喷嘴具有用于基质材料通过的开口。开口具有其中荧光体颗粒的直径小于或近似等于开口直径的一半的直径。荧光体颗粒也基本上是球形或圆形。喷嘴通常布置在打印头上，该打印头利用喷墨打印技术来覆盖具有基质材料层的半导体器件。该方法和系统特别适用于用一层磷光体材料覆盖LED。

6. 外观设计

USD615504S1 Emitter package 有权
标题翻译：发射器包
公开(公告)号：USD615504S1
公开(公告)日：2010-05-11
申请号：US29292900
申请日：2007-10-31
申请人： Bernd Keller , Nicholas Medendorp, Jr. , Thomas Cheng-Hsin Yuan
设计人： Bernd Keller , Nicholas Medendorp, Jr. , Thomas Cheng-Hsin Yuan
CPC分类号： H01L2224/49113

7. 发明申请

US20100109029A1 Semiconductor Light Emitting Device Packages Including Submounts 有权
标题翻译：半导体发光装置包括底座
公开(公告)号：US20100109029A1
公开(公告)日：2010-05-06
申请号：US12685883
申请日：2010-01-12
申请人： Ban P. Loh , Nicholas Medendorp, JR. , Bernd Keller
发明人： Ban P. Loh , Nicholas Medendorp, JR. , Bernd Keller
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译：一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫，接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域并且延伸到所述支撑构件的第二侧表面的延伸区域。第二电接合板的管芯安装区域可以被配置为接收电子设备。底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

8. 发明授权

US07655957B2 Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same 有权
标题翻译：用于半导体发光器件封装的底座以及包括其的半导体发光器件封装
公开(公告)号：US07655957B2
公开(公告)日：2010-02-02
申请号：US11412381
申请日：2006-04-27
申请人： Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
发明人： Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
IPC分类号： H01L29/22 , H01L23/48
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译：一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫，接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域并且延伸到所述支撑构件的第二侧表面的延伸区域。第二电接合板的管芯安装区域可以被配置为接收电子设备。底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

9. 发明授权

US09070850B2 Light emitting diode package and method for fabricating same 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US09070850B2
公开(公告)日：2015-06-30
申请号：US11982275
申请日：2007-10-31
申请人： Bernd Keller , Nicholas Medendorp, Jr. , Thomas Cheng-Hsin Yuan
发明人： Bernd Keller , Nicholas Medendorp, Jr. , Thomas Cheng-Hsin Yuan
IPC分类号： H01L33/62 , H01L33/64 , H01L33/54
CPC分类号： H01L33/62 , H01L33/54 , H01L33/64 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01087 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a submount having a top and bottom surface with a plurality of top electrically and thermally conductive elements on its top surface. An LED is included on one of the top elements such that an electrical signal applied to the top elements causes the LED to emit light. The electrically conductive elements also spread heat from the LED across the majority of the submount top surface. A bottom thermally conductive element is included on the bottom surface of said submount and spreads heat from the submount, and a lens is formed directly over the LED. A method for fabricating LED packages includes providing a submount panel sized to be separated into a plurality of LED package submounts. Top conductive elements are formed on one surface of the submount panel for a plurality of LED packages, and LEDs are attached to the top elements. Lenses are molded over the LEDs and the substrate panel is singulated to separate it into a plurality of LED packages.
摘要翻译： LED封装包括其顶表面和底表面的底座，其顶表面上具有多个顶部导电和导热元件。顶部元件之一中包括LED，使得施加到顶部元件的电信号使得LED发光。导电元件还将散热的LED从跨越大多数的底座顶面传播。底部导热元件包括在所述底座的底表面上并且从底座散热，并且在LED上直接形成透镜。一种制造LED封装的方法包括提供尺寸被分成多个LED封装底座的底座面板。顶部导电元件形成在用于多个LED封装的基座面板的一个表面上，并且LED附接到顶部元件。在LED上模制透镜，并且衬底面板被分割成多个LED封装。

10. 发明授权

US08378374B2 Semiconductor light emitting device packages including submounts 有权
标题翻译：半导体发光器件封装包括底座
公开(公告)号：US08378374B2
公开(公告)日：2013-02-19
申请号：US12685883
申请日：2010-01-12
申请人： Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
发明人： Ban P. Loh , Nicholas Medendorp, Jr. , Bernd Keller
IPC分类号： H01L33/62 , H01L33/64
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/19107 , H01L2924/00014
摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.
摘要翻译：一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫，接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域并且延伸到所述支撑构件的第二侧表面的延伸区域。第二电接合板的管芯安装区域可以被配置为接收电子设备。底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

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