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    • 52. 发明申请
    • METHOD FOR PRODUCING AN ELECTRODE-MEMBRANE-FRAME ASSEMBLY
    • 用于生产电极 - 膜框架组件的方法
    • US20100248087A1
    • 2010-09-30
    • US12745743
    • 2008-12-04
    • Yoichiro TsujiToshihiro MatsumotoHiroki KusakabeTakashi Morimoto
    • Yoichiro TsujiToshihiro MatsumotoHiroki KusakabeTakashi Morimoto
    • H01M8/00
    • B29C45/1671B29C45/14065B29C45/14836B29C2045/1673B29L2031/3468H01M8/0202H01M8/0286H01M8/1004H01M2008/1095Y02P70/56
    • In the method of the invention for producing an electrode-membrane-frame assembly, its principal part is formed by laying a first catalyst layer onto one of surfaces of an electrolyte membrane, arranging a first gas diffusion layer onto the surface of the first catalyst layer and inside the circumferential region of the electrolyte membrane, laying a second catalyst layer onto the other surface of the electrolyte membrane, and arranging a second gas diffusion layer onto the surface of the second catalyst layer and inside the circumferential region of the electrolyte membrane so as to make the position of the outer circumference of the second gas diffusion layer different from that of the outer circumference of the first gas diffusion layer. Then, in the state that an outer circumferential portion of either the first gas diffusion layer or the second gas diffusion layer, the portion being positioned outside a region of the first and second gas diffusion layers wherein the two layers are opposed to each other, is opposed to a portion of a flat region located inside the frame of a frame-form primary molded body, the circumferential region of the principal part is arranged on the flat region, and subsequently a secondary molded body is formed to cover the circumferential region of the electrolyte membrane with the second molded body together with the primary molded body, in order to prevent the polymer electrolyte membrane from being broken or deformed.
    • 在制造电极 - 膜框架组件的本发明的方法中,其主要部分是通过在电解质膜的一个表面上铺设第一催化剂层而形成的,第一气体扩散层设置在第一催化剂层的表面上 并且在所述电解质膜的周向区域的内部,在所述电解质膜的另一个表面上设置第二催化剂层,在所述第二催化剂层的表面和所述电解质膜的周向区域内配置第二气体扩散层, 使第二气体扩散层的外周的位置与第一气体扩散层的外周的位置不同。 然后,在第一气体扩散层或第二气体扩散层的外周部分,位于第一和第二气体扩散层的其中两层彼此相对的区域之外的部分是 与位于框架一次成型体的框架内的平坦区域的一部分相对,主要部分的周向区域布置在平坦区域上,随后形成二次成型体以覆盖 电解质膜与第一成型体一起具有第二成型体,以防止聚合物电解质膜破裂或变形。
    • 55. 发明申请
    • DATA TRANSFER CONTROL DEVICE, DATA TRANSFER DEVICE, DATA TRANSFER CONTROL METHOD, AND SEMICONDUCTOR INTEGRATED CIRCUIT USING RECONFIGURED CIRCUIT
    • 数据传输控制设备,数据传输设备,数据传输控制方法和使用重新配置的电路的半导体集成电路
    • US20100042751A1
    • 2010-02-18
    • US12522490
    • 2008-10-24
    • Kouichi IshinoTakashi MorimotoKoji Asai
    • Kouichi IshinoTakashi MorimotoKoji Asai
    • G06F3/00
    • G11C7/10G06F13/1694
    • A semiconductor integrated circuit ensures to reserve a required memory bandwidth at low cost. A memory bandwidth monitoring unit 1210 calculates a required memory bandwidth, monitors the usage condition of the memory, and outputs the following information to a reconfiguration control unit 1120. The information is necessary to reconfigure a reconfiguration unit 1110 into a logic unit and a temporary buffer both of which are scalable depending on the usage condition. According to information, the reconfiguration control unit 1120 controls the reconfiguration unit 1110. The buffer is for storing data accessed to or from the memory by each bus master. The logic unit acts as a bus master that only uses a portion of the memory bandwidth that remains unused during the time no access request to the data storage unit 1002 issued by a bus master unit having a higher priority level is being executed.
    • 半导体集成电路确保以低成本保留所需的存储器带宽。 存储器带宽监视单元1210计算所需的存储器带宽,监视存储器的使用状况,并将以下信息输出到重新配置控制单元1120.该信息对于将重新配置单元1110重新配置为逻辑单元和临时缓冲器 这两者都可以根据使用条件进行扩展。 根据信息,重新配置控制单元1120控制重新配置单元1110.缓冲器用于存储由每个总线主机访问或从存储器访问的数据。 逻辑单元充当总线主机,其仅在没有执行具有较高优先级的总线主机单元发出的对数据存储单元1002的访问请求的时间内仅使用保持未使用的存储器带宽的一部分。
    • 58. 发明授权
    • Boot band
    • 启动乐队
    • US07424769B2
    • 2008-09-16
    • US10560355
    • 2004-06-04
    • Takashi OginoTakashi MorimotoHiroshi IkedaToshiya Migita
    • Takashi OginoTakashi MorimotoHiroshi IkedaToshiya Migita
    • F16B2/08
    • A43C11/00B65D63/02F16L33/025F16L33/035Y10T24/1457Y10T24/21
    • Buckling is prevented at the time of clamping a band body, and the band body is made short. A boot band comprises a band body 31 that is wound in a ring shape—around a member to be clamped—in such a way that the outer-layer portion 32 of the band body 31 overlaps the inner-layer portion 33 of the band body 31, engagement holes 34, 35 that are formed in the outer-layer portion 32, engagement pawls 36, 37 that are formed on the inner-layer portion 33 and that are to be engaged with the engagement holes 34, 35, so that the band body 31 is maintained in a clamped condition, a first boot-band pawl 41 that is formed on the to and at the end of the outer-layer portion 32, a planar end 39 that is formed closer to the end of the outer-layer portion 32 than the first boot-band pawl 41 is, a second boot-band pawl 38 that (1) is formed in the inner-layer portion 33, (2) has (a) an opening 38a wherein the terminal end 39 can be inserted, and (b) a pressing portion 38b for pressing—from the outside—the terminal end 39 that is inserted in the opening 38a, and (3) clamps the band body 31 together with the first boot-band pawl 41, and a slit 42 that is formed between the first boot-band pawl 41 and the engagement hole 34 in the outer-layer portion 32.
    • 在夹持带体时防止弯曲,并且使带体短。 靴带包括带状体31,该带体31围绕被夹持的构件缠绕成环形,使得带体31的外层部分32与带体的内层部分33重叠 31,形成在外层部分32中的接合孔34,35,形成在内层部分33上并且与接合孔34,35接合的接合爪36,37,使得 带体31保持在夹紧状态,形成在外层部分32的端部和端部的第一靴带棘爪41,形成为更靠近外层部分32的端部的平面端39, (1)形成在第二内壳部分33中的第二靴带棘爪38(2)具有(a)开口38a,其中终端39 可以插入,(b)从插入开口部41a的终端39的外侧按压的按压部38b,(3)将带子 y 31与第一靴带爪41一起形成,狭缝42形成在外层部分32中的第一靴带棘爪41和接合孔34之间。