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1. 发明申请

US20190061220A1 OVERMOLDING DEVICE OF COSMETIC VESSEL 审中-公开
公开(公告)号：US20190061220A1
公开(公告)日：2019-02-28
申请号：US15850441
申请日：2017-12-21
申请人： SAMHWA P&T CO., LTD.
发明人： Kyung Chang LEE
IPC分类号： B29C45/72
CPC分类号： B29C45/7207 , B29C45/14434 , B29C45/14836 , B29K2709/08 , B29L2031/718
摘要： Disclosed is an overmolding device of a cosmetic vessel including a cosmetic vessel made of glass, a cooling means for cooling the inside of the cosmetic vessel, and left and right outer molds and overmolding an outer shape of the cosmetic vessel with the cosmetic vessel and the cooling means interposed therebetween. According to the present invention, it is possible to prevent breakage of the vessel due to a molding temperature by cooling the inside of the cosmetic vessel by the cooling means at the time of overmolding of the cosmetic vessel such as a perfume bottle.

2. 发明申请

US20180261386A1 FORMING METHOD FOR PRODUCING A COMPOSITE PART HAVING A PERMANENT MAGNET 审中-公开
公开(公告)号：US20180261386A1
公开(公告)日：2018-09-13
申请号：US15905189
申请日：2018-02-26
申请人： PREH GMBH
发明人： René KIRSCH , Kai LANG
IPC分类号： H01F41/02 , H01F7/02 , B29C45/14
CPC分类号： H01F41/0266 , B29C45/14336 , B29C45/14377 , B29C45/14778 , B29C45/14836 , B29K2995/0008 , B29K2995/0013 , B29K2995/0015 , H01F7/02 , H01F7/0221 , H01F41/026
摘要： The present disclosure relates to a forming method for producing a composite part for an operating member, the method comprising the steps: disposing at least one permanent magnet in an injection-molding tool, which defines a mold cavity, and a heat-conducting reinforcement, which extends along the permanent magnet and is in touching contact with the injection-molding tool, in each case at a predefined position of the mold cavity; overmolding the permanent magnet with molding material by introducing molding material into the mold cavity; forming the composite part having the at least one permanent magnet, the heat-conducting reinforcement and the molding material.

3. 发明授权

US09962876B2 Ring-shaped insert molded article 有权
公开(公告)号：US09962876B2
公开(公告)日：2018-05-08
申请号：US15412213
申请日：2017-01-23
申请人： NAKANISHI METAL WORKS CO., LTD.
发明人： Yoshihiro Ito , Nobumasa Oka
IPC分类号： B29C45/38 , B29C45/14 , B29C45/27 , G01D5/12 , B29K105/00 , B29K705/00
CPC分类号： B29C45/2708 , B29C45/0025 , B29C45/14418 , B29C45/1459 , B29C45/14836 , B29C45/38 , B29C2045/0027 , B29C2045/2714 , B29C2045/2716 , B29K2077/00 , B29K2081/04 , B29K2101/10 , B29K2103/06 , B29K2105/16 , B29K2105/251 , B29K2705/00 , B29K2905/00 , B29K2995/0008 , G01D5/00 , G01D5/12 , G01D5/244 , Y10T428/218
摘要： A molded article 1 is configured such that an insert 2 is made of a steel plate and includes a cylindrical part 2A and an annular part 2B, a plastic 4 is annular in shape so as to be joined to the annular part 2B, inner diameter D1 of the plastic 4 is larger than inner diameter D2 of the annular part 2B so that no burrs at a gate mark E protrude to the inner diameter side of the molded article 1, the injection molding is conducted with a disc gate arranged on an inner peripheral surface F of the plastic 4 at a position separated from a surface of the annular part 2B, and the gate mark E resides on the inner peripheral surface F of the plastic 4 at a position separated from the surface of the annular part 2B.

4. 发明授权

US09914250B2 Retention of magnetic properties 有权
公开(公告)号：US09914250B2
公开(公告)日：2018-03-13
申请号：US13955996
申请日：2013-07-31
申请人： Apple Inc.
发明人： Douglas Joseph Weber , Julio C. Quintero , Benjamin M. Rappoport , Harry W. Smith, IV
IPC分类号： B29C45/14 , B29C45/78
CPC分类号： B29C45/14836 , B29C45/78 , B29C2945/76157 , B29C2945/76294 , B29C2945/76531 , B29C2945/76545 , B29C2945/76772 , B29C2945/76782 , B29C2945/76933 , B29K2995/0008
摘要： Methods, systems, and apparatuses for retaining magnetic properties of magnetic elements while undergoing manufacturing processes are presented. In one embodiment, a manufacturing fixture includes a temperature controlled region suitable for retaining a magnetic element. The manufacturing fixture also includes a cooling mechanism configured to maintain the magnetic element at an acceptable temperature range during a thermally active manufacturing process. The temperature controlled or stabilized region can include a structure configured to receive the magnetic element and a sensor, or sensors. In one embodiment, the sensor can be configured to measure an ambient temperature of the temperature stabilized region. In another embodiment, the sensor can be a magnetic sensor configured to determine a magnetic property of the magnetic element.

5. 发明授权

US09501102B2 Method of manufacturing surface panel 有权
标题翻译：制造面板的方法
公开(公告)号：US09501102B2
公开(公告)日：2016-11-22
申请号：US15004784
申请日：2016-01-22
申请人： ALPS ELECTRIC CO., LTD.
发明人： Shinji Okawara , Hajime Katono , Mitsuru Tokuta
IPC分类号： G06F1/16 , B29C45/14 , G06F3/041 , G06F3/044 , B29K33/00 , B29L31/34
CPC分类号： G06F1/1643 , B29C45/14811 , B29C45/14836 , B29K2033/12 , B29L2031/3475 , G06F1/1656 , G06F3/0412 , G06F3/044 , G06F2203/04103
摘要： A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer.
摘要翻译：一种使用具有模制凹部的第一模具和具有模制突出部分的第二模具制造包括由单个透射树脂层形成的前面板主体和附接到其上的传感器膜的前面板。将第一模具和第二模具接合在一起，使得通过将传感器膜放置在第一模具和第二模具之间，在模腔中的模制突出部分上，在模制凹部和模制突出部之间形成空腔。将熔融树脂注入到空腔中以形成具有形成为模制凹部的形状的前表面的单透射树脂层和沿着传感器膜形成为成型突出部的形状的背面，从而将传感器膜到透射树脂层的背面。

6. 发明授权

US09266266B2 Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof 有权
标题翻译：具有嵌入天线图案框架的电子设备的情况，其模具及其制造方法
公开(公告)号：US09266266B2
公开(公告)日：2016-02-23
申请号：US13099930
申请日：2011-05-03
申请人： Ha Ryong Hong , Sung Eun Cho , Ki Won Chang , Chang Mok Han , Dae Kyu Lee , Dae Seong Jeon , Chan Gwang An , Jae Suk Sung , Duk Woo Lee
发明人： Ha Ryong Hong , Sung Eun Cho , Ki Won Chang , Chang Mok Han , Dae Kyu Lee , Dae Seong Jeon , Chan Gwang An , Jae Suk Sung , Duk Woo Lee
IPC分类号： H01Q1/24 , B29C45/14 , B29C45/16 , H01Q1/40 , H01Q7/00 , H01Q9/04 , H01Q5/40 , B29C45/00 , B29L31/34
CPC分类号： B29C45/14065 , B29C45/0046 , B29C45/14418 , B29C45/14639 , B29C45/14778 , B29C45/14836 , B29C45/1671 , B29C2045/0049 , B29L2031/3431 , B29L2031/3437 , B29L2031/3456 , B29L2031/3481 , H01Q1/243 , H01Q1/40 , H01Q5/40 , H01Q7/00 , H01Q9/0421
摘要： There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part and formed on a film is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
摘要翻译：提供一种具有嵌入其中的天线图案的电子设备的壳体，所述壳体包括：注射模制的散热器框架，使得在其一个表面上形成包括形成在膜上的天线图案部分的散热器; 在所述散热器框架上向上模塑并且设置有散热器框架和所述壳体框架之间的散热器的壳体框架; 以及形成散热器框架和壳体框架之间的边界并且具有形成在壳体框架内侧的槽的边界部分。

7. 发明申请

US20150364456A1 WAFER-LEVEL MOLDING CHASE DESIGN 有权
标题翻译：水平模具设计
公开(公告)号：US20150364456A1
公开(公告)日：2015-12-17
申请号：US14302697
申请日：2014-06-12
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Chen-Hua Yu , Chung-Shi Liu , Hui-Min Huang , Chih-Fan Huang , Ming-Da Cheng , Meng-Tse Chen , Bor-Ping Jang , Chien Ling Hwang
IPC分类号： H01L25/00 , H01L25/065 , B29C45/14 , H01L21/66 , B29C45/77 , B29C45/20 , H01L21/67 , H01L21/56
CPC分类号： H01L21/67126 , B29C45/0046 , B29C45/02 , B29C45/14655 , B29C45/14836 , B29C45/34 , B29C2045/0049 , B29C2045/14663 , B29L2031/34 , H01L21/561 , H01L21/565 , H01L24/18 , H01L24/96 , H01L24/97 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/18161 , H01L2924/014
摘要： An apparatus includes a mold chase, which includes a top portion and an edge ring having a ring-shape. The edge ring is underlying and connected to an edge of the top portion. The edge ring has an injection port and a venting port. A molding guide kit is configured to be inserted into the injection port. The molding guide kit includes a front sidewall having a curved front edge.
摘要翻译：一种装置包括模具追逐，其包括顶部和具有环形的边缘环。边缘环是底部并连接到顶部的边缘。边缘环有注射口和排气口。成型引导组件配置成插入注射口。成型引导套件包括具有弯曲前边缘的前侧壁。

8. 发明申请

US20150140259A1 RADIO-WAVE TRANSPARENT COVER AND METHOD FOR MANUFACTURING RADIO-WAVE TRANSPARENT COVER 审中-公开
标题翻译：无线电波透明覆盖层和制造无线电波透明覆盖层的方法
公开(公告)号：US20150140259A1
公开(公告)日：2015-05-21
申请号：US14541223
申请日：2014-11-14
申请人： TOYODA GOSEI CO., LTD.
发明人： Tatsuya SUGIURA , Hideto MAEDA , Daiichiro KAWASHIMA
IPC分类号： B29C45/00 , B60R13/00 , B32B3/08 , B32B3/30 , B32B27/08
CPC分类号： B60R13/005 , B29C45/006 , B29C45/14836 , B29C45/1671 , B29C2045/14844 , B29C2045/1673 , B29K2025/08 , B29K2033/08 , B29K2077/00 , B29K2995/0027 , B29L2031/3456 , B32B3/30 , B32B27/08 , B32B27/302 , B32B27/34 , B32B2307/304 , B32B2307/412 , B32B2307/752 , G01S7/03 , G01S2013/9375 , Y10T428/234 , Y10T428/24521 , Y10T428/24529 , Y10T428/31757
摘要： A radio-wave transparent cover is adapted to be arranged on a radio wave path of a radar device. The radio-wave transparent cover includes a transparent member, a decorative layer, a base, and a suppression member. The transparent member is formed of a first resin material. The decorative layer is formed on the rear surface of the transparent member. The base is formed of a second resin material and arranged behind the decorative layer. The suppression member is formed of a third resin material and molded in advance. The suppression member is arranged on the decorative layer to cover the rear surface of the decorative layer. The suppression member suppresses heat transfer to the transparent member when the base is insert-molded.
摘要翻译：无线电波透明盖适于布置在雷达装置的无线电波路径上。无线电波透明盖包括透明构件，装饰层，基座和抑制构件。透明构件由第一树脂材料形成。装饰层形成在透明构件的后表面上。该基部由第二树脂材料形成并且布置在装饰层的后面。抑制构件由第三树脂材料形成并预先模制。抑制构件布置在装饰层上以覆盖装饰层的后表面。当基底被嵌入成型时，抑制构件抑制对透明构件的热传递。

9. 发明授权

US08952404B2 Light-emitting device package and method of manufacturing the light-emitting device package 有权
标题翻译：发光器件封装以及制造发光器件封装的方法
公开(公告)号：US08952404B2
公开(公告)日：2015-02-10
申请号：US13348369
申请日：2012-01-11
申请人： Cheol-jun Yoo , Young-hee Song
发明人： Cheol-jun Yoo , Young-hee Song
IPC分类号： H01L33/44 , H01L33/48 , B29C45/14 , H01L33/54 , H01L33/64
CPC分类号： H01L33/486 , B29C45/14344 , B29C45/14655 , B29C45/14836 , H01L33/54 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/4826 , H01L2224/73215 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.
摘要翻译：具有提高接合线的连接可靠性的发光器件封装，由于后成型而导致的散热特性和光质量以及制造发光器件封装的方法。发光器件封装包括例如具有开口的布线基板; 发光装置，其布置在所述布线基板上并覆盖所述开口; 通过所述开口将所述布线基板的底面与所述发光装置的底面电连接的接合线; 在布线基板的上表面的一部分上形成有围绕发光装置的侧面而不是作为发光面的发光元件的顶面的成型部件，布线基板的开口以覆盖接合线; 以及形成在布线基板的底面上的阻焊剂和凸块。

10. 发明授权

US08796572B2 Vehicle condition detection device and method for manufacturing the same 有权
标题翻译：车辆状况检测装置及其制造方法
公开(公告)号：US08796572B2
公开(公告)日：2014-08-05
申请号：US13259052
申请日：2009-07-14
申请人： Yuji Hiraoka , Tsutomu Kishimoto
发明人： Yuji Hiraoka , Tsutomu Kishimoto
IPC分类号： H01R3/00
CPC分类号： B29C45/14655 , B29C45/14065 , B29C45/14336 , B29C45/14639 , B29C45/14836 , B29C45/1671 , B29L2031/3061 , B29L2031/3481
摘要： A molding process is performed by molds such that a primarily molded body 12 mounted with a detecting element 11 for detecting a vehicle condition is subjected to a secondary molding process, and that a hollow portion 19 within a connector housing portion 15 to be formed by the secondary molding process is penetrated to the face area of the primarily molded body 12 corresponding to the position of the detecting element 11.
摘要翻译：通过模具进行成型工序，使得安装有用于检测车辆状况的检测元件11的主要成型体12进行二次成型处理，并且在由连接器收纳部15内形成的中空部19 二次成型工序相对于检测元件11的位置贯穿到主要成形体12的面部区域。

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