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51. 发明授权

US08264307B2 Dual substrate MEMS plate switch and method of manufacture 有权
标题翻译：双基板MEMS板开关及其制造方法
公开(公告)号：US08264307B2
公开(公告)日：2012-09-11
申请号：US12929259
申请日：2011-01-11
申请人： John S. Foster , Alok Paranjypye , Paul J. Rubel
发明人： John S. Foster , Alok Paranjypye , Paul J. Rubel
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , B81B2201/018 , B81B2207/093 , B81B2207/095 , B81C1/00333 , B81C2203/0118 , B81C2203/035 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/16152 , H01L2924/00014 , H01L2924/00
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. A hermetic seal may be made around the device with a larger, secondary enclosure. Electrical access to the deformable plate may be accomplished by an electrical path which is independent of the seal. The electrical path may include a via through the first substrate or the second substrate, or a flash deposited on an external region of the switch.
摘要翻译：用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。可变形板可以具有位于可变形板的振动模式的节点线处的至少一个分流杆，使得当板在该振动模式下振动时，分流棒保持相对静止。可以在具有较大二次外壳的装置周围制造气密密封。可以通过独立于密封件的电气路径来实现对可变形板的电气接入。电路可以包括通过第一衬底或第二衬底的通孔，或者沉积在开关的外部区域上的闪光。

52. 发明申请

US20120132522A1 Deposition/bonding chamber for encapsulated microdevices and method of use 审中-公开
标题翻译：用于封装微型设备的沉积/粘合室及其使用方法
公开(公告)号：US20120132522A1
公开(公告)日：2012-05-31
申请号：US12007485
申请日：2008-01-11
申请人： John S. Foster , Jeffery F. Summers
发明人： John S. Foster , Jeffery F. Summers
IPC分类号： C23C14/34 , H01L21/56
CPC分类号： B81C1/00285 , H01L21/67069 , H01L21/67092
摘要： A method for depositing a getter for encapsulation in a device cavity containing a microdevice comprises depositing the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma sputtering process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then sputters the getter material from a getter target, and this getter material is directly thereafter sealed within the device cavity of the microdevice, all within the deposition/bonding chamber.
摘要翻译：用于在包含微型器件的器件腔中沉积用于封装的吸气剂的方法包括在将器件晶片和盖晶片封装在接合室中时沉积吸气剂材料。可以使用等离子体溅射工艺，其中通过向盖晶片施加大的负电压，在接合室内的低压环境中形成等离子体。然后等离子体从吸气剂靶中吸出吸气剂材料，然后将该吸气剂材料直接密封在微型装置的装置腔内，全部在沉积/粘合室内。

53. 发明授权

US08088651B1 System and method for providing access to an encapsulated device 有权
标题翻译：用于提供对封装设备的访问的系统和方法
公开(公告)号：US08088651B1
公开(公告)日：2012-01-03
申请号：US12232298
申请日：2008-09-15
申请人： Douglas L. Thompson , Gregory A. Carlson , David M. Erlach
发明人： Douglas L. Thompson , Gregory A. Carlson , David M. Erlach
IPC分类号： H01L21/00 , H01L21/30 , H01L21/46
CPC分类号： B81C99/004
摘要： A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially above the feature, and removing material substantially uniformly from the bottom surface of the lid wafer, until an aperture is formed at the cavity, over the feature on the device wafer. By removing material from the lid wafer in a substantially uniform manner, difficulties with the prior art procedure of saw cutting, such as alignment and debris generation, are avoided.
摘要翻译：描述了一种用于提供对设备晶片上的特征的访问并位于封装区域外部的方法。该方法包括在盖晶片中形成空腔，将盖晶片与器件晶片对准，使得空腔基本上位于特征上方，并且从盖晶片的底表面基本上均匀地移除材料，直到孔形成在在器件晶圆上的特征之上。通过以大致均匀的方式从盖晶片去除材料，避免了现有技术的锯切过程（例如对准和碎屑产生）的困难。

54. 发明授权

US07893798B2 Dual substrate MEMS plate switch and method of manufacture 有权
标题翻译：双基板MEMS板开关及其制造方法
公开(公告)号：US07893798B2
公开(公告)日：2011-02-22
申请号：US11797924
申请日：2007-05-09
申请人： John S. Foster , Kimberly L. Turner
发明人： John S. Foster , Kimberly L. Turner
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , B81B2201/018 , B81C1/00333 , Y10T29/49105 , Y10T29/5317
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.
摘要翻译：用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。可变形板可以具有位于可变形板的振动模式的节点线处的至少一个分流杆，使得当板在该振动模式下振动时，分流棒保持相对静止。气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

55. 发明授权

US07872432B2 MEMS thermal device with slideably engaged tether and method of manufacture 有权
标题翻译：具有可滑动接合系绳的MEMS热敏装置及其制造方法
公开(公告)号：US07872432B2
公开(公告)日：2011-01-18
申请号：US11378340
申请日：2006-03-20
申请人： Alok Paranjpye , Jeffery F. Summers
发明人： Alok Paranjpye , Jeffery F. Summers
IPC分类号： H02N11/00
CPC分类号： B81B3/0024 , B81B2201/018 , B81B2201/0278 , H01H2037/008 , H01H2061/008 , Y10T29/49105 , Y10T29/49147 , Y10T29/49204 , Y10T29/53248
摘要： A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam and the cool, flexor beam together, whereas the slideably engaged tether allows the hot, expanding beam to elongate with respect to the cool, flexor beam, without loading the slideably engaged tether with a large shear force. As a result, the material of the tether can be made stiffer, and therefore transmit the bending force of the hot, expanding beam more efficiently to the cool, flexor beam.
摘要翻译：公开了一种MEMS热开关，其使用可滑动接合的系绳将热膨胀梁耦合到冷弯头梁，并且通过热束的膨胀来弯曲冷弯曲梁。刚性接合的系绳将热的，扩张的梁和冷的弯曲梁的远端连接在一起，而可滑动地接合的系绳允许热的，膨胀的梁相对于冷的屈肌梁而伸长，而不加载可滑动地接合的系绳具有很大的剪切力。结果，系链的材料可以变得更硬，并且因此将热膨胀梁的弯曲力更有效地传递到凉爽的弯曲梁。

56. 发明授权

US07864006B2 MEMS plate switch and method of manufacture 有权
标题翻译： MEMS板式开关及其制造方法
公开(公告)号：US07864006B2
公开(公告)日：2011-01-04
申请号：US12068586
申请日：2008-02-08
申请人： John S. Foster , Paulo Silveira da Motta , Alok Paranjpye , Kimon Rybnicek
发明人： John S. Foster , Paulo Silveira da Motta , Alok Paranjpye , Kimon Rybnicek
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , H01H1/18
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.
摘要翻译：用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。可变形板可以具有柔性分流杆，其具有联接到可变形板的一端，而另一端联接到第二基板上的接触件。在启动开关时，可变形板将分流杆推动抵靠形成在第二基板中的第二触点，由此闭合开关。气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

57. 发明授权

US07675162B2 Interconnect structure using through wafer vias and method of fabrication 有权
标题翻译：通过晶片通孔和制造方法的互连结构
公开(公告)号：US07675162B2
公开(公告)日：2010-03-09
申请号：US11541774
申请日：2006-10-03
申请人： John S. Foster , Steven H. Hovey , Paul J. Rubel , Kimon Rybnicek
发明人： John S. Foster , Steven H. Hovey , Paul J. Rubel , Kimon Rybnicek
IPC分类号： H01L23/10
CPC分类号： B81B7/007 , B81B2201/014 , B81B2207/092
摘要： A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.
摘要翻译：描述了一种在空腔内气密地密封至少一个微结构的装置和方法。通过通过在其前侧支撑至少一个微结构的通孔基板形成的通过晶片通孔提供对至少一个微结构的电接触。通孔基板和盖子晶片可以形成封闭至少一个微结构的密封腔。贯通晶片通孔通过形成在通孔基板的背面上的互连结构连接到位于空腔外部的接合焊盘。因为它们在空腔外部，所以接合焊盘可以放置在形成空腔的接合线的周边内部，从而大大减小了器件所占据的面积。贯通晶片通孔也缩短了微结构与互连之间的电路长度，从而改善了器件中的传热和信号损失。

58. 发明授权

US07622783B2 MEMS thermal actuator and method of manufacture 有权
标题翻译： MEMS热致动器及其制造方法
公开(公告)号：US07622783B2
公开(公告)日：2009-11-24
申请号：US11705739
申请日：2007-02-14
申请人： Gregory A. Carlson , John S. Foster , Christopher S. Gudeman , Paul J. Rubel
发明人： Gregory A. Carlson , John S. Foster , Christopher S. Gudeman , Paul J. Rubel
IPC分类号： H01L29/82
CPC分类号： H01H1/0036 , H01H61/04 , H01H2001/0047 , H01H2001/0078 , H01H2061/006 , H01H2061/008
摘要： A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.
摘要翻译：公开了一种分离的MEMS热致动器，其对热致动器的悬臂梁中的蠕变基本上不敏感。在分离的MEMS热致动器中，嵌入的悬臂式驱动梁形成在同一平面上，但与被动梁分开，间隙小。由于嵌入的悬臂驱动梁和被动梁不直接耦合，镶嵌悬臂驱动梁的静止位置的任何变化可能不会传递到被动梁，如果变化的幅度小于间隙的大小。

59. 发明授权

US07548145B2 Hysteretic MEMS thermal device and method of manufacture 有权
标题翻译：迟滞MEMS热装置及其制造方法
公开(公告)号：US07548145B2
公开(公告)日：2009-06-16
申请号：US11334438
申请日：2006-01-19
申请人： Paul J. Rubel
发明人： Paul J. Rubel
IPC分类号： H01H51/22
CPC分类号： H02N10/00 , F03G7/06 , H01H61/02 , H01H61/04 , H01H2001/0047 , H01H2001/0068 , H01H2061/006 , H01H2061/008 , Y10T29/42 , Y10T29/49155 , Y10T29/49204
摘要： A MEMS hysteretic thermal device may have a cantilevered beam which bends about one or more points in at least two substantially different directions. In one exemplary embodiment, the MEMS hysteretic thermal device is made from a first segment coupled to an anchor point, and also coupled to a second segment by a joint. Heating two respective drive beams causes the first segment to bend in a direction substantially about the anchor point and the second segment to bend in a direction substantially about the joint. By cooling the first drive beam faster than the second drive beam, the motion of the MEMS thermal device may be hysteretic. The MEMS hysteretic thermal device may be used for example, as an electrical switch or as a valve or piston.
摘要翻译： MEMS迟滞热装置可以具有悬臂梁，其在至少两个基本上不同的方向上围绕一个或多个点弯曲。在一个示例性实施例中，MEMS滞后热装置由耦合到锚定点的第一段制成，并且还通过接头耦合到第二段。加热两个相应的驱动梁使得第一段在基本上围绕锚点的方向上弯曲，而第二段在基本上围绕接头的方向上弯曲。通过比第二驱动光束更快地冷却第一驱动光束，MEMS热装置的运动可能是滞后的。 MEMS迟滞热装置可以例如用作电开关或阀或活塞。

60. 发明授权

US07528691B2 Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture 有权
标题翻译：具有气密密封和制造方法的双基板静电MEMS开关
公开(公告)号：US07528691B2
公开(公告)日：2009-05-05
申请号：US11211623
申请日：2005-08-26
申请人： Andrew D. Wallis , John S. Foster , Paul J. Rubel , Kimon Rybnicek , Michael J. Shillinger , Jeffrey F. Summers
发明人： Andrew D. Wallis , John S. Foster , Paul J. Rubel , Kimon Rybnicek , Michael J. Shillinger , Jeffrey F. Summers
IPC分类号： H01H51/22
CPC分类号： H01H59/0009
摘要： Systems and methods for forming an electrostatic MEMS switch include forming a cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.
摘要翻译：用于形成静电MEMS开关的系统和方法包括在第一基板上形成悬臂梁，在第二基板上形成电触头，并且使用气密密封来连接两个基板。气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

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