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1. 发明授权

US07864006B2 MEMS plate switch and method of manufacture 有权
标题翻译： MEMS板式开关及其制造方法
公开(公告)号：US07864006B2
公开(公告)日：2011-01-04
申请号：US12068586
申请日：2008-02-08
申请人： John S. Foster , Paulo Silveira da Motta , Alok Paranjpye , Kimon Rybnicek
发明人： John S. Foster , Paulo Silveira da Motta , Alok Paranjpye , Kimon Rybnicek
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , H01H1/18
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.
摘要翻译：用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。可变形板可以具有柔性分流杆，其具有联接到可变形板的一端，而另一端联接到第二基板上的接触件。在启动开关时，可变形板将分流杆推动抵靠形成在第二基板中的第二触点，由此闭合开关。气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

2. 发明授权

US07785913B2 System and method for forming moveable features on a composite substrate 有权
标题翻译：用于在复合基底上形成可移动特征的系统和方法
公开(公告)号：US07785913B2
公开(公告)日：2010-08-31
申请号：US11359558
申请日：2006-02-23
申请人： John S. Foster , Paul J. Rubel , Kimon Rybnicek , Paulo Silveira da Motta
发明人： John S. Foster , Paul J. Rubel , Kimon Rybnicek , Paulo Silveira da Motta
IPC分类号： H01L21/00
CPC分类号： B81C1/00936 , B81C2201/0132
摘要： A method for forming moveable features suspended over a substrate is described, wherein a cavity beneath the moveable feature is first formed using a liquid etchant applied through one or more release holes. After formation of the cavity, the outline of the moveable feature is formed using a dry etch process. Since the moveable feature is free to move upon its formation using the dry etch process, no stiction issues arise using the systems and methods described here.
摘要翻译：描述了一种用于形成悬挂在衬底上的可移动特征的方法，其中首先使用通过一个或多个释放孔施加的液体蚀刻剂形成可移动特征之下的空腔。在形成空腔之后，使用干蚀刻工艺形成可移动特征的轮廓。由于可移动特征在使用干蚀刻工艺形成时可以自由移动，所以不使用本文所述的系统和方法产生静电问题。

3. 发明申请

US20080006850A1 System and method for forming through wafer vias using reverse pulse plating 审中-公开
标题翻译：使用反向脉冲电镀形成通过晶片通孔的系统和方法
公开(公告)号：US20080006850A1
公开(公告)日：2008-01-10
申请号：US11482944
申请日：2006-07-10
申请人： Kimon Ribnicek , Gregory A. Carlson , Paulo Silveira da Motta , Jian Zhao
发明人： Kimon Ribnicek , Gregory A. Carlson , Paulo Silveira da Motta , Jian Zhao
IPC分类号： H01L29/76 , H01L21/20
CPC分类号： H01L21/76898 , B81B2203/0353 , B81C1/00087 , B81C2201/0181
摘要： A method for forming through wafer vias in a substrate uses a Cr/Au seed layer to plate the bottom of a blind trench formed in the front side of a substrate. Thereafter, a reverse plating process uses a forward current to plate the bottom and sides of the blind hole, and a reverse current to de-plate material in or near the top. Using the reverse pulse plating technique, the plating proceeds generally from the bottom of the blind hole to the top. To form the through wafer via, the back side of the substrate is ground or etched away to remove material up to and including the dead-end wall of the blind hole.
摘要翻译：用于在衬底中形成晶片通孔的方法使用Cr / Au种子层来平坦化形成在衬底前侧的盲沟的底部。此后，反向电镀工艺使用正向电流来平板盲孔的底部和侧面，以及在顶部中或附近的去镀材料的反向电流。使用反向脉冲电镀技术，电镀通常从盲孔的底部到顶部。为了形成贯通晶片通孔，将衬底的背面研磨或蚀刻掉以去除直到并包括盲孔的死端壁的材料。

4. 发明申请

US20080277258A1 MEMS plate switch and method of manufacture 有权
标题翻译： MEMS板式开关及其制造方法
公开(公告)号：US20080277258A1
公开(公告)日：2008-11-13
申请号：US12068586
申请日：2008-02-08
申请人： John S. Foster , Alok Paranjpye , Kimon Rybnicek , Paulo Silveira da Motta
发明人： John S. Foster , Alok Paranjpye , Kimon Rybnicek , Paulo Silveira da Motta
IPC分类号： H01H1/10
CPC分类号： H01H59/0009 , H01H1/18
摘要： Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.
摘要翻译：用于形成静电MEMS板开关的系统和方法包括在第一衬底上形成可变形板，在第二衬底上形成电触点，并使用气密密封来连接两个衬底。可变形板可以具有柔性分流杆，其具有联接到可变形板的一端，而另一端联接到第二基板上的接触件。在启动开关时，可变形板将分流杆推动抵靠形成在第二基板中的第二触点，由此闭合开关。气密密封可以是金/铟合金，通过加热镀在一层金上的铟层而形成。可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。

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