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1. 发明授权

US08343791B2 Plating process and apparatus for through wafer features 有权
标题翻译：用于通过晶片特征的电镀工艺和设备
公开(公告)号：US08343791B2
公开(公告)日：2013-01-01
申请号：US12923693
申请日：2010-10-05
申请人： John S. Foster , John C. Harley , Jeffery F. Summers
发明人： John S. Foster , John C. Harley , Jeffery F. Summers
IPC分类号： H01L21/00
CPC分类号： H01L21/76898 , B32B37/02 , B32B2457/14 , B81B7/0006 , B81B2207/092 , B81B2207/095
摘要： A method for forming through features in a substrate uses a seed layer deposited over a first substrate, and a second substrate bonded to the seed layer. The features may be formed in the first substrate, by plating a conductive filler material onto the seed layer. The first substrate and the second substrate may then be bonded to a third substrate, and the second substrate is removed, leaving through features and first substrate adhered to the third substrate. The through features may provide at least one of electrical access and motion to a plurality of devices formed on the third substrate, or may impart movement to a moveable feature on the first substrate, wherein the third substrate supports the first substrate after removal of the second substrate.
摘要翻译：用于在衬底中形成穿透特征的方法使用沉积在第一衬底上的种子层和与种子层结合的第二衬底。特征可以在第一基板中形成，通过将导电填料材料镀在种子层上。然后可以将第一衬底和第二衬底接合到第三衬底，并且去除第二衬底，留下通过特征和粘附到第三衬底的第一衬底。穿透特征可以向形成在第三基底上的多个装置提供电通路和运动中的至少一个，或者可以将运动赋予第一基板上的可移动特征，其中第三基板在移除第二基板之后支撑第一基板基质。

2. 发明申请

US20110250092A1 Inlaid optical material and method of manufacture 有权
标题翻译：镶嵌光学材料及其制造方法
公开(公告)号：US20110250092A1
公开(公告)日：2011-10-13
申请号：US12662237
申请日：2010-04-07
申请人： John S. Foster , John C. Harley , Ian R. Johnston , Jeffery F. Summers
发明人： John S. Foster , John C. Harley , Ian R. Johnston , Jeffery F. Summers
IPC分类号： G01N21/00 , G01N33/00 , C23F1/00
CPC分类号： G01N21/645 , G01N15/1459 , G01N15/1484 , G01N21/6428 , G01N2015/149
摘要： An optical material is inlaid into a supporting substrate, with the top surface of the optical material flush with the top surface of the substrate, wherein the optical element is used to shape a beam of light travelling substantially parallel to the top surface of the substrate, but with the central axis of the beam below the top surface of the substrate. The optical elements serve to shape the beam of light for delivery to or from a microfabricated structure within the device.
摘要翻译：将光学材料嵌入支撑基板中，其中光学材料的顶表面与基板的顶表面齐平，其中光学元件用于成形基本上平行于基板的顶表面行进的光束，但是梁的中心轴线在基板的顶表面下方。光学元件用于成形光束，用于传送到或从设备内的微加工结构传输。

3. 发明申请

US20120132522A1 Deposition/bonding chamber for encapsulated microdevices and method of use 审中-公开
标题翻译：用于封装微型设备的沉积/粘合室及其使用方法
公开(公告)号：US20120132522A1
公开(公告)日：2012-05-31
申请号：US12007485
申请日：2008-01-11
申请人： John S. Foster , Jeffery F. Summers
发明人： John S. Foster , Jeffery F. Summers
IPC分类号： C23C14/34 , H01L21/56
CPC分类号： B81C1/00285 , H01L21/67069 , H01L21/67092
摘要： A method for depositing a getter for encapsulation in a device cavity containing a microdevice comprises depositing the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma sputtering process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then sputters the getter material from a getter target, and this getter material is directly thereafter sealed within the device cavity of the microdevice, all within the deposition/bonding chamber.
摘要翻译：用于在包含微型器件的器件腔中沉积用于封装的吸气剂的方法包括在将器件晶片和盖晶片封装在接合室中时沉积吸气剂材料。可以使用等离子体溅射工艺，其中通过向盖晶片施加大的负电压，在接合室内的低压环境中形成等离子体。然后等离子体从吸气剂靶中吸出吸气剂材料，然后将该吸气剂材料直接密封在微型装置的装置腔内，全部在沉积/粘合室内。

4. 发明申请

US20080169521A1 MEMS structure using carbon dioxide and method of fabrication 审中-公开
标题翻译：使用二氧化碳的MEMS结构和制造方法
公开(公告)号：US20080169521A1
公开(公告)日：2008-07-17
申请号：US11652631
申请日：2007-01-12
申请人： John S. Foster , Alok Paranjpye , Jeffery F. Summers , Douglas L. Thompson
发明人： John S. Foster , Alok Paranjpye , Jeffery F. Summers , Douglas L. Thompson
IPC分类号： H01L29/84 , H01L21/56 , H01L21/67
CPC分类号： B81B7/0064 , B81B7/0041 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/00
摘要： A MEMS device is encapsulated in a carbon dioxide environment, which effectively insulates the MEMS device against arcing in high voltage applications. The carbon dioxide environment may have a pressure of between about 0.2 atm and about 4 atm. Carbon dioxide is shown to be more effective than other insulating gases such as sulfur hexafluoride in preventing arcing for applications having dimensions on the order of microns.
摘要翻译： MEMS器件被封装在二氧化碳环境中，这有效地使MEMS器件绝缘在高电压应用中防止电弧。二氧化碳环境可具有介于约0.2atm至约4atm之间的压力。显示出二氧化碳比其他绝缘气体如六氟化硫更有效地防止了具有微米数量级的应用的电弧。

5. 发明授权

US07141080B2 Method and apparatus for assembling an array of micro-devices 有权
公开(公告)号：US07141080B2
公开(公告)日：2006-11-28
申请号：US11272689
申请日：2005-11-15
申请人： Patrick E. Feierabend , John S. Foster , Richard T. Martin , Paul J. Rubel , John W. Stocker , Jeffery F. Summers , Andrew D. Wallis
发明人： Patrick E. Feierabend , John S. Foster , Richard T. Martin , Paul J. Rubel , John W. Stocker , Jeffery F. Summers , Andrew D. Wallis
IPC分类号： H01L21/00
CPC分类号： B81C3/008 , G02B6/3512 , G02B6/3518 , G02B6/353 , G02B6/3546 , G02B6/3572 , G02B6/3578 , G02B6/3584 , G02B6/3586 , Y10T29/41
摘要： The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N×M fiber optic switches, which direct light from N input fibers into M output fibers.

6. 发明授权

US06801681B2 Optical switch with low-inertia micromirror 失效
标题翻译：具有低惯量微镜的光开关
公开(公告)号：US06801681B2
公开(公告)日：2004-10-05
申请号：US09765520
申请日：2001-01-17
申请人： Patrick E. Feierabend , John S. Foster , Bryant P. Hichwa , Richard T. Martin , Paul J. Rubel , Kimon Rybnicek , John W. Stocker , Jeffery F. Summers
发明人： Patrick E. Feierabend , John S. Foster , Bryant P. Hichwa , Richard T. Martin , Paul J. Rubel , Kimon Rybnicek , John W. Stocker , Jeffery F. Summers
IPC分类号： G02B626
CPC分类号： G02B6/3564 , G02B6/3518 , G02B6/357 , G02B6/3584 , G02B6/4226 , G02B26/0841 , G02B26/085 , G02B2006/12104
摘要： An optical switch is fabricated using micro-electro-mechanical system (“MEMS”) techniques. A thin mirror is fabricated in the major plane of the substrate and rotates about an axis perpendicular to the major plane to move into and out of an optical beam path. The mirror surface is open for chemical polishing and deposition, resulting in a high-quality mirror. In one embodiment, the backside of the mirror is patterned with reinforcing ribs. In another embodiment, a two-sided mirror is fabricated.
摘要翻译：使用微机电系统（“MEMS”）技术制造光开关。在基板的主平面上制造薄的反射镜，并且围绕垂直于主平面的轴旋转以进入和离开光束路径。镜面打开以进行化学抛光和沉积，产生高品质的镜子。在一个实施例中，镜子的背面被加强肋图案化。在另一个实施例中，制造双面镜。

7. 发明授权

US06785038B2 Optical cross-connect with magnetic micro-electro-mechanical actuator cells 失效
标题翻译：光磁交叉连接磁微机电致动器单元
公开(公告)号：US06785038B2
公开(公告)日：2004-08-31
申请号：US09765522
申请日：2001-01-17
申请人： Bryant P. Hichwa , John S. Foster , Richard T. Martin , Paul J. Rubel , John W. Stocker , Jeffery F. Summers
发明人： Bryant P. Hichwa , John S. Foster , Richard T. Martin , Paul J. Rubel , John W. Stocker , Jeffery F. Summers
IPC分类号： G02B2600
CPC分类号： G02B6/3564 , G02B6/3518 , G02B6/357 , G02B6/3584 , G02B6/4226 , G02B2006/12104
摘要： An optical cross-connect is fabricated on a substrate using individual MEMs dice with mirrors that rotate into and out of an optical beam path. Each die can be aligned to a single (input-output) pair of collimators in a fiber-optic switching system. An individually accessible magnetic drive on each die provides low power consumption when re-configuring the array in addition to fast switching speeds. The state of each die can be electronically sensed to verify proper array configuration and operation of each die.
摘要翻译：光学交叉连接使用具有旋转进入和离开光束路径的反射镜的各个MEM骰子在基板上制造。每个管芯可以与光纤交换系统中的单个（输入 - 输出）准直器对准。除了快速切换速度之外，每个模具上可单独访问的磁驱动器重新配置阵列时提供低功耗。可以电子地感测每个管芯的状态，以验证每个管芯的阵列配置和操作。

8. 发明授权

US08541735B2 Inlaid optical material and method of manufacture 有权
标题翻译：镶嵌光学材料及其制造方法
公开(公告)号：US08541735B2
公开(公告)日：2013-09-24
申请号：US12662237
申请日：2010-04-07
申请人： John S. Foster , John C. Harley , Ian R. Johnston , Jeffery F. Summers
发明人： John S. Foster , John C. Harley , Ian R. Johnston , Jeffery F. Summers
IPC分类号： H01L21/00 , B29D11/00 , H01J3/14 , G01N21/00 , G01N15/06
CPC分类号： G01N21/645 , G01N15/1459 , G01N15/1484 , G01N21/6428 , G01N2015/149
摘要： An optical material is inlaid into a supporting substrate, with the top surface of the optical material flush with the top surface of the substrate, wherein the optical element is used to shape a beam of light travelling substantially parallel to the top surface of the substrate, but with the central axis of the beam below the top surface of the substrate. The optical elements serve to shape the beam of light for delivery to or from a microfabricated structure within the device.
摘要翻译：将光学材料嵌入支撑基板中，其中光学材料的顶表面与基板的顶表面齐平，其中光学元件用于成形基本上平行于基板的顶表面行进的光束，但是梁的中心轴线在基板的顶表面下方。光学元件用于成形光束，用于传送到或从设备内的微加工结构传输。

9. 发明申请

US20120080762A1 Plating process and apparatus for through wafer features 有权
标题翻译：用于通过晶片特征的电镀工艺和设备
公开(公告)号：US20120080762A1
公开(公告)日：2012-04-05
申请号：US12923693
申请日：2010-10-05
申请人： John S. Foster , John C. Harley , Jeffery F. Summers
发明人： John S. Foster , John C. Harley , Jeffery F. Summers
IPC分类号： H01L29/84 , B32B37/00 , H01L21/18
CPC分类号： H01L21/76898 , B32B37/02 , B32B2457/14 , B81B7/0006 , B81B2207/092 , B81B2207/095
摘要： A method for forming through features in a substrate uses a seed layer deposited over a first substrate, and a second substrate bonded to the seed layer. The features may be formed in the first substrate, by plating a conductive filler material onto the seed layer. The first substrate and the second substrate may then be bonded to a third substrate, and the second substrate is removed, leaving through features and first substrate adhered to the third substrate. The through features may provide at least one of electrical access and motion to a plurality of devices formed on the third substrate, or may impart movement to a moveable feature on the first substrate, wherein the third substrate supports the first substrate after removal of the second substrate.
摘要翻译：用于在衬底中形成穿透特征的方法使用沉积在第一衬底上的种子层和与种子层结合的第二衬底。特征可以在第一基板中形成，通过将导电填料材料镀在种子层上。然后可以将第一衬底和第二衬底接合到第三衬底，并且去除第二衬底，留下通过特征和粘附到第三衬底的第一衬底。穿透特征可以向形成在第三基底上的多个装置提供电通路和运动中的至少一个，或者可以将运动赋予第一基板上的可移动特征，其中第三基板在移除第二基板之后支撑第一基板基质。

10. 发明申请

US20080250785A1 Micromechanical device with gold alloy contacts and method of manufacture 审中-公开
标题翻译：具有金合金触点的微机械装置及其制造方法
公开(公告)号：US20080250785A1
公开(公告)日：2008-10-16
申请号：US11785119
申请日：2007-04-16
申请人： Gregory A. Carlson , Patrick E. Feierabend , John S. Foster , Daryl W. Grummit , Alok Paranjpye , Paul J. Rubel , Jeffery F. Summers , Douglas L. Thompson
发明人： Gregory A. Carlson , Patrick E. Feierabend , John S. Foster , Daryl W. Grummit , Alok Paranjpye , Paul J. Rubel , Jeffery F. Summers , Douglas L. Thompson
IPC分类号： F01B29/10
CPC分类号： H01H1/0036 , H01H1/023 , H01H1/04 , H01H2001/0052 , H01H2001/0078 , H01H2061/006 , H01H2061/008
摘要： A MEMS switch device is made using a gold alloy as the switch contact material. The increased mechanical hardness of the alloy compared to the pure gold prevents the contacts of the switch from welding together. A scrubbing action which occurs when the switch closes may allow the contact surfaces to come to rest where their surfaces are complementary, thus resulting in higher contact area and low contact resistance, despite the higher sheet resistance of the gold alloy material relative to the pure gold material.
摘要翻译：使用金合金作为开关触点材料制造MEMS开关装置。与纯金相比，合金的增加的机械硬度防止开关的接触焊接在一起。当开关闭合时发生的擦洗动作可允许接触表面在其表面互补的情况下停止，因此导致更高的接触面积和低的接触电阻，尽管金合金材料相对于纯金的较高的薄层电阻材料。

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