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1. 发明申请

US20180249242A1 TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE PACKAGE 审中-公开
公开(公告)号：US20180249242A1
公开(公告)日：2018-08-30
申请号：US15968676
申请日：2018-05-01
申请人： Knowles Electronics, LLC
发明人： Anthony D. MINERVINI
IPC分类号： H04R1/28 , B81B7/00 , H04R19/00 , H04R19/01 , H04R19/04 , H04R31/00 , B81C1/00 , H01L23/10 , H01L23/15 , H04R1/04 , H04R3/00 , B81C3/00 , B81B3/00 , H01L21/78 , H04R1/22 , H04R23/00
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

2. 发明授权

US09986354B2 Pre-mold for a microphone assembly and method of producing the same 有权
公开(公告)号：US09986354B2
公开(公告)日：2018-05-29
申请号：US13927865
申请日：2013-06-26
申请人： Infineon Technologies AG
发明人： Thomas Mueller , Horst Theuss , Stefan Uwe Schindler , Dominik Kohl , Jochen Dangelmaier
IPC分类号： H01L29/84 , H01L21/78 , H04R25/00 , B81C1/00 , H01L23/495 , H04R31/00 , H04R19/00 , H04R19/04 , H04R1/08
CPC分类号： H04R31/00 , B81B2201/0257 , B81B2207/092 , B81B2207/096 , B81C1/0023 , B81C1/00301 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/10158 , H01L2924/16195 , H04R1/086 , H04R19/005 , H04R19/04 , Y10T29/49121 , H01L2924/00014
摘要： A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

3. 发明授权

US09911563B2 MEMS switch device and method of fabrication 有权
公开(公告)号：US09911563B2
公开(公告)日：2018-03-06
申请号：US13955866
申请日：2013-07-31
申请人： ANALOG DEVICES GLOBAL
发明人： John G Macnamara , Padraig L. Fitzgerald , Raymond C Goggin , Bernard P Stenson
IPC分类号： H01H59/00 , B81C1/00 , B81B7/00 , H01H1/00
CPC分类号： H01H59/0009 , B81B7/007 , B81B2201/014 , B81B2207/092 , B81C1/00341 , H01H2001/0052 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49109 , H01L2924/181 , Y10T307/937 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A MEMS switch device including: a substrate layer; an insulating layer formed over the substrate layer; and a MEMS switch module having a plurality of contacts formed on the surface of the insulating layer, wherein the insulating layer includes a number of conductive pathways formed within the insulating layer, the conductive pathways being configured to interconnect selected contacts of the MEMS switch module.

4. 发明申请

US20170297902A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20170297902A1
公开(公告)日：2017-10-19
申请号：US15130077
申请日：2016-04-15
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
发明人： HUNG-HUA LIN , PING-YIN LIU , KUAN-LIANG LIU , CHIA-SHIUNG TSAI , ALEXANDER KALNITSKY
IPC分类号： B81B3/00 , B81C3/00
CPC分类号： B81C1/00269 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81B2207/092 , B81C2203/0118 , B81C2203/036 , B81C2203/0792
摘要： A semiconductor structure includes a first substrate including a cavity extended into the first substrate, a device disposed within the cavity, a first dielectric layer disposed over the first substrate and a first conductive structure surrounded by the first dielectric layer, and a second substrate including a second dielectric layer disposed over the second substrate and a second conductive structure surrounded by the second dielectric layer, wherein the first conductive structure is bonded with the second conductive structure and the first dielectric layer is bonded with the second dielectric layer to seal the cavity.

5. 发明授权

US09586811B2 Semiconductor devices with moving members and methods for making the same 有权
标题翻译：具有移动构件的半导体器件及其制造方法
公开(公告)号：US09586811B2
公开(公告)日：2017-03-07
申请号：US13157994
申请日：2011-06-10
申请人： Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin
发明人： Chia-Hua Chu , Kuei-Sung Chang , Chung-Hsien Lin
IPC分类号： H01L23/48 , B81B3/00 , B81B7/00 , B81C1/00
CPC分类号： B81B3/0005 , B81B3/001 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81B2207/092 , B81B2207/095 , B81B2207/096 , B81C1/00269 , B81C1/00579 , B81C2201/0111 , B81C2201/014 , B81C2201/0176 , B81C2203/0118 , B81C2203/019
摘要： The present disclosure provides an embodiment of a micro-electro-mechanical system (MEMS) structure, the MEMS structure comprising a MEMS substrate; a first and second conductive plugs of a semiconductor material disposed on the MEMS substrate, wherein the first conductive plug is configured for electrical interconnection and the second conductive plug is configured as an anti-stiction bump; a MEMS device configured on the MEMS substrate and electrically coupled with the first conductive plug; and a cap substrate bonded to the MEMS substrate such that the MEMS device is enclosed therebetween.
摘要翻译：本公开提供了微机电系统（MEMS）结构的实施例，所述MEMS结构包括MEMS基板; 设置在所述MEMS衬底上的半导体材料的第一和第二导电插塞，其中所述第一导电插头被配置用于电互连，所述第二导电插头被配置为抗静电凸块; 配置在所述MEMS基板上并与所述第一导电插塞电耦合的MEMS器件; 以及盖子衬底，其结合到MEMS衬底上，使得MEMS器件封装在其间。

6. 发明申请

US20160075550A1 MEMS ELEMENT AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译： MEMS元件及其制造方法
公开(公告)号：US20160075550A1
公开(公告)日：2016-03-17
申请号：US14643790
申请日：2015-03-10
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Naofumi NAKAMURA , Yumi HAYASHI
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/007 , B81B2203/04 , B81B2207/092 , B81C2203/0136 , B81C2203/0145
摘要： According to one embodiment, a MEMS element is disclosed. The element includes a substrate, a first electrode provided on the substrate, a second electrode disposed above the first electrode, a film including a connection hole defined by an inner wall communicating with the second electrode, the film and the substrate constituting a cavity in which the first electrode and the second electrode are contained. The element further includes an interconnect connected to the second electrode. The interconnect includes a portion arranged in the connection hole.
摘要翻译：根据一个实施例，公开了一种MEMS元件。元件包括衬底，设置在衬底上的第一电极，设置在第一电极上方的第二电极，包括由与第二电极连通的内壁限定的连接孔的膜，膜和构成空腔的衬底，包含第一电极和第二电极。元件还包括连接到第二电极的互连。互连包括布置在连接孔中的部分。

7. 发明申请

US20160052782A1 ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：电子器件封装及其制造方法
公开(公告)号：US20160052782A1
公开(公告)日：2016-02-25
申请号：US14932814
申请日：2015-11-04
申请人： XINTEC INC.
发明人： Chien-Hung LIU
IPC分类号： B81C1/00
CPC分类号： B81C1/00325 , B81B2207/092 , B81B2207/097 , B81C1/00301 , B81C2201/0115 , B81C2203/0118 , H01L21/6835 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/93 , H01L2221/68304 , H01L2221/68331 , H01L2221/6834 , H01L2221/68372 , H01L2221/68377 , H01L2221/68386 , H01L2224/02313 , H01L2224/02371 , H01L2224/0239 , H01L2224/0401 , H01L2224/05548 , H01L2224/11009 , H01L2224/11019 , H01L2224/1132 , H01L2224/11462 , H01L2224/11849 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/29007 , H01L2224/29011 , H01L2224/2919 , H01L2224/32225 , H01L2224/83191 , H01L2224/8385 , H01L2224/93 , H01L2924/0001 , H01L2924/01013 , H01L2924/01021 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01075 , H01L2924/014 , H01L2924/10156 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/15151 , H01L2924/15788 , H01L2224/0231 , H01L2224/11 , H01L2224/13099 , H01L2924/00
摘要： The invention provides an electronic device package and fabrication method thereof. The electronic device package includes a sensor chip. An upper surface of the sensor chip comprises a sensing film. A covering plate having an opening structure covers the upper surface of the sensor chip. A cavity is between the covering plate and the sensor chip, corresponding to a position of the sensing film, where the cavity communicates with the opening structure. A spacer is between the covering plate and the sensor chip, surrounding the cavity. A pressure releasing region is between the spacer and the sensing film.
摘要翻译：本发明提供一种电子器件封装及其制造方法。电子装置封装包括传感器芯片。传感器芯片的上表面包括感测膜。具有开口结构的覆盖板覆盖传感器芯片的上表面。覆盖板和传感器芯片之间的腔体对应于感测膜的位置，其中空腔与开口结构连通。间隔件位于覆盖板和传感器芯片之间，围绕腔体。压力释放区域位于间隔件和感测膜之间。

8. 发明申请

US20160016789A1 THIN FILM STRUCTURE FOR HERMETIC SEALING 有权
标题翻译：薄膜薄膜结构密封
公开(公告)号：US20160016789A1
公开(公告)日：2016-01-21
申请号：US14332461
申请日：2014-07-16
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Shao-Chi Yu , Hsiang-Fu Chen , Hsin-Ting Huang , Chia-Ming Hung , Wen-Chuan Tai
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81C1/00293 , B81B2207/092 , B81B2207/095 , B81B2207/096 , B81C2203/0109 , B81C2203/0136
摘要： The present disclosure relates to a MEMS device with a hermetic sealing structure, and an associated method. In some embodiments, a first die and a second die are bonded at a bond interface region to form a chamber. A conformal thin film structure is disposed covering an outer sidewall of the bond interface region to provide hermetic sealing. In some embodiments, the conformal thin film structure is a continuous thin layer covering an outer surface of the second die and a top surface of the first die. In some other embodiments, the conformal thin film structure comprises several discrete thin film patches disposed longitudinal.
摘要翻译：本公开涉及一种具有气密密封结构的MEMS器件及其相关方法。在一些实施例中，第一管芯和第二管芯在结合界面区域结合形成腔室。设置覆盖接合界面区域的外侧壁的保形薄膜结构以提供气密密封。在一些实施例中，保形薄膜结构是覆盖第二模具的外表面和第一模具的顶表面的连续薄层。在一些其它实施例中，保形薄膜结构包括纵向布置的几个分立的薄膜贴片。

9. 发明申请

US20150353348A1 GLASS WAFER ASSEMBLY 有权
标题翻译：玻璃组件
公开(公告)号：US20150353348A1
公开(公告)日：2015-12-10
申请号：US14718408
申请日：2015-05-21
申请人： RF Micro Devices, Inc.
发明人： Jan Edward Vandemeer , Jonathan Hale Hammond
IPC分类号： B81B7/00
CPC分类号： B81B7/0006 , B81B2201/014 , B81B2207/092 , B81B2207/095 , B81B2207/096 , B81C1/00269 , B81C1/00301 , B81C2203/0109 , B81C2203/035 , H01L2224/48137
摘要： A glass wafer assembly is disclosed. In one aspect, the glass wafer assembly comprises a first glass wafer and a second glass wafer that are bonded by a conductive sealing ring. The conductive sealing ring defines a substantially hermetically sealed cavity between the first glass wafer and the second glass wafer. In another aspect, the first glass wafer and the second glass wafer each comprise a plurality of conductive through glass vias (TGVs). At least one active device is disposed in the substantially hermetically sealed cavity and can be electrically coupled to a conductive TGV in the first glass wafer and a conductive TGV in the second glass wafer to enable flexible electrical routing through the glass wafer assembly without wire bonding and over molding. As a result, it is possible to reduce footprint and height while improving radio frequency (RF) performance of the glass wafer assembly.
摘要翻译：公开了一种玻璃晶片组件。在一个方面，玻璃晶片组件包括通过导电密封环结合的第一玻璃晶片和第二玻璃晶片。导电密封环在第一玻璃晶片和第二玻璃晶片之间限定基本上气密的空腔。在另一方面，第一玻璃晶片和第二玻璃晶片各自包括多个导电透玻璃通孔（TGV）。至少一个有源器件设置在基本上气密密封的空腔中，并且可以电耦合到第一玻璃晶片中的导电TGV和第二玻璃晶片中的导电TGV，以使得能够通过玻璃晶片组件的柔性电路径而不引线接合，超模塑。结果，可以在改善玻璃晶片组件的射频（RF）性能的同时减小占地面积和高度。

10. 发明授权

US09181084B2 Electronic device package and fabrication method thereof 有权
标题翻译：电子器件封装及其制造方法
公开(公告)号：US09181084B2
公开(公告)日：2015-11-10
申请号：US12652715
申请日：2010-01-05
申请人： Chien-Hung Liu
发明人： Chien-Hung Liu
IPC分类号： H01L23/02 , B81C1/00 , H01L21/683 , H01L23/00
CPC分类号： B81C1/00325 , B81B2207/092 , B81B2207/097 , B81C1/00301 , B81C2201/0115 , B81C2203/0118 , H01L21/6835 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/93 , H01L2221/68304 , H01L2221/68331 , H01L2221/6834 , H01L2221/68372 , H01L2221/68377 , H01L2221/68386 , H01L2224/02313 , H01L2224/02371 , H01L2224/0239 , H01L2224/0401 , H01L2224/05548 , H01L2224/11009 , H01L2224/11019 , H01L2224/1132 , H01L2224/11462 , H01L2224/11849 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/29007 , H01L2224/29011 , H01L2224/2919 , H01L2224/32225 , H01L2224/83191 , H01L2224/8385 , H01L2224/93 , H01L2924/0001 , H01L2924/01013 , H01L2924/01021 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01075 , H01L2924/014 , H01L2924/10156 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/15151 , H01L2924/15788 , H01L2224/0231 , H01L2224/11 , H01L2224/13099 , H01L2924/00
摘要： The invention provides an electronic device package and fabrication method thereof. The electronic device package includes a sensor chip. An upper surface of the sensor chip comprises a sensing film. A covering plate having an opening structure covers the upper surface of the sensor chip. A cavity is between the covering plate and the sensor chip, corresponding to a position of the sensing film, where the cavity communicates with the opening structure. A spacer is between the covering plate and the sensor chip, surrounding the cavity. A pressure releasing region is between the spacer and the sensing film.
摘要翻译：本发明提供一种电子器件封装及其制造方法。电子装置封装包括传感器芯片。传感器芯片的上表面包括感测膜。具有开口结构的覆盖板覆盖传感器芯片的上表面。覆盖板和传感器芯片之间的腔体对应于感测膜的位置，其中空腔与开口结构连通。间隔件位于覆盖板和传感器芯片之间，围绕腔体。压力释放区域位于间隔件和感测膜之间。

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