专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080079120A1 Interconnect structure using through wafer vias and method of fabrication 有权
标题翻译：通过晶片通孔和制造方法的互连结构
公开(公告)号：US20080079120A1
公开(公告)日：2008-04-03
申请号：US11541774
申请日：2006-10-03
申请人： John S. Foster , Steven H. Hovey , Paul J. Rubel , Kimon Rybnicek
发明人： John S. Foster , Steven H. Hovey , Paul J. Rubel , Kimon Rybnicek
IPC分类号： H01L29/06 , H01L21/30
CPC分类号： B81B7/007 , B81B2201/014 , B81B2207/092
摘要： A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.
摘要翻译：描述了一种在空腔内气密地密封至少一个微结构的装置和方法。通过通过在其前侧支撑至少一个微结构的通孔基板形成的通过晶片通孔提供对至少一个微结构的电接入。通孔基板和盖子晶片可以形成封闭至少一个微结构的密封腔。贯通晶片通孔通过形成在通孔基板的背面上的互连结构连接到位于空腔外部的接合焊盘。因为它们在空腔外部，所以接合焊盘可以放置在形成空腔的接合线的周边内部，从而大大减小了器件所占据的面积。贯通晶片通孔也缩短了微结构与互连之间的电路长度，从而改善了器件中的传热和信号损失。

2. 发明授权

US06578436B1 Method and apparatus for pressure sensing 有权
公开(公告)号：US06578436B1
公开(公告)日：2003-06-17
申请号：US09571765
申请日：2000-05-16
申请人： Srinavasan K. Ganapathi , Randolph S. Gluck , Steven H. Hovey , Shiva Prakash
发明人： Srinavasan K. Ganapathi , Randolph S. Gluck , Steven H. Hovey , Shiva Prakash
IPC分类号： G01D700
CPC分类号： G06K9/00053 , G06K9/0002 , H01H1/0036 , H01H67/22 , Y10T29/49004
摘要： The present invention provides a pressure based fingerprint image capture device that includes an array of cantilevers or simply suspended bridges, with each pressure based sensor having a cantilever or a simply suspended bridge in contact with a conducting electrode that deforms under the load applied by the localized ridge on the fingerprint, and which provides contact to another conducting electrode thereby closing the electrical circuit, a switch in the simplest form, and providing a “pulse” response from the sensor. In the quiescent state, each cantilever or simply suspended bridge structure contains an upper electrode which forms one part of the switch, while another conducting layer, the lower electrode at the bottom of the well of the individual sensor, forms the other part of the switch.

3. 发明授权

US07972683B2 Wafer bonding material with embedded conductive particles 有权
标题翻译：具有嵌入式导电颗粒的晶片接合材料
公开(公告)号：US07972683B2
公开(公告)日：2011-07-05
申请号：US11896648
申请日：2007-09-05
申请人： Christopher S. Gudeman , Steven H. Hovey , Ian R. Johnston
发明人： Christopher S. Gudeman , Steven H. Hovey , Ian R. Johnston
IPC分类号： H01L29/12 , B29C65/48 , H01B1/02
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01B1/02 , H01B1/023 , H01B1/026 , H01L2924/0002 , H01L2924/01079 , Y10T428/12528 , Y10T428/24909 , H01L2924/00
摘要： A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted or fused, and pressure is applied between the first wafer and the second wafer, the first wafer approaches the second wafer until a minimum separation is reached, defined by a dimension of the conductive particles. Each of the first wafer and the second wafer may have circuitry formed thereon, and the conductive particles may form a conductive path between the circuitry on one wafer and the circuitry on the other wafer. Advantageously, the high fusing temperature required by the insulating adhesive may also serve to activate a getter material, formed in the device cavity between the first wafer and the second wafer.
摘要翻译：用于将第一晶片接合到第二晶片的材料，其包括具有嵌入粘合物质中的导电颗粒的绝缘粘合剂。当粘合剂被施加并熔化或熔化并且在第一晶片和第二晶片之间施加压力时，第一晶片接近第二晶片，直至达到由导电颗粒尺寸限定的最小分离。第一晶片和第二晶片中的每一个可以具有在其上形成的电路，并且导电粒子可以在一个晶片上的电路和另一个晶片上的电路之间形成导电路径。有利地，绝缘粘合剂所需的高定影温度也可以用于激活形成在第一晶片和第二晶片之间的器件空腔中的吸气剂材料。

4. 发明授权

US07968986B2 Lid structure for microdevice and method of manufacture 有权
标题翻译：微型装置的盖结构和制造方法
公开(公告)号：US07968986B2
公开(公告)日：2011-06-28
申请号：US11797659
申请日：2007-05-07
申请人： Steven H. Hovey , Hung D. Nguyen
发明人： Steven H. Hovey , Hung D. Nguyen
IPC分类号： H01L23/02
CPC分类号： G02B1/118 , B81B2201/047 , B81C1/00317 , B81C2201/019 , B81C2203/0109 , H01L23/04 , H01L33/483 , H01L2924/0002 , H01L2924/00
摘要： A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelength features on a surface of an infrared transmitting substrate, and coating the subwavelength features with an etch stop material. A spacer wafer is then bonded to the infrared transmitting substrate, and a device cavity is etched into the spacer wafer down to the etch stop material, exposing the subwavelength features. The etch stop material may then be removed, and the microdevice enclosed in the device cavity, by bonding the device wafer to the lid.
摘要翻译：描述了用于在衬底中的空腔底部形成特征的系统和方法。该系统和方法的实施例提供了用于微型装置的红外透射密封盖。可以通过首先在红外线透射基板的表面上形成小的亚波长特征并用蚀刻停止材料涂覆亚波长特征来制造盖子。然后将间隔晶片接合到红外线传输基板，并且将器件空腔蚀刻到间隔晶片中直到蚀刻停止材料，暴露亚波长特征。然后可以通过将器件晶片结合到盖子上来去除蚀刻停止材料，并且将微器件封装在器件空腔中。

5. 发明申请

US20080277672A1 Lid structure for microdevice and method of manufacture 有权
标题翻译：微型装置的盖结构和制造方法
公开(公告)号：US20080277672A1
公开(公告)日：2008-11-13
申请号：US11797659
申请日：2007-05-07
申请人： Steven H. Hovey , Hung D. Nguyen
发明人： Steven H. Hovey , Hung D. Nguyen
IPC分类号： H01L31/12 , H01L21/58
CPC分类号： G02B1/118 , B81B2201/047 , B81C1/00317 , B81C2201/019 , B81C2203/0109 , H01L23/04 , H01L33/483 , H01L2924/0002 , H01L2924/00
摘要： A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelength features on a surface of an infrared transmitting substrate, and coating the subwavelength features with an etch stop material. A spacer wafer is then bonded to the infrared transmitting substrate, and a device cavity is etched into the spacer wafer down to the etch stop material, exposing the subwavelength features. The etch stop material may then be removed, and the microdevice enclosed in the device cavity, by bonding the device wafer to the lid.
摘要翻译：描述了用于在衬底中的空腔底部形成特征的系统和方法。该系统和方法的实施例提供了用于微型装置的红外透射密封盖。盖可以通过首先在红外线透射基底的表面上形成小的亚波长特征，并用蚀刻停止材料涂覆亚波长特征来制造。然后将间隔晶片接合到红外线传输基板，并且将器件空腔蚀刻到间隔晶片中直到蚀刻停止材料，暴露亚波长特征。然后可以通过将器件晶片结合到盖子上来去除蚀刻停止材料，并且将微器件封装在器件空腔中。

6. 发明授权

US06829950B2 Method and apparatus for pressure sensing 有权
标题翻译：用于压力感测的方法和装置
公开(公告)号：US06829950B2
公开(公告)日：2004-12-14
申请号：US10146417
申请日：2002-05-14
申请人： Srinavasan K. Ganapathi , Randolph S. Gluck , Steven H. Hovey , Shiva Prakash
发明人： Srinavasan K. Ganapathi , Randolph S. Gluck , Steven H. Hovey , Shiva Prakash
IPC分类号： G01L300
CPC分类号： G06K9/00053 , G06K9/0002 , H01H1/0036 , H01H67/22 , Y10T29/49004
摘要： The present invention provides a pressure based fingerprint image capture device that includes an array of cantilevers or simply suspended bridges, with each pressure based sensor having a cantilever or a simply suspended bridge in contact with a conducting electrode that deforms under the load applied by the localized ridge on the fingerprint, and which provides contact to another conducting electrode thereby closing the electrical circuit, a switch in the simplest form, and providing a “pulse” response from the sensor. In the quiescent state, each cantilever or simply suspended bridge structure contains an upper electrode which forms one part of the switch, while another conducting layer, the lower electrode at the bottom of the well of the individual sensor, forms the other part of the switch.
摘要翻译：本发明提供了一种基于压力的指纹图像捕获装置，其包括悬臂阵列或简单悬挂的桥，每个基于压力的传感器具有悬臂或与导电电极接触的简单悬挂桥，该导电电极在由局部并且其提供与另一个导电电极的接触，从而闭合电路，最简单形式的开关，并提供来自传感器的“脉冲”响应。在静止状态下，每个悬臂或简单悬挂的桥结构都包含形成开关一部分的上电极，而另一导电层，单个传感器的阱底部的下电极形成开关的另一部分。

7. 发明授权

US07229838B2 MEMS actuator and method of manufacture for MEMS particle sorting device 有权
标题翻译： MEMS致动器及MEMS粒子分选装置的制造方法
公开(公告)号：US07229838B2
公开(公告)日：2007-06-12
申请号：US11260367
申请日：2005-10-28
申请人： John S. Foster , John C. Harley , Steven H. Hovey , Richard T. Martin , Hung D. Nguyen , Paul J. Rubel
发明人： John S. Foster , John C. Harley , Steven H. Hovey , Richard T. Martin , Hung D. Nguyen , Paul J. Rubel
IPC分类号： G01N1/10 , G01N21/64
CPC分类号： B01L3/502707 , A61M1/3633 , A61M1/3678 , B01L3/5027 , B01L3/50273 , B01L3/502761 , B01L2200/0647 , B01L2300/0864 , B01L2400/0484 , C12M47/04 , G01N21/6428 , G01N2015/0288 , G01N2015/149 , Y10T436/11 , Y10T436/112499 , Y10T436/2575
摘要： A micromechanical particle sorting chip uses an actuator divided into two parts to direct a component of interest into one of a plurality of possible exit paths, based on detection of a fluorescent signal emanating from the component of interest. The two-part actuator may include a force-generating portion and a microactuator portion. The microactuator portion may be disposable, whereas the force-generating portion may be reuseable. By bringing the force-generating portion into proximity to the microactuator portion, the microactuator is induced to move, thereby separating the component of interest from the rest of the fluid stream. The force-generating portion and the microactuator portion may be optimized and fabricated separately, thereby leading to faster, more reliable and less expensive particle sorting.
摘要翻译：微机械粒子分选芯片基于从感兴趣的部件发出的荧光信号的检测，使用分成两部分的致动器将感兴趣的部件引导到多个可能的出口路径中的一个。两部分致动器可以包括力产生部分和微致动器部分。微致动器部分可以是一次性的，而力产生部分可以是可再利用的。通过使力产生部分靠近微致动器部分，微致动器被诱导移动，从而将感兴趣的部件与流体流的其余部分分离。力产生部分和微致动器部分可以分开优化和制造，从而导致更快，更可靠和更便宜的颗粒分选。

8. 发明授权

US07059201B2 Use of multi-layer thin films as stress sensors 有权
公开(公告)号：US07059201B2
公开(公告)日：2006-06-13
申请号：US09747304
申请日：2000-12-20
申请人： Shiva Prakash , Srinivasan K. Ganapathi , Randolph S. Gluck , Steven H. Hovey
发明人： Shiva Prakash , Srinivasan K. Ganapathi , Randolph S. Gluck , Steven H. Hovey
IPC分类号： G01D7/00
CPC分类号： G06K9/0002 , G01L1/125
摘要： The present invention provides a pressure sensing device that includes at least one TMR sensor, and preferably an array of TMR sensors, with each TMR sensor having an insulating spacer layer interposed between a pinned and a free ferromagnetic layer. In an unbiased state, the magnetization vector of each of the ferromagnetic layers is preferably parallel to each other. Upon application of a small voltage, the magnetization vectors remain unchanged. Upon application of stress, the magnetization vector of the free magnetic layer will rotate, thus causing a corresponding and proportionally related change in the resistance of the sensor. This change in resistance can be sensed and used to calculate the stress applied thereto.

9. 发明授权

US07675162B2 Interconnect structure using through wafer vias and method of fabrication 有权
标题翻译：通过晶片通孔和制造方法的互连结构
公开(公告)号：US07675162B2
公开(公告)日：2010-03-09
申请号：US11541774
申请日：2006-10-03
申请人： John S. Foster , Steven H. Hovey , Paul J. Rubel , Kimon Rybnicek
发明人： John S. Foster , Steven H. Hovey , Paul J. Rubel , Kimon Rybnicek
IPC分类号： H01L23/10
CPC分类号： B81B7/007 , B81B2201/014 , B81B2207/092
摘要： A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.
摘要翻译：描述了一种在空腔内气密地密封至少一个微结构的装置和方法。通过通过在其前侧支撑至少一个微结构的通孔基板形成的通过晶片通孔提供对至少一个微结构的电接触。通孔基板和盖子晶片可以形成封闭至少一个微结构的密封腔。贯通晶片通孔通过形成在通孔基板的背面上的互连结构连接到位于空腔外部的接合焊盘。因为它们在空腔外部，所以接合焊盘可以放置在形成空腔的接合线的周边内部，从而大大减小了器件所占据的面积。贯通晶片通孔也缩短了微结构与互连之间的电路长度，从而改善了器件中的传热和信号损失。

10. 发明授权

US07220594B2 Method and apparatus for sorting particles with a MEMS device 有权
标题翻译：用MEMS装置分选颗粒的方法和装置
公开(公告)号：US07220594B2
公开(公告)日：2007-05-22
申请号：US11196291
申请日：2005-08-04
申请人： John S. Foster , John C. Harley , Steven H. Hovey , Richard T. Martin , Hung D. Nguyen , Paul J. Rubel
发明人： John S. Foster , John C. Harley , Steven H. Hovey , Richard T. Martin , Hung D. Nguyen , Paul J. Rubel
IPC分类号： G01N1/10 , G01N21/64
CPC分类号： C12M47/04 , A61M1/36 , A61M1/3633 , A61M1/3678 , A61M2202/0437 , B01L3/5027 , G01N21/6428 , G01N2015/0288 , G01N2015/149 , Y10T436/11 , Y10T436/112499 , Y10T436/2575
摘要： A micromechanical particle sorting chip uses laser light directed through at least one of a reflective and refractive surface to come to a focus in an optically transparent layer. The laser light impinges on a particle of interest, causing it to fluoresce. Upon detecting the fluorescence, a micromemchanical actuator is activated, which directs the particle of interest into one of a plurality of possible exit paths.
摘要翻译：微机械粒子分选芯片使用通过反射和折射表面中的至少一个引导的激光在光学透明层中进行聚焦。激光照射在感兴趣的颗粒上，使其发出荧光。在检测到荧光时，微机械致动器被激活，其将感兴趣的颗粒引导到多个可能的出口路径中的一个。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式