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21. 发明授权

US5817156A Substrate heat treatment table apparatus 失效
标题翻译：基板热处理台设备
公开(公告)号：US5817156A
公开(公告)日：1998-10-06
申请号：US548151
申请日：1995-10-25
申请人： Kiyohisa Tateyama , Osamu Hirose
发明人： Kiyohisa Tateyama , Osamu Hirose
IPC分类号： H01L21/027 , H01L21/00 , H01L21/687 , H01L21/68
CPC分类号： H01L21/67173 , H01L21/67109 , H01L21/67236 , H01L21/68742 , H01L21/6875 , H01L21/68778 , Y10T29/41
摘要： A substrate treatment apparatus according to an aspect of the invention includes a table for placing thereon an object to be treated, heating means for heating the object with the table interposed therebetween, and a plurality of support members which project from the table for supporting the object with a space interposed between the object and the table. The height of each of the support members can be varied in accordance with a surface temperature distribution of the object during treatment. A substrate treatment apparatus according to another aspect of the invention includes a table for placing thereon an object to be treated, and heating means for heating the object with the table interposed therebetween. The table has a surface thereof divided into regions of different heat radiation states in accordance with a surface temperature distribution of the object during treatment of the object.
摘要翻译：根据本发明的一个方面的基板处理装置包括：用于放置待处理对象的工作台，用于加热被处理物体的加热装置，以及用于支撑物体的从桌子突出的多个支撑构件在物体和桌子之间插入一个空间。每个支撑构件的高度可以根据处理期间物体的表面温度分布而变化。根据本发明的另一方面的基板处理装置包括用于放置待处理物体的台，以及用于加热物体的加热装置。根据物体处理期间的物体的表面温度分布，该表具有分为不同散热状态的区域。

22. 发明授权

US5813819A Substrate transfer apparatus, and method of transferring substrates 失效
标题翻译：基板转印装置以及基板的转印方法
公开(公告)号：US5813819A
公开(公告)日：1998-09-29
申请号：US833424
申请日：1997-04-07
申请人： Tetu Ohsawa , Kiyohisa Tateyama
发明人： Tetu Ohsawa , Kiyohisa Tateyama
IPC分类号： B65G49/07 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67259 , H01L21/67778 , Y10S414/136 , Y10S414/137
摘要： In a vertical heat treatment apparatus, a transfer apparatus is used to transfer a wafer between a wafer carrier and a wafer boat. The transfer apparatus comprises a base unit, a fork, three non-contact type sensors, and a main controller. The base unit can move between a first position at which to transfer the wafer to and from the wafer carrier and a second position at which to transfer the wafer to and from the wafer boat. The fork can move back and forth with respect to the base unit, for supporting the wafer. The non-contact type sensors are mounted on the fork, for detecting the position of the wafer. The main controller controls the base unit and the fork in accordance with the data detected by the non-contact type sensors. Another embodiment utilizes a monitor camera in place of the sensors to monitor and display the movement of the fork relative to the wafer.
摘要翻译：在立式热处理装置中，转印装置用于在晶片载体和晶片舟之间传送晶片。传送装置包括基座单元，叉子，三个非接触型传感器和主控制器。基座单元可在第一位置和第二位置之间移动，第一位置将晶片传送到晶片载体和从晶片载体传送晶片到第二位置，在第二位置将晶片传送到晶片舟皿和从晶片舟皿传送晶片。叉子可相对于基座单元前后移动，用于支撑晶片。非接触型传感器安装在叉上，用于检测晶片的位置。主控制器根据非接触型传感器检测到的数据控制基座和叉。另一实施例利用监视摄像机来代替传感器来监测和显示叉相对于晶片的运动。

23. 发明授权

US5718763A Resist processing apparatus for a rectangular substrate 失效
标题翻译：用于矩形基板的抗蚀加工装置
公开(公告)号：US5718763A
公开(公告)日：1998-02-17
申请号：US416369
申请日：1995-04-04
申请人： Kiyohisa Tateyama , Kimio Motoda , Tatsuya Iwasaki , Takenobu Matsuo , Kazuki Denpoh , Eiji Yamaguchi
发明人： Kiyohisa Tateyama , Kimio Motoda , Tatsuya Iwasaki , Takenobu Matsuo , Kazuki Denpoh , Eiji Yamaguchi
IPC分类号： B05C11/08 , G03F7/16 , H01L21/00 , H01L21/687 , D05C5/00
CPC分类号： H01L21/67173 , B05C11/08 , G03F7/162 , G03F7/168 , H01L21/6715 , H01L21/68707 , Y10S134/902
摘要： A apparatus of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.
摘要翻译：一种对矩形基板进行抗蚀处理的装置，包括在将抗蚀剂溶液旋转的同时将抗蚀剂溶液供给到基板的抗蚀剂涂布步骤，至少在其一个表面上形成抗蚀剂膜，以及除去液体的抗蚀剂去除步骤，其可以解决在其侧边缘处抵抗其两个表面以从它们去除抗蚀剂膜。

24. 发明授权

US5688322A Apparatus for coating resist on substrate 失效
标题翻译：用于在基材上涂覆抗蚀剂的装置
公开(公告)号：US5688322A
公开(公告)日：1997-11-18
申请号：US653341
申请日：1996-05-24
申请人： Kimio Motoda , Kiyohisa Tateyama , Noriyuki Anai
发明人： Kimio Motoda , Kiyohisa Tateyama , Noriyuki Anai
IPC分类号： B05C11/08 , G03F7/16 , B05C5/00
CPC分类号： G03F7/162 , B05C11/08
摘要： Disclosed is an apparatus for coating resist comprising a spin-chuck capable of moving vertically, holding a substrate received and rotating together with the substrate, resist solution supplying mean for supplying a resist solution onto a substrate held on the spin-chuck, a rotating cup surrounding the substrate held on the spin-chuck and rotated in synchronism with the spin-chuck, for receiving the resist solution centrifugally separated from the substrate, a drain cup provided around the rotating cup, for receiving a waste material discharged from the rotating cup, the drain cup having a collecting space for collecting the waste material received, a drainage passage having a drainage port opening into the collecting space for discharging a liquid component of the waste material collected in the collecting space therefrom, an exhaust passage having an exhaust port communicating with the collecting space, for discharging a gas component of the waste material collected in the collecting space therefrom, an exhaust gas guiding passage provided at a level higher than at least the drainage port, for guiding the gas component from the collecting space to the exhaust passage, and a gas-liquid separating member provided in the exhaust gas guiding passage, for condensing a liquid component contained in air containing the gas component by striking it against the gas-liquid separating member, thereby preventing the liquid component from going around the exhaust passage.
摘要翻译：公开了一种涂覆抗蚀剂的装置，包括能够垂直移动的旋转卡盘，保持与基板一起容纳和旋转的基板，用于将抗蚀剂溶液供应到保持在旋转卡盘上的基板上的抗蚀剂溶液供应装置，旋转杯围绕保持在旋转卡盘上的基板并与旋转卡盘同步旋转，用于接收从基板离心分离的抗蚀剂溶液;设置在旋转杯周围的用于接收从旋转杯排出的废料的排液杯，所述排水杯具有用于收集所接收的废料的收集空间，排水通道，具有通向所述收集空间的排出口，用于排出收集在所述收集空间中的废料的液体成分;排气通道，具有收集空间，用于排出收集在集合体中的废料的气体成分 g的空气引导通道，排气导引通道，其设置在比至少所述排水口高的位置，用于将气体成分从收集空间引导到排气通道;以及气体分离部件，设置在排气引导通道中，用于通过将包含在气体成分的空气中的液体成分撞击气液分离部件而冷凝，从而防止液体成分绕排气通路。

25. 发明授权

US5375291A Device having brush for scrubbing substrate 失效
标题翻译：具有擦洗基板的刷子的装置
公开(公告)号：US5375291A
公开(公告)日：1994-12-27
申请号：US62536
申请日：1993-05-18
申请人： Kiyohisa Tateyama , Michiaki Matsushita
发明人： Kiyohisa Tateyama , Michiaki Matsushita
IPC分类号： B08B1/04 , B08B11/02 , H01L21/00 , B08B3/02
CPC分类号： H01L21/67173 , B08B1/007 , B08B1/04 , B08B11/02 , H01L21/67046 , Y10S134/902
摘要： A substrate cleaning device comprising a motor for rotating a wafer together with a spin plate, claws for holding the wafer so as to form a space between the spin plate and the wafer, a jet nozzle through which cleaning solution is jetted onto an upper surface of the wafer, a rotating brush for brush-cleaning the upper surface of the wafer, a mechanism for blowing nitrogen gas or pure water onto the lower surface of the wafer, and a mechanism for exhausting the space between the spin plate and the wafer, wherein a solution passage for the solution blowing mechanism and an exhaust passage for the exhaust mechanism are formed in a drive shaft of the motor and communicated with the space.
摘要翻译：一种基板清洗装置，其特征在于，包括用于与旋转板一起旋转晶片的马达，用于保持所述晶片的爪，以在所述旋转板和所述晶片之间形成空间，喷嘴，将清洗液喷射到所述旋转板的上表面晶片，用于刷洗晶片的上表面的旋转刷，用于将氮气或纯水吹入晶片的下表面的机构，以及用于排出旋转板和晶片之间的空间的机构，其中用于溶液吹送机构的溶液通道和用于排气机构的排气通道形成在马达的驱动轴中并与空间连通。

26. 发明授权

US5374312A Liquid coating system 失效
标题翻译：液体涂层系统
公开(公告)号：US5374312A
公开(公告)日：1994-12-20
申请号：US144492
申请日：1993-11-01
申请人： Keizo Hasebe , Kiyohisa Tateyama , Yuji Yoshimoto , Yuji Matsuyama , Tetsuro Nakahara , Yoshio Kimura
发明人： Keizo Hasebe , Kiyohisa Tateyama , Yuji Yoshimoto , Yuji Matsuyama , Tetsuro Nakahara , Yoshio Kimura
IPC分类号： B05C5/00 , B05C5/02 , B05C11/08 , G03F7/16 , H01L21/20
CPC分类号： B05C5/001 , B05C11/08 , B05C5/0208 , B05C5/027 , G03F7/162 , Y10S134/902
摘要： A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir. The liquid coating system further comprises an air operation valve disposed in a communication passage between the inlet of the nozzle and the liquid supply source and used to reduce the pressure of the liquid fed under pressure to the liquid reservoir.
摘要翻译：根据本发明的液体涂覆系统包括：液体供应源，具有与液体供应源连通的入口和基本上线性的液体排出部分的喷嘴;压力供给单元，用于在液体供应源通过压缩气体到喷嘴，用于固定地支撑半导体晶片的旋转卡盘，用于使喷嘴的液体排出部分紧密地面对旋转卡盘上的晶片的上下缸体，以及用于旋转旋转卡盘。喷嘴包括从液体供应源供应的液体被收集的液体储存器和与液体储存器连通的大量小通道。液体涂布系统还包括设置在喷嘴入口和液体供应源之间的连通通道中的空气操作阀，用于将在压力下供给的液体的压力降低到液体储存器。

27. 发明授权

US5252137A System and method for applying a liquid 失效
标题翻译：用于施加液体的系统和方法
公开(公告)号：US5252137A
公开(公告)日：1993-10-12
申请号：US758128
申请日：1991-09-12
申请人： Kiyohisa Tateyama , Keizo Hasebe
发明人： Kiyohisa Tateyama , Keizo Hasebe
IPC分类号： G03F7/30 , B05C5/00 , H01L21/00 , H01L21/027 , H01L21/30 , B08B3/00
CPC分类号： H01L21/67173 , B05C5/005 , H01L21/6715
摘要： A liquid applying system according to the present invention comprises a liquid supply source and a nozzle communicating with the liquid supply source. The nozzle comprises a liquid storing portion for storing a liquid supplied from the liquid supply source, a number of small passages communicating with the liquid storing portion, each of the small passages having a transverse section which is smaller than that of the liquid storing portion, and a slit-like passage communicating with the small passages, in which liquids from the small passages flow together and from which the liquids are continuously discharged like a curtain toward a semiconductor wafer.
摘要翻译：根据本发明的液体施加系统包括液体供应源和与液体供应源连通的喷嘴。喷嘴包括用于储存从液体供应源供应的液体的液体存储部分，与液体存储部分连通的多个小通道，每个小通道具有小于液体存储部分的横截面，以及与小通道连通的狭缝状通道，其中来自小通道的液体流动在一起，并且液体从窗口连续排出到半导体晶片。

28. 发明授权

US07101646B2 Developing method and apparatus 失效
标题翻译：开发方法和装置
公开(公告)号：US07101646B2
公开(公告)日：2006-09-05
申请号：US11229534
申请日：2005-09-20
申请人： Kiyohisa Tateyama , Masafumi Nomura , Taketora Shinogi
发明人： Kiyohisa Tateyama , Masafumi Nomura , Taketora Shinogi
IPC分类号： G03F7/30
CPC分类号： G03D3/065 , G03D3/06 , G03F7/30 , G03F7/3071 , H01L21/6715 , H01L21/67253
摘要： In this developing method and apparatus, a concentration measuring unit 222 picks part of developing fluid in a blending tank 186 to measure the resist concentration by an absorption photometry and feeds the detected resist concentration to a control unit 240. The control unit 240 controls respective valves 210, 212, 216 of a TMAH concentrate solution 200, a solvent pipe 204 and a drain pipe 208 in a manner that the developing fluid in the blending tank 186 has a TMAH concentration corresponding to a measured resist-concentration value to accomplish a constant developing rate, performing component control of the developing fluid. The developing fluid transferred from the blending tank 186 to a supply tank 188 is fed to a developer nozzle DN in a developing section 126 through a developer pipe 224 owing to the drive of a pump 228. Accordingly, even if the developing fluid is reused in the developing process in multiple times, it is possible to make sure of the uniformity in development.
摘要翻译：在该显影方法和装置中，浓度测量单元222拾取混合罐186中的显影液的一部分，通过吸收测光法测量抗蚀剂浓度，并将检测到的抗蚀剂浓度供给到控制单元240。控制单元240以这样的方式控制TMAH浓缩液200，溶剂管204和排水管208的各个阀210,212,216，使得混合罐186中的显影流体具有对应于测量的抗蚀剂层的TMAH浓度，浓度值以实现恒定的显影速率，进行显影液的成分控制。通过泵228的驱动，从混合罐186向供给罐188输送的显影液通过显影剂管道224被供给到显影部分126中的显影剂喷嘴DN。因此，即使显影液在显影过程中重复使用多次，也可以确保显影的均匀性。

29. 发明授权

US06706322B2 Film forming apparatus and film forming method 失效
标题翻译：成膜装置及成膜方法
公开(公告)号：US06706322B2
公开(公告)日：2004-03-16
申请号：US10062506
申请日：2002-02-05
申请人： Kiyohisa Tateyama , Tsutae Omori
发明人： Kiyohisa Tateyama , Tsutae Omori
IPC分类号： B05D312
CPC分类号： H01L21/6715 , B05C11/08 , Y10T74/19074 , Y10T74/19102
摘要： A drive pulley is disposed to a driving motor. A plurality of follower pulleys are disposed to a rotating shaft of a spin chuck that vacuum sucks a substrate. A belt is passed from one follower pulley to the drive pulley. Belts are passed from the other follower pulleys to the drive shafts of a plurality of air motors. Since the air motors assist the driving of the driving motor, a large substrate can be rotated at a predetermined rotating acceleration. Thus, a film forming apparatus and a film forming method that allow the quantity of process solution supplied to be reduced and a film of process solution to be equally formed on a substrate can be provided.
摘要翻译：驱动皮带轮设置在驱动马达上。多个从动带轮设置在旋转卡盘的旋转轴上，真空吸附基板。皮带从一个从动轮传递到驱动皮带轮。皮带从其他从动滑轮传递到多个气动马达的驱动轴。由于空气马达有助于驱动马达的驱动，因此可以以预定的旋转加速度旋转大的基板。因此，可以提供允许提供的处理溶液量减少并且可以在基板上同样形成处理溶液膜的成膜装置和成膜方法。

30. 发明授权

US6152677A Apparatus for and method of transferring substrates 失效
标题翻译：用于传送衬底的设备和方法
公开(公告)号：US6152677A
公开(公告)日：2000-11-28
申请号：US75927
申请日：1998-05-12
申请人： Kiyohisa Tateyama , Hideyuki Takamori
发明人： Kiyohisa Tateyama , Hideyuki Takamori
IPC分类号： B65G49/07 , H01L21/677 , H01L21/683 , H01L21/687 , B66C1/00
CPC分类号： H01L21/6838 , H01L21/67742 , H01L21/68707 , Y10S414/136 , Y10S414/141
摘要： A substrate transfer apparatus capable of preventing contaminants from sticking to a substrate again when the substrate is unloaded, wherein a first support member and a second support member are provided on an arm, the first support member supporting the substrate when the substrate is loaded into a processing machine and the second support member supporting the substrate when the substrate is unloaded from the processing machine.
摘要翻译：一种基板输送装置，其能够在基板卸载时能够再次防止污染物粘附到基板上，其中，第一支撑构件和第二支撑构件设置在臂上，所述第一支撑构件在将基板装载到基板中时支撑基板处理机器和第二支撑构件，当从处理机器卸载基板时，支撑基板。

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