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21. 发明授权

US07180736B2 Microelectronic package within cylindrical housing 失效
标题翻译：圆柱形外壳内的微电子封装
公开(公告)号：US07180736B2
公开(公告)日：2007-02-20
申请号：US10616528
申请日：2003-07-10
申请人： Andrew Z. Glovatsky , Vladimir Stoica
发明人： Andrew Z. Glovatsky , Vladimir Stoica
IPC分类号： H05K7/20
CPC分类号： H05K7/20163 , H05K7/1434
摘要： A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipati9on of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.
摘要翻译：微电子封装包括微电子组件和具有圆柱形外壁的壳体。微电子组件包括安装在基板上的电子部件，并且固定到壳体的内壁的支撑表面。壳体优选地由沿着轴向边缘连接的半圆柱形部分形成。壳体包括插入在外壁和内壁之间的用于输送冷却剂气体的一个或多个轴向通道。以这种方式，尽管在圆柱形外壁和支撑表面之间的厚度的变化（其优选是平面的），壳体在操作期间提供了由微电子组件产生的热更均匀的热耗散。

22. 发明授权

US07102888B2 Electronically integrated vehicle structure 有权
标题翻译：电子集成车辆结构
公开(公告)号：US07102888B2
公开(公告)日：2006-09-05
申请号：US10828396
申请日：2004-04-20
申请人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
发明人： Andrew Z. Glovatsky , Jay D. Baker , Richard Keith McMillan , Myron Lemecha , Daniel Roger Vander Sluis
IPC分类号： H05K7/20 , B62D25/14
CPC分类号： B60R16/0207
摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.
摘要翻译：集成车辆结构包括塑料支撑结构中的电子位置。该电子站点具有安装在其上的电子部件的柔性基板。塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。每个肋具有形成塑料安装表面的一部分的侧边缘。柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。也可以提供限定金属安装表面的方法支撑结构。一个或多个电子侧可以附接到金属和塑料安装表面。

23. 发明授权

US06977346B2 Vented circuit board for cooling power components 失效
标题翻译：通风电路板用于冷却功率元件
公开(公告)号：US06977346B2
公开(公告)日：2005-12-20
申请号：US10458448
申请日：2003-06-10
申请人： Vivek A. Jairazbhoy , Andrew Z. Glovatsky
发明人： Vivek A. Jairazbhoy , Andrew Z. Glovatsky
IPC分类号： H01L23/367 , H05K1/02 , H05K3/34 , H05K3/40 , H05K1/00
CPC分类号： H05K1/0203 , H01L23/3677 , H01L2924/0002 , H05K1/0272 , H05K3/341 , H05K3/4007 , H05K2201/0361 , H05K2201/064 , H05K2201/09063 , H05K2201/09736 , H05K2201/10166 , H05K2201/10689 , H01L2924/00
摘要： The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.
摘要翻译：本发明提供了一种电路板，包括形成用于互连电子部件的多个导电电路迹线的第一导体层。电路板包括用于支撑第一导体层的基板和由基板形成的基座，用于支撑多个电子部件中的至少一个。基座提供用于将热量远离多个电子部件中的至少一个的热传导路径和邻近基座的基板中的孔，以允许流体通过基板。

24. 发明授权

US06753477B1 Flatwire jumper patch 失效
标题翻译：扁线跳线贴片
公开(公告)号：US06753477B1
公开(公告)日：2004-06-22
申请号：US10426304
申请日：2003-04-30
申请人： Peter J. Sinkunas , Andrew Z. Glovatsky , Xu Song , Anne M. Sullivan , Yutaka Kawase
发明人： Peter J. Sinkunas , Andrew Z. Glovatsky , Xu Song , Anne M. Sullivan , Yutaka Kawase
IPC分类号： H01B708
CPC分类号： H01R12/613 , H05K1/141 , H05K3/222 , H05K3/363 , H05K2201/10363
摘要： A flatwire assembly includes a pair of elongate flatwire segments that are interconnected with a thin, flexible patch that overlies the opposed longitudinal ends of the segments. Conductive traces on the bottom face of the patch are electrically connected to the respective conductive traces of the segments by solder layers that, upon reflow under heat and pressure, respectively extend past an edge of the patch, whereupon visual confirmation of the solder joints between the traces of the patch and the segment is readily obtained. A layer of a thermally-activated or pressure-sensitive adhesive is disposed between the patch and each segment to further mechanically couple the patch to each segment during solder reflow. Longitudinal extensions of the patch substrate are bonded by the adhesive layer to respective portions of the segments farther removed from the segment ends than the solder layer extensions provide enhanced strain relief.
摘要翻译：扁线组件包括一对细长的扁平线段，其与覆盖在段的相对的纵向端部之间的薄的柔性补片相互连接。贴片底面上的导电迹线通过焊料层电连接到片段的相应导电迹线，焊料层在热和压力下回流分别延伸经过贴片的边缘，于是可见地确认焊点贴片和片段的痕迹容易获得。在贴片和每个片段之间设置热激活或压敏粘合剂层，以在焊料回流期间进一步将贴片机械地耦合到每个片段。贴片衬底的纵向延伸部分通过粘合剂层粘合到比段焊接层延伸更远部分的相应部分，而焊料层延伸部提供增强的应变消除。

25. 发明授权

US06688290B2 Integrated fuel delivery and electronic powertrain control module and method of manufacture 失效
标题翻译：综合燃油输送和电子动力总成控制模块及其制造方法
公开(公告)号：US06688290B2
公开(公告)日：2004-02-10
申请号：US10062321
申请日：2002-01-31
申请人： Jim Zehnal , Lakhi N. Goenka , Mark D. Miller , Andrew Z. Glovatsky , David J. Steinert , Harvinder Singh , Jeff J. Klas
发明人： Jim Zehnal , Lakhi N. Goenka , Mark D. Miller , Andrew Z. Glovatsky , David J. Steinert , Harvinder Singh , Jeff J. Klas
IPC分类号： F02M3304
CPC分类号： F02M35/10321 , F02M35/10085 , F02M35/10144 , F02M35/10216 , F02M35/10249 , F02M35/10288 , F02M35/10327 , F02M35/10347 , F02M35/10354 , F02M35/116 , F05C2225/08
摘要： An integrated control and fuel delivery system having an intake manifold that receives a portion of an airflow and delivers air to an engine and a fuel spacer that receives the air from the intake manifold. The fuel spacer includes a wiring harness. A control module is disposed on the fuel spacer adjacent to the intake manifold of the engine.
摘要翻译：一种具有进气歧管的综合控制和燃料输送系统，该进气歧管接收气流的一部分并将空气输送到发动机，以及从进气歧管接收空气的燃料间隔件。燃料间隔件包括线束。控制模块设置在与发动机的进气歧管相邻的燃料间隔件上。

26. 发明授权

US5702584A Enhanced plating adhesion through the use of metallized fillers in plastic substrate 失效
标题翻译：通过在塑料基材中使用金属化填料增强镀层附着力
公开(公告)号：US5702584A
公开(公告)日：1997-12-30
申请号：US675308
申请日：1996-07-01
申请人： Lakhi N. Goenka , Michael G. Todd , Andrew Z. Glovatsky
发明人： Lakhi N. Goenka , Michael G. Todd , Andrew Z. Glovatsky
IPC分类号： B29C37/00 , B29C70/64 , C23C18/16 , H05K3/38 , C25D5/54 , B05D3/04 , C25D5/56
CPC分类号： C23C18/22 , B29C37/0082 , B29C70/64 , C23C18/1641 , C23C18/1653 , H05K3/381
摘要： A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.
摘要翻译：聚合物基板用金属镀覆，使用聚合物中的金属填料颗粒作为通过化学镀操作形成的金属层的固定点。聚合物具有包括非金属填料颗粒和金属填料颗粒的填料; 可以蚀刻与聚合物表面相邻的非金属填料颗粒，以使靠近蚀刻表面的金属填料颗粒暴露。暴露的金属填料颗粒用作无电镀层的固定点。

27. 发明授权

US06906679B2 Light weight portable phased array antenna 有权
标题翻译：轻便便携式相控阵天线
公开(公告)号：US06906679B2
公开(公告)日：2005-06-14
申请号：US10624040
申请日：2003-07-21
申请人： Lawrence Leroy Kneisel , Jay D. Baker , Bernard A. Meyer , Andrew Z. Glovatsky
发明人： Lawrence Leroy Kneisel , Jay D. Baker , Bernard A. Meyer , Andrew Z. Glovatsky
IPC分类号： H01Q1/08 , H01Q1/12 , H01Q1/27 , H01Q1/32 , H01Q3/26 , H01Q15/14 , H01Q21/00 , H01Q21/06 , H04B10/00
CPC分类号： H01Q1/08 , H01Q1/1235 , H01Q1/32 , H01Q3/26 , H01Q3/2676 , H01Q21/062
摘要： An antenna system for receiving communication signals from satellites having plurality of subplates, a plurality of antenna nodes supported on the top surface of each subplate, and an electronic control unit to which the subplates are fixed and aligned and a collapsible support stand fixed to the bottom of the electronic control unit opposite the subplates in which the subplates, electronic control unit and stand interconnect to form an easily assembled lightweight antenna assembly that may be disassembled into easily portable components.
摘要翻译：一种天线系统，用于从具有多个子板的卫星接收通信信号，多个天线节点被支撑在每个辅助板的顶表面上，以及一个电子控制单元，子板被固定和对准，一个可折叠的支撑架固定在底部电子控制单元与底板相对的子板，电子控制单元和支架互连构成易于组装的轻型天线组件，其可以拆卸成易于携带的部件。

28. 发明授权

US06669273B1 Vehicle instrument panel structure to support electronics packaging 失效
标题翻译：车载仪表板结构支持电子封装
公开(公告)号：US06669273B1
公开(公告)日：2003-12-30
申请号：US10245764
申请日：2002-09-16
申请人： Andrew Z. Glovatsky , Thomas B. Krautheim , Daniel R. Vander Sluis
发明人： Andrew Z. Glovatsky , Thomas B. Krautheim , Daniel R. Vander Sluis
IPC分类号： B62D2514
CPC分类号： B62D25/145 , B60K37/00
摘要： An automobile instrument panel assembly for the cockpit of an automobile. The assembly includes, in one embodiment, a cross-car beam structure for supporting the assembly. The structure extends across a substantial portion of the cockpit and defines a plurality of generally planar mounting sites and further defines at least one recess. At least one substrate is mounted to the beam and includes at least one area of the substrate populated by electronic components on both sides of the substrate. The area is aligned over the at least one recess, and an instrument panel cover is removably positioned over the substrate and the structure.
摘要翻译：一种用于汽车驾驶舱的汽车仪表板组件。在一个实施例中，组件包括用于支撑组件的十字架梁结构。该结构延伸穿过驾驶舱的大部分并且限定多个大致平面的安装位置，并进一步限定至少一个凹部。至少一个基板被安装到所述梁上并且包括由所述基板的两侧上的电子部件填充的所述基板的至少一个区域。该区域在至少一个凹部上对准，并且仪表板盖可移除地定位在基板和结构上方。

29. 发明授权

US06613239B2 Method for making an electrical circuit board 失效
公开(公告)号：US06613239B2
公开(公告)日：2003-09-02
申请号：US09836644
申请日：2001-04-17
申请人： Andrew Z. Glovatsky , Robert E. Belke , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Marc A. Straub , Richard K. McMillan , Ram S. Raghava , Thomas B. Krautheim , Michael A. Howey , Vivek A. Jairazbhoy
发明人： Andrew Z. Glovatsky , Robert E. Belke , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Marc A. Straub , Richard K. McMillan , Ram S. Raghava , Thomas B. Krautheim , Michael A. Howey , Vivek A. Jairazbhoy
IPC分类号： B44C122
CPC分类号： H05K3/4641 , H05K3/062 , H05K3/4038 , H05K3/4623 , H05K2201/0305 , H05K2201/0361 , H05K2201/0397 , H05K2201/09554 , H05K2201/09881 , H05K2203/0733 , H05K2203/1184 , Y10T29/49155
摘要： A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

30. 发明授权

US06391211B1 Method for making an electrical circuit board 失效
标题翻译：制造电路板的方法
公开(公告)号：US06391211B1
公开(公告)日：2002-05-21
申请号：US09655559
申请日：2000-09-06
申请人： Andrew Z. Glovatsky , Robert Joseph Gordon , Vivek Amir Jairazbhoy , Vladimir Stoica
发明人： Andrew Z. Glovatsky , Robert Joseph Gordon , Vivek Amir Jairazbhoy , Vladimir Stoica
IPC分类号： H01B1300
CPC分类号： H05K3/062 , H01L2924/00013 , H05K3/445 , H05K3/4614 , H05K3/4641 , H05K2201/0361 , H05K2201/0379 , H05K2201/09881 , H05K2203/0323 , H01L2224/29099
摘要： A method for making multi-layer electronic circuit board including a pre-circuit assembly 12 and a ground layer 14 which are automatically aligned and bonded together by use of solder material or deposits 26, 28.
摘要翻译：一种制造多层电子电路板的方法，其包括通过使用焊料或沉积物26,28自动对准并结合在一起的预电路组件12和接地层14。

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