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    • 12. 发明申请
    • Semiconductor laser and method of making the same
    • 半导体激光器及其制作方法
    • US20090141764A1
    • 2009-06-04
    • US12289709
    • 2008-10-31
    • Hideki YagiToshio NomaguchiKenji Hiratsuka
    • Hideki YagiToshio NomaguchiKenji Hiratsuka
    • H01S5/22H01L21/02
    • H01S5/2231H01S5/0425H01S5/2213H01S5/2214H01S5/222
    • In the method of making a semiconductor laser, a semiconductor region is grown on an active layer, and a part of the semiconductor region is etched to form a ridge structure. An insulating film is formed over the ridge structure, and a resin layer of photosensitive material is formed to bury the ridge structure. A cured resin portion and an uncured resin portion are formed in the resin layer by performing lithographic exposure of the resin layer, and the uncured resin portion is on the top of the ridge structure. The uncured resin portion is removed to form a dent which is provided on the top of the ridge structure. An overall surface of the cured resin portion and dent is etched to form an etched resin layer. An opening is formed in the etched resin layer by thinning the cured resin portion, and a part of the insulating film is exposed in the opening of the etched resin layer. The part of the insulating film is etched using the etched resin layer as a mask to form an opening in the insulating film. An electrode is formed over the ridge structure and the etched resin layer.
    • 在制造半导体激光器的方法中,半导体区域在有源层上生长,并且半导体区域的一部分被蚀刻以形成脊结构。 在脊结构上形成绝缘膜,形成感光材料的树脂层以埋设脊结构。 通过进行树脂层的光刻曝光,在树脂层中形成固化树脂部分和未固化的树脂部分,未固化的树脂部分在脊部结构的顶部。 去除未固化的树脂部分以形成设置在脊结构的顶部上的凹陷。 将固化的树脂部分和凹陷的整个表面蚀刻以形成蚀刻的树脂层。 通过使固化的树脂部分变薄,在蚀刻的树脂层中形成开口,并且绝缘膜的一部分暴露在蚀刻的树脂层的开口中。 使用蚀刻树脂层作为掩模来蚀刻绝缘膜的一部分,以在绝缘膜中形成开口。 在脊结构和蚀刻树脂层上形成电极。
    • 13. 发明授权
    • Fluorocopolymer material with sulfonic acid functional groups as a solid polyelectrolyte for use in fuel cells
    • 具有磺酸官能团的含氟共聚物材料作为用于燃料电池的固体聚电解质
    • US07455934B1
    • 2008-11-25
    • US09700185
    • 1999-05-10
    • Takayuki ArakiNoritoshi OkaYoshito TanakaTakayuki NakamuraTetsuo Shimizu
    • Takayuki ArakiNoritoshi OkaYoshito TanakaTakayuki NakamuraTetsuo Shimizu
    • H01M10/08
    • H01S5/22C08J5/2237C08J2327/12G02B2006/12097G02B2006/12176H01B1/122H01M8/0289H01M8/1025H01M8/1039H01M8/1067H01S5/0655H01S5/20H01S5/2004H01S5/2213H01S5/2218H01S5/2227
    • The invention is a material for a solid polyelectrolyte, comprising a multi-segmented fluoropolymer that comprises a block copolymer and/or a graft copolymer, wherein the copolymer contains one or more blocks essentially consisting of segment A and one or more blocks essentially consisting of segment B, the segment A combines with the segment B, wherein the segment A has a molecular weight of 5,000 to 1,000.000, and the Segment A is a copolymer chain comprising (a) an ethylenicfluoromonomer containing sulfonic acid functional groups each represented by Formula (1) CX2═CX1—(O)n—Rf—SO2Y, wherein X and X1 may be the same or different and are each hydrogen or fluorine; Y is FI, Cl, or OY1 wherein y1 is hydrogen, alkali metal or C1-C5 alkyl; Rf is C1 to C40 divalent fluoroalkylene or C1 to C40 divalent fluoroalkylene having one or more ether bonds; and n is 0 or 1; and (b) at least one type of ethylenic fluoromonomer copolymerizable with the ethylenic fluoromonomer (a) and containing no sulfonic acid functional groups, the segment B is a fluoropolymer containing no sulfonic acid functional groups, has a molecular weight of 3,000 to 1,200,000, and has a crystalline melting point of 100° C. or higher or a glass transition point of 100° C. or higher, wherein the ratio of segment A:segment B in the segmented fluoropolymer is 5:9˜to 98:2 30:70 to 90:10 wt. %.
    • 本发明是用于固体聚电解质的材料,其包含多段含氟聚合物,其包含嵌段共聚物和/或接枝共聚物,其中所述共聚物含有一个或多个基本上由片段A组成的嵌段和一个或多个基本上由片段 B,段A与段B结合,其中段A的分子量为5,000〜1,000.000,段A为共聚物链,其包含(a)含有各自由式(1)表示的磺酸官能团的烯键式氟单体, CX 2 - - - - - - - - - - - - - - - - - - - - - - - - - - - - (O) SUP> 1可以相同或不同,分别为氢或氟; Y是FI,Cl或OY 1,其中y 1是氢,碱金属或C 1 -C 5 烷基; Rf是C 1至C 40二价氟代亚烷基或C 1至C 40二价氟代亚烷基,其具有一个或多个醚 债券 并且n为0或1; 和(b)至少一种可与烯属含氟单体(a)共聚并且不含磺酸官能团的烯属含氟单体,段B是不含磺酸官能团的含氟聚合物,分子量为3,000至1,200,000, 具有100℃以上的结晶熔点或100℃以上的玻璃化转变温度,其中分段含氟聚合物中A段:B段的比例为5:9〜98:2 30:70 至90:10重量 %。
    • 17. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US06765944B2
    • 2004-07-20
    • US10307365
    • 2002-12-02
    • Tetsuya YagiYasuaki Yoshida
    • Tetsuya YagiYasuaki Yoshida
    • H01S522
    • H01S5/22H01S5/02461H01S5/162H01S5/2213H01S5/2214H01S5/2216H01S5/2227H01S2301/18
    • A semiconductor laser device includes a stacked structure. The stacked structure includes a first electrode, a substrate of a first conductivity type on the first electrode, a first cladding layer of the first conductivity type, an active layer, a second cladding layer of a second conductivity type opposite the first conductivity type, an insulating layer, and a second electrode. The second cladding layer includes at least first and second portions having thickness different from each other. The first portion is thicker than the second portion. The insulating layer is deposited on the second cladding layer but not on the first portion. The second electrode is electrically connected to the first portion. A product of a reciprocal of layer thickness and heat conductivity of the insulating layer is smaller than 4×108 W/(m2K).
    • 半导体激光器件包括堆叠结构。 堆叠结构包括第一电极,第一电极上的第一导电类型的衬底,第一导电类型的第一包层,有源层,与第一导电类型相反的第二导电类型的第二包层, 绝缘层和第二电极。 第二包层至少包括具有彼此不同厚度的第一和第二部分。 第一部分比第二部分厚。 绝缘层沉积在第二覆层上,但不在第一部分上。 第二电极电连接到第一部分。 绝缘层的厚度和导热率的倒数的乘积小于4×10 8 W /(m 2 K)。
    • 19. 发明申请
    • RIDGE WAVEGUIDE-TYPE OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    • RIDGE波导型光学半导体器件及其制造方法
    • US20010022885A1
    • 2001-09-20
    • US09222866
    • 1998-12-30
    • KOJI YAMADAKOJI NAKAMURA
    • G02B006/13
    • H01S5/22G02B2006/12097G02B2006/12176H01S5/0655H01S5/20H01S5/2004H01S5/2213H01S5/2218H01S5/2227
    • A ridge waveguide-type optical semiconductor device and a method of fabricating the same. The method of fabrication includes forming a first clad layer, a core layer, a second clad layer and a contact layer, in the stated order on a semiconductor substrate, forming a strip-shaped etching mask on the contact layer, removing the contact layer and the second clad layer selectively by etching, using the etching mask, until the core layer is exposed, so as to form a ridge including etched second clad layer, and forming a semiconductor layer by crystal growth, so as to form a mode control layer on the exposed surface of the core layer. The semiconductor device includes a semiconductor substrate, a first clad layer formed on the substrate, a core layer serving as a waveguide, on the first clad layer, and a strip-shaped second clad layer on the core layer. A mode control layer is formed on the core layer, and insulating layers are formed on the mode control layer, at opposite sides of the second clad layer. To confine light to waveguide, the mode control layer has a refractive index equal to or less than a refractive index of the core layer, and is larger than refractive indexes of the respective insulating layers.
    • 脊波导型光学半导体器件及其制造方法。 制造方法包括在半导体衬底上按顺序形成第一覆盖层,芯层,第二覆盖层和接触层,在接触层上形成条状蚀刻掩模,去除接触层和 通过蚀刻选择性地使用蚀刻掩模直到芯层露出,以便形成包括蚀刻的第二覆盖层的脊,并且通过晶体生长形成半导体层,以形成模式控制层 核心层的暴露表面。 半导体器件包括半导体衬底,在衬底上形成的第一覆盖层,用作波导的芯层,在第一覆盖层上,以及芯层上的带状第二覆盖层。 在芯层上形成模式控制层,在模式控制层上,在第二覆层的相对侧形成绝缘层。 为了将光限制在波导上,模式控制层具有等于或小于芯层的折射率的折射率,并且大于各绝缘层的折射率。