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    • 3. 发明授权
    • Semiconductor laser device
    • 半导体激光器件
    • US06765944B2
    • 2004-07-20
    • US10307365
    • 2002-12-02
    • Tetsuya YagiYasuaki Yoshida
    • Tetsuya YagiYasuaki Yoshida
    • H01S522
    • H01S5/22H01S5/02461H01S5/162H01S5/2213H01S5/2214H01S5/2216H01S5/2227H01S2301/18
    • A semiconductor laser device includes a stacked structure. The stacked structure includes a first electrode, a substrate of a first conductivity type on the first electrode, a first cladding layer of the first conductivity type, an active layer, a second cladding layer of a second conductivity type opposite the first conductivity type, an insulating layer, and a second electrode. The second cladding layer includes at least first and second portions having thickness different from each other. The first portion is thicker than the second portion. The insulating layer is deposited on the second cladding layer but not on the first portion. The second electrode is electrically connected to the first portion. A product of a reciprocal of layer thickness and heat conductivity of the insulating layer is smaller than 4×108 W/(m2K).
    • 半导体激光器件包括堆叠结构。 堆叠结构包括第一电极,第一电极上的第一导电类型的衬底,第一导电类型的第一包层,有源层,与第一导电类型相反的第二导电类型的第二包层, 绝缘层和第二电极。 第二包层至少包括具有彼此不同厚度的第一和第二部分。 第一部分比第二部分厚。 绝缘层沉积在第二覆层上,但不在第一部分上。 第二电极电连接到第一部分。 绝缘层的厚度和导热率的倒数的乘积小于4×10 8 W /(m 2 K)。