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    • 4. 发明授权
    • Method of making an article comprising an oxide layer on a GaAs-based semiconductor body
    • 在GaAs基半导体本体上制造包含氧化物层的制品的方法
    • US06271069B1
    • 2001-08-07
    • US09122558
    • 1998-07-24
    • Young-Kai ChenAlfred Yi ChoWilliam Scott HobsonMinghwei HongJenn-Ming KuoJueinai Raynien KwoDonald Winslow MurphyFan Ren
    • Young-Kai ChenAlfred Yi ChoWilliam Scott HobsonMinghwei HongJenn-Ming KuoJueinai Raynien KwoDonald Winslow MurphyFan Ren
    • H01L2976
    • H01L29/517C23C14/08H01L21/28158H01L21/28264H01L21/8252H01L27/0605H01L29/66522H01L29/78H01L33/44H01S5/028
    • Disclosed are a method of making GaAs-based enhancement-type MOS-FETs, and articles (e.g., GaAs-based ICs) that comprise such a MOS-FET. The MOS-FETs are planar devices, without etched recess or epitaxial re-growth, with gate oxide that is primarily Ga2O3, and with low midgap interface state density (e.g., at most 1×1011 cm−2 eV−1 at 20° C.). The method involves ion implantation, implant activation in an As-containing atmosphere, surface reconstruction, and in situ deposition of the gate oxide. In preferred embodiments, no processing step subsequent to gate oxide formation is carried out above 300° C. in air, or above about 700° C. in UHV. The method makes possible fabrication of planar enhancement-type MOS-FETs having excellent characteristics, and also makes possible fabrication of complementary MOS-FETs, as well as ICs comprising MOS-FETs and MES-FETs. The method includes deposition of gate oxide of overall composition GaxAyOz, where Ga substantially is in the 3+ oxidation state, A is one or more electropositive stabilizer element adapted for stabilizing Ga in the 3+ oxidation state, x is greater than or equal to zero, z is selected to satisfy the requirement that both Ga and A are substantially fully oxidized, and y/(x+y) is greater than 0.1.
    • 公开了制造基于GaAs的增强型MOS-FET的方法以及包括这种MOS-FET的制品(例如,基于GaAs的IC)。 MOS-FET是没有蚀刻凹槽或外延再生长的平面器件,其栅极氧化物主要是Ga 2 O 3,并且具有低的中间隙界面态密度(例如,在20℃下至多为1×10 11 cm -2 eV-1) 。 该方法涉及离子注入,在含As气氛中的注入活化,表面重构和栅极氧化物的原位沉积。 在优选的实施方案中,栅极氧化物形成之后的处理步骤在高于300℃的空气中或在高于约700℃的UHV中进行。 该方法可以制造具有优异特性的平面增强型MOS-FET,并且还可以制造互补MOS-FET以及包括MOS-FET和MES-FET的IC。 该方法包括沉积总体组成为GaxAyOz的栅极氧化物,其中Ga基本上处于3+氧化态,A是一种或多种适用于稳定3+氧化态的Ga的正电荷稳定剂元素,x大于或等于零 选择z以满足Ga和A基本上完全氧化,y /(x + y)大于0.1的要求。