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1. 发明申请

US20060141649A1 Method of reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region 有权
公开(公告)号：US20060141649A1
公开(公告)日：2006-06-29
申请号：US11358784
申请日：2006-02-21
申请人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
发明人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
IPC分类号： H01L21/00 , G02B6/12
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： A method for reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region in a photonic integrated circuit (PIC) includes the steps of forming a passivation layer over the waveguides and region and forming the passivation overlayer such that it monotonically increases in thickness through the transition region to the free space coupler region.

2. 发明申请

US20060140574A1 Formation of cleaved grooves in a passivation layer formed over a surface of a wafer prior to wafer singulation 有权
标题翻译：在晶片切割之前在晶片的表面上形成钝化层中的切割槽的形成
公开(公告)号：US20060140574A1
公开(公告)日：2006-06-29
申请号：US11362952
申请日：2006-02-27
申请人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Frank Peters , Mehradad Ziari , Fred Kish
发明人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Frank Peters , Mehradad Ziari , Fred Kish
IPC分类号： G02B6/00
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： Cleaved grooves, also referred to herein as “cleave streets”, are formed exclusively in a wafer passivation layer overlaying a wafer to provide for correctly aligned and sharp cleaves prior to singulation of the wafer into separate die or chips. The deployment of cleave streets is applicable to both Group III-V-base wafers, such as InP-based wafers with photonic integrated circuits (PICs), and silicon-based wafers with integrated circuits where such wafers utilize a passivating layer
摘要翻译：在本文中也称为“切割街道”的切割凹槽仅专门形成在覆盖晶片的晶片钝化层中，以在将晶片分离成单独的芯片或芯片之前提供正确对准和尖锐的切割。劈裂街道的部署适用于III-V族晶圆，例如具有光子集成电路（PIC）的基于InP的晶片，以及具有集成电路的硅基晶片，其中这些晶片利用钝化层

3. 发明申请

US20060138433A1 Optical combiner/decombiner with reduced insertion loss 有权
标题翻译：具有减少插入损耗的光学组合器/分解器
公开(公告)号：US20060138433A1
公开(公告)日：2006-06-29
申请号：US11358337
申请日：2006-02-21
申请人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
发明人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
IPC分类号： H01L33/00 , G02B6/10 , G02B6/12
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： A photonic integrated circuit that includes a plurality of active and passive components on a substrate where one of the components is an optical combiner/decombiner having at least one free space coupler region and a plurality of longitudinal ridge waveguides each extending in the circuit from a first region of the waveguide and coupled at a second region of the waveguide at the free space coupler region. A first dielectric layer formed over the ridge waveguides and the free space coupler region. The first dielectric layer monotonically increases in cross-sectional thickness from the waveguide first region to the second region to reduce signal insertion losses in transitioning from the ridge waveguides to the free space coupler region. The first dielectric layer may be covered with a second passivation layer. The first dielectric layer may be SiOx, SiNx or SixONy and the second passivation layer may be BCB, ZnS or ZnSe.
摘要翻译：一种光子集成电路，其包括在衬底上的多个有源和无源部件，其中所述部件之一是具有至少一个自由空间耦合器区域的多个纵向脊波导和多个纵向脊波导，所述多个纵向脊波导在电路中从第一并且在自由空间耦合器区域的波导的第二区域耦合。形成在脊状波导上的第一电介质层和自由空间耦合器区域。第一电介质层从波导第一区域到第二区域的横截面厚度单调增加，以减少从脊状波导到自由空间耦合器区域的转换中的信号插入损耗。第一介电层可以被第二钝化层覆盖。第一电介质层可以是SiO x，SiN x x或Si x x y y，并且第二钝化层可以是BCB，ZnS或ZnSe。

4. 发明申请

US20060093369A1 Photonic integrated circuit (PIC) transceivers for an optical line terminal (OLT) and an optical network unit (ONU) in passive optical networks (PONs) 有权
标题翻译：用于光线路终端（OLT）的光子集成电路（PIC）收发器和无源光网络（PON）中的光网络单元（ONU）
公开(公告)号：US20060093369A1
公开(公告)日：2006-05-04
申请号：US11253776
申请日：2005-10-19
申请人： Radhakrishnan Nagarajan
发明人： Radhakrishnan Nagarajan
IPC分类号： H04B10/00
CPC分类号： H04J14/02 , H04B10/43 , H04J14/0282 , H04J14/0283
摘要： A photonic integrated circuit (PIC) for a PON transceiver comprises a single monolithic chip having a modulated transmitter laser diode of a first wavelength, λ1, for generating a first communication signal outgoing from the chip via an input/output port and a receiving photodetector for receiving a second communication signal of a second wavelength, λ2, onto chip incoming from the input/output port and a monitoring photodetector for receiving a portion of the first communication signal to monitor the laser diode output power. In one embodiment, the chip is provided with multimode (MM) coupler set to direct a substantial portion of the incoming communication signal to the receiving photodetector and to direct a substantial portion of the outgoing communication signal to the input/output port. A filter may be inserted before the receiving photodetector and/or the laser diode to extract any remaining and undesired signal to either such electro-optic elements. In another embodiment, the laser diode, power monitoring photodetector and the receiving photodetector are collinear in the same chip having a common waveguide where the power monitoring photodetector is capable of both monitoring power and insuring no backward reflecting light of the laser diode reaches the receiving photodiode through it absorption of such light. The active region of the power monitoring photodetector can be set to be absorptive of incoming of backward reflected polarized light of both the TE and TM polarization modes respectively from the chip input or the on-chip laser diode.
摘要翻译：用于PON收发器的光子集成电路（PIC）包括具有第一波长λ1的调制发射器激光二极管的单个单片芯片，用于通过输入产生从芯片输出的第一通信信号 /输出端口和接收光电检测器，用于接收来自输入/输出端口的芯片上的第二波长λ2的第二通信信号和用于接收第一通信信号的一部分的监视光电检测器监控激光二极管的输出功率。在一个实施例中，芯片设置有多模（MM）耦合器组，以将输入通信信号的大部分引导到接收光电检测器，并将输出通信信号的大部分引导到输入/输出端口。可以在接收光电检测器和/或激光二极管之前插入滤光器以将任何剩余和不期望的信号提取到这样的电光元件。在另一个实施例中，激光二极管，功率监测光电检测器和接收光电检测器在具有公共波导的相同芯片中共线，其中功率监测光电检测器能够监测功率并确保激光二极管的反向反射光不到达接收光电二极管通过它吸收这样的光。功率监视光电检测器的有源区域可以被设置为分别从芯片输入或片上激光二极管吸收TE和TM偏振模的反向偏振光的反射偏振光的入射。

5. 发明申请

US20060067619A1 Optical transport network 有权
公开(公告)号：US20060067619A1
公开(公告)日：2006-03-30
申请号：US11273844
申请日：2005-11-15
申请人： David Welch , Radhakrishnan Nagarajan , Fred Kish , Mark Missey , Vincent Dominic , Atul Mathur , Frank Peters , Charles Joyner , Richard Schneider , Ting-Kuang Chiang
发明人： David Welch , Radhakrishnan Nagarajan , Fred Kish , Mark Missey , Vincent Dominic , Atul Mathur , Frank Peters , Charles Joyner , Richard Schneider , Ting-Kuang Chiang
IPC分类号： G02B6/34
CPC分类号： H04B10/2914 , B82Y20/00 , G02B6/12004 , G02B6/12007 , G02B6/12011 , G02B6/12019 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/1203 , G02B6/12033 , G02B6/4249 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/0425 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/101 , H01S5/1014 , H01S5/12 , H01S5/1228 , H01S5/183 , H01S5/2077 , H01S5/22 , H01S5/2224 , H01S5/227 , H01S5/3404 , H01S5/3408 , H01S5/34306 , H01S5/4025 , H01S5/4031 , H01S5/4087 , H01S5/50 , H01S5/5072 , H04B10/25 , H04B10/50 , H04B10/675 , H04J14/02
摘要： An optical transport network comprises a monolithic transmitter photonic integrated circuit (TxPIC) InP-based chip and a monolithic receiver photonic integrated circuit (RxPIC) InP-based chip.

6. 发明申请

US20060029324A1 Benzocyclobutene polymer (BCB) as a passivation layer for optical passive elements 有权
公开(公告)号：US20060029324A1
公开(公告)日：2006-02-09
申请号：US11242519
申请日：2005-10-03
申请人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
发明人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
IPC分类号： G02B6/10
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： An InP-based photonic integrated circuit (PIC) includes an optical passive element in the circuit with no bias current applied to such an element. A passivation cladding layer overlies a surface of the optical passive element where the passivation layer comprises benzocyclobutene polymer or BCB.

7. 发明申请

US20050213883A1 Method of optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC) 有权
标题翻译：在单片接收机光子集成电路（RxPIC）中优化光信道信号解复用的方法
公开(公告)号：US20050213883A1
公开(公告)日：2005-09-29
申请号：US11136735
申请日：2005-05-24
申请人： David Welch , Radhakrishnan Nagarajan , Fred Kish , Mark Missey , Vincent Dominic , Atul Mathur , Frank Peters , Charles Joyner
发明人： David Welch , Radhakrishnan Nagarajan , Fred Kish , Mark Missey , Vincent Dominic , Atul Mathur , Frank Peters , Charles Joyner
IPC分类号： G02B6/12 , G02B6/34 , G02F1/017 , H01S5/026 , H01S5/0625 , H01S5/0683 , H01S5/12 , H01S5/20 , H01S5/22 , H01S5/34 , H01S5/40 , H01S5/50 , H04B10/12 , H04B10/145 , H04B10/158 , H04B10/17 , H04J14/02
CPC分类号： H04B10/2914 , B82Y20/00 , G02B6/12004 , G02B6/12007 , G02B6/12011 , G02B6/12019 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/1203 , G02B6/12033 , G02B6/4249 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/0425 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/101 , H01S5/1014 , H01S5/12 , H01S5/1228 , H01S5/183 , H01S5/2077 , H01S5/22 , H01S5/2224 , H01S5/227 , H01S5/3404 , H01S5/3408 , H01S5/34306 , H01S5/4025 , H01S5/4031 , H01S5/4087 , H01S5/50 , H01S5/5072 , H04B10/25 , H04B10/50 , H04B10/675 , H04J14/02
摘要： A method is disclosed for optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RXPIC) chip by providing an integrated channel signal demultiplexing with multiple waveguide input verniers provided to an WDM signal demultiplexer. The RxPIC chip may optionally include an integrated amplifier in at least some of the waveguide input verniers. The RxPIC chip may be comprised of, in monolithic form, a plurality of optional semiconductor optical amplifiers (SOAs) at the input of the chip to receive a WDM signal from an optical link which is provided along a plurality of waveguide input verniers to an integrated optical demultiplexer, such as, but not limited to, an arrayed waveguide grating (AWG), as a WDM signal demultiplexer. Thus, optical outputs from the respective semiconductor laser amplifiers are provided as vernier inputs to the optical demultiplexer forming a plurality of input verniers at the input to the optical demultiplexer. One of the vernier inputs to the chip is selected for operation in the RxPIC chip that corresponds to an optimum performance in matching a WDM channel signal wavelength grid of the received WDM signal to a wavelength grid of the on-chip optical demultiplexer.
摘要翻译：公开了一种用于通过提供给提供给WDM信号解复用器的多个波导输入游标的集成信道信号解复用来优化单片接收机光子集成电路（RXPIC）芯片中的光信道信号解复用的方法。 RxPIC芯片可以可选地在至少一些波导输入游标中包括集成放大器。 RxPIC芯片可以以单片形式包括在芯片的输入处的多个可选的半导体光放大器（SOA），以从沿着多个波导输入游标提供的集成的光链路接收WDM信号光解复用器，例如但不限于阵列波导光栅（AWG），作为WDM信号解复用器。因此，来自各个半导体激光放大器的光输出被提供为在光解复用器的输入处形成多个输入游标的光解复用器的游标输入。选择芯片的游标输入之一用于RxPIC芯片中的操作，其对应于将所接收的WDM信号的WDM信道信号波长网格与芯片上的光解复用器的波长网格匹配的最佳性能。

8. 发明申请

US20050100278A1 Method and apparatus for a polarization insensitive arrayed waveguide grating (AWG) 有权
标题翻译：用于偏振不敏感阵列波导光栅（AWG）的方法和装置
公开(公告)号：US20050100278A1
公开(公告)日：2005-05-12
申请号：US11016241
申请日：2004-12-17
申请人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
发明人： Charles Joyner , Mark Missey , Radhakrishnan Nagarajan , Fred Kish
IPC分类号： G02B6/34 , G02B6/42
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： An arrayed waveguide grating (AWG) comprises at least two free space regions, a plurality of grating arms extending between the two space regions, a passivation layer formed over the arrayed waveguide grating and a plurality of inputs at least to one of the free space regions to receive a plurality of channel signals separated by a predetermined channel spacing. A depth of the passivation layer chosen by providing a TE to TM wavelength shift between TE and TM modes propagating through the arrayed waveguide grating being approximately less than or equal to 20% of a magnitude of the channel spacing.
摘要翻译：阵列波导光栅（AWG）包括至少两个自由空间区域，在两个空间区域之间延伸的多个光栅臂，在阵列波导光栅上形成的钝化层，以及至少一个自由空间区域以接收由预定信道间隔分开的多个信道信号。通过在通过阵列波导光栅传播的TE和TM模式之间提供TE到TM波长移位而选择的钝化层的深度大约小于或等于信道间隔幅度的20％。

9. 发明申请

US20050094927A1 Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use 有权
标题翻译：用于测试晶片内光子集成电路（PIC）的探针卡和使用方法
公开(公告)号：US20050094927A1
公开(公告)日：2005-05-05
申请号：US10990042
申请日：2004-11-16
申请人： Fred Kish , Radhakrishnan Nagarajan , Frank Peters , Richard Schneider
发明人： Fred Kish , Radhakrishnan Nagarajan , Frank Peters , Richard Schneider
IPC分类号： G02B6/12 , G02B6/34 , G02F1/017 , H01L31/12 , H01S3/00 , H01S3/13 , H01S5/00 , H01S5/026 , H01S5/0625 , H01S5/0683 , H01S5/12 , H01S5/20 , H01S5/22 , H01S5/34 , H01S5/40 , H01S5/50 , H04B10/00 , H04B10/04 , H04B10/145 , H04B10/17 , H04J14/02
CPC分类号： G02B6/12011 , B82Y20/00 , G01R31/31728 , G01R31/318511 , G02B6/12004 , G02B6/12007 , G02B6/12019 , G02B6/12021 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/12033 , G02B6/131 , G02B6/136 , G02B6/4204 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , G02F2203/69 , H01L31/125 , H01S5/0014 , H01S5/0085 , H01S5/02248 , H01S5/026 , H01S5/0262 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/06832 , H01S5/12 , H01S5/1228 , H01S5/2077 , H01S5/22 , H01S5/3408 , H01S5/4031 , H01S5/4087 , H01S5/50 , H04B10/2914 , H04B10/50 , H04J14/02 , H04J14/0246 , H04J14/025 , H04J14/0258 , H04J14/0265 , H04J14/0276 , H04J14/0282
摘要： Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface electrical contacts. The probe card has a probe card body with at least one row of downwardly dependent, electrically conductive contact probes. The probe body is transversely translated over the surface of the wafer to a selected in-wafer photonic integrated circuit (PIC) die. Then, the contact probes of the probe card are brought into engagement with surface electrical contacts of the selected photonic integrated circuit (PIC) die for testing the operation of electro-optic components in the selected in-wafer photonic integrated circuit (PIC) die.
摘要翻译：用于利用探针卡测试晶片间光子集成电路（PIC）的方法和装置，其包括形成在半导体晶片的表面中的多个晶片内的光子集成电路（PIC）管芯，其中每个PIC包括一个或多个电 - 具有形成的晶片表面电触点的光学元件。探针卡具有带有至少一排向下依赖的导电接触探针的探针卡体。探针体在晶片的表面上横向平移到选定的晶片内的光子集成电路（PIC）管芯。然后，将探针卡的接触探针与所选择的光子集成电路（PIC）管芯的表面电触点接合，以测试所选择的晶片内光子集成电路（PIC）管芯中的电光部件的操作。

10. 发明授权

US5933265A Optical receiver module for an optical communication transmission system 失效
标题翻译：光通信传输系统的光接收模块
公开(公告)号：US5933265A
公开(公告)日：1999-08-03
申请号：US64688
申请日：1998-04-22
申请人： Radhakrishnan Nagarajan
发明人： Radhakrishnan Nagarajan
IPC分类号： H01S5/068 , H01S5/343 , H04B10/155 , H04B10/158 , H04B10/06
CPC分类号： H01S5/3434 , B82Y20/00 , H01S5/34313 , H04B10/504 , H04B10/6911 , H04B10/6932 , H01S5/068 , H01S5/34306
摘要： An optical transmission link has both a transmitter module and a receiver module operable under uncooled conditions, i.e., without the need of costly cooling equipment, such as thermoelectric coolers. The optical transmission system includes both a semiconductor laser diode source and an optical receiver module that are both designed to operate uncooled under high frequencies (e.g., GHz range) over a wide temperature range without significant changes in signal bandwidth and at temperatures in excess of 125.degree. C. Compensation is provided to reduce the effect of photodiode noise and amplifier noise. In addition, temperature compensation can be provided that provides for overall reduction in receiver noise across the bandwidth of the receiver module through maintenance of a temperature environment optimizing receiver performance.
摘要翻译：光传输链路具有在不冷却条件下可操作的发射器模块和接收器模块，即不需要昂贵的冷却设备，例如热电冷却器。光传输系统包括半导体激光二极管源和光接收器模块，其均被设计为在宽的温度范围内在高频（例如，GHz范围）下未经制冷而不经过信号带宽的显着变化并且在超过125℃的温度下运行 DEG C.提供补偿以减少光电二极管噪声和放大器噪声的影响。此外，可以提供温度补偿，其通过维持优化接收机性能的温度环境来提供整个接收器模块的带宽上的接收机噪声的整体降低。

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