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11. 发明申请

US20080171440A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate 审中-公开
标题翻译：用于互连基板的预抛光处理溶液，抛光方法以及用于制造互连基板的方法和装置
公开(公告)号：US20080171440A1
公开(公告)日：2008-07-17
申请号：US12007786
申请日：2008-01-15
申请人： Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
发明人： Akira Kodera , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Itsuki Kobata
IPC分类号： H01L21/304 , C23F11/14 , B23H3/00
CPC分类号： H01L21/3212 , C09G1/04
摘要： A pre-polishing treatment solution has a prominent corrosion inhibiting effect, and can be used in pre-polishing treatments for interconnect substrates. The pre-polishing treatment solution comprises a corrosion inhibitor dissolved in an organic solvent.
摘要翻译：预抛光处理溶液具有显着的腐蚀抑制作用，可用于互连基板的预抛光处理。预抛光处理溶液包含溶解在有机溶剂中的腐蚀抑制剂。

12. 发明申请

US20090078583A1 Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus 审中-公开
标题翻译：电化学机械抛光方法和电化学机械抛光装置
公开(公告)号：US20090078583A1
公开(公告)日：2009-03-26
申请号：US12007956
申请日：2008-01-17
申请人： Itsuki Kobata , Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Yuji Makita , Hirokuni Hiyama
发明人： Itsuki Kobata , Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Yuji Makita , Hirokuni Hiyama
IPC分类号： B23H5/06 , B23H11/00 , C25F3/16 , C25F7/00
CPC分类号： C25F3/00 , B23H5/08 , B24B37/013 , B24B49/105 , H01L21/32125
摘要： A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.
摘要翻译：复合电解处理方法使得可以在导电膜上去除导电膜而不会使其在下面的阻挡膜上处于电绝缘状态，从而暴露阻挡膜。电化学机械抛光方法包括：在连接到电源的一个极的第一电极和连接到电源的另一个极的第二电极之间施加电压，用于向抛光对象的导电膜供电; 将电解液体填充到研磨对象物的第一电极和导电膜之间的空间内; 并且将导电膜按压并摩擦抛光垫的抛光表面以使导电膜抛光，使得导电膜下面的阻挡膜从研磨对象的中心逐渐露出。

13. 发明申请

US20080067077A1 Electrolytic liquid for electrolytic polishing and electrolytic polishing method 审中-公开
标题翻译：电解液用于电解抛光和电解抛光法
公开(公告)号：US20080067077A1
公开(公告)日：2008-03-20
申请号：US11896251
申请日：2007-08-30
申请人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
发明人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
IPC分类号： C25F3/16 , B23H3/00
CPC分类号： B23H5/08 , B23H5/12 , C25F3/16 , C25F3/22
摘要： An electrolytic liquid is used for electrolytic polishing which can provide a processed surface having high flattening characteristics with a low voltage applied while ensuring a higher processing rate for an conductive material, and can remove an unnecessary conductive material and expose a barrier film without causing dishing, erosion, or etching at the interface between the barrier film and a metal (conductive material). The electrolytic liquid for use in electrolytic polishing of a surface conductive material of a workpiece comprises an aqueous solution containing at least one organic acid or its salt, at least one strong acid having a sulfonic acid group, a corrosion inhibitor and a water-soluble polymeric compound.
摘要翻译：一种电解液用于电解抛光，其可以在确保更高的导电材料的加工速率的同时，提供具有高平坦化特性的加工表面，同时确保更高的导电材料的加工速率，并且可以去除不必要的导电材料并暴露阻挡膜而不引起凹陷，侵蚀或蚀刻在阻挡膜和金属（导电材料）之间的界面处。用于工件表面导电材料的电解抛光的电解液包括含有至少一种有机酸或其盐的水溶液，至少一种具有磺酸基的强酸，缓蚀剂和水溶性聚合物复合。

14. 发明申请

US20070187259A1 Substrate processing apparatus and method 审中-公开
标题翻译：基板加工装置及方法
公开(公告)号：US20070187259A1
公开(公告)日：2007-08-16
申请号：US11715971
申请日：2007-03-09
申请人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
发明人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
IPC分类号： B23H5/00
CPC分类号： H01L21/6708 , C25F3/00 , C25F7/00
摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.
摘要翻译：基板处理装置可以执行与普通的常规蚀刻不同的电解处理，以去除（清除）形成在或附着于基板的斜面部分等上的导电材料（膜）或处理通过电化学作用的衬底的周边部分。基板处理装置包括：具有多个电极的电极部，该多个电极层叠有绝缘体，并且具有与基板的周边部相对的保持部; 设置在电极部的保持部中的离子交换部; 液体供应部分，用于将液体供应到电极部分的保持位置; 以及用于向电极部分的电极施加电压使得电极交替具有不同极性的电源。

15. 发明申请

US20050155868A1 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050155868A1
公开(公告)日：2005-07-21
申请号：US11035373
申请日：2005-01-14
申请人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
发明人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
IPC分类号： B23H5/08 , B24B37/04 , C25F1/00 , C25F3/00 , H01L21/321 , H01L21/768 , B23H3/00
CPC分类号： H01L21/32115 , B23H5/08 , B24B37/042 , B24B37/046 , C25F1/00 , C25F3/00 , H01L21/7684
摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.
摘要翻译：电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

16. 发明申请

US20080188162A1 Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution 审中-公开
标题翻译：电化学机械抛光装置调理方法，调理溶液
公开(公告)号：US20080188162A1
公开(公告)日：2008-08-07
申请号：US12068300
申请日：2008-02-05
申请人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
发明人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B23H5/08 , B24B37/042 , B24B37/046 , B24B49/10 , H01L21/32125 , H01L21/7684
摘要： An electrochemical mechanical polishing apparatus is for use in polishing of a conductive material (e.g., metal) on a surface of a substrate by combination of electrochemical action and mechanical action. This apparatus includes a polishing table having divided electrodes and adapted to hold a polishing pad having a polishing surface, a polishing head adapted to hold a workpiece having a conductive film and to press the workpiece against the polishing surface, a second electrode for supplying an electric current to the conductive film, an electrolytic-solution supply section for supplying an electrolytic solution to the polishing surface, a detecting section adapted to detect a signal corresponding to a thickness of the conductive film, a variable resistance unit having the same number of variable resistors as the number of divided electrodes, a moving mechanism for providing relative movement between the workpiece and the polishing surface, and a control section adapted to control each of the variable resistors based on the signal from the detecting section.
摘要翻译：电化学机械抛光装置用于通过电化学作用和机械作用的组合在基底表面上抛光导电材料（例如金属）。该装置包括具有分割电极并且适于保持具有抛光表面的抛光垫的抛光台，用于保持具有导电膜的工件并将工件压靠抛光表面的抛光头，用于提供电电流至导电膜的电解液供应部分，用于向研磨表面供应电解液的电解溶液供应部分，用于检测对应于导电膜厚度的信号的检测部分，具有相同数目的可变电阻器的可变电阻单元作为分割电极的数量，用于在工件和抛光表面之间提供相对移动的移动机构，以及适于基于来自检测部分的信号来控制每个可变电阻器的控制部分。

17. 发明授权

US07101465B2 Electrolytic processing device and substrate processing apparatus 有权
标题翻译：电解处理装置及基板处理装置
公开(公告)号：US07101465B2
公开(公告)日：2006-09-05
申请号：US10337357
申请日：2003-01-07
申请人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
发明人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
IPC分类号： C25D17/00
CPC分类号： B23H5/08
摘要： There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.
摘要翻译：提供了一种电解处理装置，包括：与工件接触或接近工件的处理电极; 用于向工件供电的供电电极; 离子交换器，其设置在所述工件和所述处理电极之间的至少一个空间中，以及所述工件与所述馈电电极之间; 用于在处理电极和馈电电极之间施加电压的电源; 以及液体供给部，用于将液体供给到工件与存在有离子交换器的处理电极和供电电极中的至少一个之间的空间。还提供了具有该电解处理装置的基板处理装置。

18. 发明授权

US06743349B2 Electrochemical machining method and apparatus 有权
公开(公告)号：US06743349B2
公开(公告)日：2004-06-01
申请号：US09897913
申请日：2001-07-05
申请人： Yuzo Mori , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata , Takayuki Saito
发明人： Yuzo Mori , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata , Takayuki Saito
IPC分类号： C25F316
CPC分类号： B23H3/00 , B23H3/08
摘要： An electrochemical machining apparatus comprises a machining chamber for holding ultrapure water, a cathode/anode immersed in the ultrapure water held in the machining chamber, and a workpiece holding portion for holding a workpiece at a predetermined distance from the cathode/anode so that a surface, to be machined, of the workpiece is brought into contact with the ultrapure water. The electrochemical machining apparatus further comprises an anode/cathode contact brought into contact with the workpiece held by the workpiece holding portion so that the workpiece serves as an anode/cathode, a catalyst having a strongly basic anion exchange function or a strongly acidic cation exchange function, a power source for applying a voltage between the cathode/anode and the workpiece, and a moving mechanism for relatively moving the workpiece and the catalyst. The catalyst is disposed between the cathode/anode and the workpiece held by the workpiece holding portion.

19. 发明授权

US06602396B2 Electrolytic machining method and apparatus 有权
公开(公告)号：US06602396B2
公开(公告)日：2003-08-05
申请号：US09996674
申请日：2001-11-30
申请人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
发明人： Yuzo Mori , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Akira Fukunaga , Itsuki Kobata
IPC分类号： B23H300
CPC分类号： C25F3/00 , B23H3/08
摘要： An anode as a workpiece, and a cathode opposed to the anode with a predetermined spacing are placed in ultrapure water. A catalytic material promoting dissociation of the ultrapure water and having water permeability is disposed between the workpiece and the cathode. A flow of the ultrapure water is formed inside the catalytic material, with a voltage being applied between the workpiece and the cathode, to decompose water molecules in the ultrapure water into hydrogen ions and hydroxide ions, and supply the resulting hydroxide ions to a surface of the workpiece, thereby performing removal processing of or oxide film formation on the workpiece through a chemical dissolution reaction or an oxidation reaction mediated by the hydroxide ions. Thus, clean processing can be performed by use of hydroxide ions in ultrapure water, with no impurities left behind on the processed surface of the workpiece.

20. 发明申请

US20080217164A1 Electrolytic Processing Apparatus 审中-公开
标题翻译：电解处理装置
公开(公告)号：US20080217164A1
公开(公告)日：2008-09-11
申请号：US10585739
申请日：2005-03-24
申请人： Yasushi Toma , Takayuki Saito , Kazuto Hirokawa
发明人： Yasushi Toma , Takayuki Saito , Kazuto Hirokawa
IPC分类号： C25D17/00
CPC分类号： C25F7/00 , B23H5/08 , H01L21/32125
摘要： An electrolytic processing apparatus (50) has feed electrodes (74) to feed a current to a substrate (W), an ion exchanger (76) brought into contact with the substrate (W), and process electrodes (72) to perform an electrolytic process on the substrate (W). The electrolytic processing apparatus (50) has an electrolytic processing liquid source to supply an electrolytic processing liquid between the substrate (W) and the ion exchanger (76), and a regeneration liquid supply source to supply a regeneration liquid to a regeneration liquid chambers (90a, 90b). The electrolytic processing apparatus (50) includes regeneration electrodes (84) spaced from the process electrodes (72). The feed electrode (74) has a potential higher than the process electrode (72) and the same polarity as the process electrode (72). The process electrode (72) has a potential higher than the regeneration electrode (84).
摘要翻译：电解处理装置（50）具有将电流供给到基板（W）的馈电电极（74），与基板（W）接触的离子交换器（76），以及处理电极（72），以进行电解在基板上的工艺（W）。电解处理装置（50）具有电解处理液源，在基板（W）和离子交换器（76）之间供给电解处理液，再生液供给源向再生液室供给再生液 90 a，90 b）。电解处理装置（50）包括与处理电极（72）间隔开的再生电极（84）。馈电电极（74）的电位高于处理电极（72）并具有与处理电极（72）相同的极性。处理电极（72）的电位高于再生电极（84）。

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